Anisotropy reduction in coating of conductive films
Provided herein is a device for forming a conductive film. The device includes a deposition device and an air supply. The deposition device is configured to form a wet film having conductive nanostructures and a fluid carrier on a web. The web is moved in a first direction while forming the wet film. The air supply is disposed at a side of the web and configured to apply an air flow onto the wet film. The air flow is directed onto the wet film in a second direction perpendicular to the first direction to reorient a direction of some conductive nanostructures in the wet film to define reoriented conductive nanostructures.
1. A device for forming a conductive film, comprising:
a deposition device configured to form a wet film having a plurality of conductive nanostructures and a fluid carrier on a top surface of a web, wherein:
the web is moved in a machine direction parallel to a first dimension of the wet film extending on the top surface of the web while forming the wet film; and
an air supply configured to apply an air flow onto the wet film, the air supply comprising an air supply source and an air supply port disposed near the web, wherein the air flow is directed onto the wet film in a second direction traverse to the machine direction and parallel to the top surface of the web to reorient a direction of at least some of the plurality of conductive nanostructures in the wet film to define a plurality of reoriented conductive nanostructures.
2. The device of claim 1 , comprising:
a drier configured to dry the wet film having the plurality of reoriented conductive nanostructures to form the conductive film.
3. The device of claim 1 , wherein the deposition device is a slot die deposition device.
4. The device of claim 1 , wherein the air supply port is an air knife disposed at a lateral side of the wet film.
5. The device of claim 4 , wherein:
the air supply port defines an outlet through which the air flow is directed onto the wet film, and
the outlet is disposed between about 0.5 mm and about 10 mm from the lateral side of the wet film.
6. The device of claim 4 , wherein the air flow is applied at an air velocity from about 1 m/s to 10 m/s.
7. The device of claim 1 , wherein:
the air supply port is a duct device disposed above the wet film and suspended over the web, and
a length of the duct device extends in the second direction.
8. The device of claim 7 , wherein:
the duct device has an upper sloped face that is closed and a lower face facing the wet film and open to the wet film, and
the duct device has a volume that is gradually reduced along the length of the duct device.
9. The device of claim 1 , wherein:
the air supply port is a duct device disposed below the wet film and below the web, and
a length of the duct device extends in the second direction.
10. The device of claim 1 , wherein the air supply port comprises a duct overlying over the web and the air flow is directed onto the wet film through the duct from the air supply source disposed at a lateral side of the wet film.
11. The device of claim 10 , wherein the duct comprises a closed face facing away from the web and an open face facing toward the web.
12. The device of claim 11 , wherein a cross-sectional area of the duct decreases in the second direction from an end of the duct facing the air supply to an end of the duct facing away from the air supply.
13. The device of claim 10 , wherein the duct is disposed about 0.1 mm to 10 mm from a top surface of the wet film.
14. The device of claim 1 , wherein the air supply port comprises a duct overlying over the web and the air flow is directed onto the wet film through the duct.
15. The device of claim 14 , wherein the duct is about 2.5 cm in width and 1 cm tall.
16. The device of claim 1 , wherein the second direction is perpendicular to the machine direction.
17. A device for forming a conductive film, comprising:
a deposition device configured to form a wet film having a plurality of conductive nanostructures and a fluid carrier on a top surface of a web, wherein:
the web is moved in a machine direction parallel to a first dimension of the wet film extending on the top surface of the web while forming the wet film; and
an air supply configured to apply an air flow onto the wet film, wherein:
the air flow is directed onto the wet film in a second direction traverse to the machine direction and parallel to the top surface of the web,
the air supply comprises a duct overlying over the web and an air supply source disposed at a lateral side of the wet film, and
the air flow is directed onto the wet film through the duct from the air supply source.
18. The device of claim 17 , wherein a cross-sectional area of the duct decreases in the second direction from an end of the duct facing the air supply to an end of the duct facing away from the air supply.
19. The device of claim 17 , wherein the duct is disposed about 0.1 mm to 10 mm from a top surface of the wet film.
20. A device for forming a conductive film, comprising:
a deposition device configured to form a wet film having a plurality of conductive nanostructures and a fluid carrier on a top surface of a web, wherein:
the web is moved in a machine direction parallel to a first dimension of the wet film extending on the top surface of the web while forming the wet film; and
an air supply configured to apply an air flow onto the wet film, wherein:
the air flow is directed onto the wet film in a second direction traverse to the machine direction and parallel to the top surface of the web,
the air supply comprises a duct overlying over the web and an air supply source coupled to the duct for supplying air, and
the air flow is directed onto the wet film through the duct from the air supply source.