Method for forming memory device involving ion implantation of the control gate spacer and wet etching process to expose sidewall of control gate

1. A method for forming a memory device, comprising:

forming a floating gate on a substrate;

forming a control gate on the floating gate;

forming a mask layer on the control gate;

forming a spacer on a sidewall of the mask layer, wherein a sidewall of the control gate and a sidewall of the floating gate is covered by the spacer;

performing an ion implantation process to implant a dopant into a top portion of the spacer; and

performing a wet etching process to expose the sidewall of the control gate.

2. The method as claimed in claim 1 , further comprising:

forming a metal layer on the control gate; and

performing an annealing process to carry out a metal silicide reaction, wherein a top portion of the control gate and the metal layer are transformed into a metal silicide layer by the metal silicide reaction.

3. The method as claimed in claim 2 , wherein a bottom surface of the metal silicide layer is lower than a top surface of the spacer.

4. The method as claimed in claim 1 , wherein the ion implantation process further comprises implanting the dopant into the mask layer and the control gate.

5. The method as claimed in claim 1 , further comprising:

forming a liner layer on a sidewall of the spacer; and

forming a filling dielectric layer on a sidewall of a liner layer, wherein the ion implantation process further comprises implanting the dopant into the liner layer and the filling dielectric layer.

6. The method as claimed in claim 1 , wherein the wet etching process is performed to remove the mask layer and top portion of the spacer.

7. The method as claimed in claim 1 , wherein the spacer and the mask layer are made of oxide, and the wet etching process is performed by using hydrofluoric acid as an etchant.

8. A method for forming a memory device, comprising:

forming a floating gate on a substrate;

forming a control gate on the floating gate;

forming a spacer on a sidewall of the control gate;

performing an ion implantation process to implant a dopant into a top portion of the spacer, wherein after performing the ion implantation process, the top portion of the spacer has a conductivity type that is the same as that of the control gate; and

performing a wet etching process to remove the top portion of the spacer.

9. The method as claimed in claim 8 , further comprising:

forming a liner layer on a sidewall of the spacer; and

forming a filling dielectric layer on a sidewall of the liner layer, wherein the ion implantation process further comprises implanting the dopant into a top portion of the liner layer and a top portion of the filling dielectric layer, and the wet etching process further comprises removing the top portion of the filling dielectric layer.

10. The method as claimed in claim 9 , further comprising:

after performing the wet etching process, performing a dry etching process to remove the top portion of the liner layer.

11. The method as claimed in claim 8 , wherein the dopant is p-type.

12. The method as claimed in claim 8 , wherein the ion implantation process further comprises implanting the dopant into a top portion of the control gate.

13. The method as claimed in claim 8 , wherein the ion implantation process has an implant energy from 30 keV to 50 keV.

14. The method as claimed in claim 8 , wherein the dopant of the ion implantation process has a doping dose of 2.5E15 ions/cm 2 to 5E15 ions/cm 2 .

15. A method for forming a memory device, comprising:

providing a substrate comprising a peripheral circuit region and an array region;

forming a first control gate and a second control gate on the peripheral circuit region of the substrate, wherein a first trench is between the first control gate and the second control gate;

forming a spacer on a sidewall of the first trench, wherein a top surface of the spacer is higher than a top surface of the first control gate and a top surface of the second control gate;

performing an ion implantation process to implant a dopant into the spacer, the first control gate and the second control gate; and

after performing the ion implantation process, performing a wet etching process to expose the sidewall of the first trench.

16. The method as claimed in claim 15 , further comprising:

forming a third control gate and a fourth control gate on the array region of the substrate, wherein a second trench is between the third control gate and the fourth control gate, and a width of the second trench is less than a width of the first trench; and

forming a dielectric layer in the second trench, wherein the dopant is implanted into the dielectric layer, the third control gate and the fourth control gate in the ion implantation process.

17. The method as claimed in claim 16 , wherein the dielectric layer in the array region and the spacer in the peripheral circuit region are made of the same material and are formed by the same process, and a sidewall of the second trench is exposed after performing the wet etching process.

18. The method as claimed in claim 16 , further comprising:

after performing the wet etching process, transforming protruding portions of the first control gate, the second control gate, the third control gate and the fourth control gate into a metal silicide layer,

wherein the top surface of the spacer in the first trench and a top surface of the dielectric layer in the second trench are higher than a bottom surface of the metal silicide layer.

19. The method as claimed in claim 15 , further comprising:

forming a mask layer on the first control gate and the second control gate;

conformally forming a spacer material layer on the mask layer and in the first trench; and

removing a portion of the spacer material layer to expose the substrate by etching, and forming the spacer on the sidewall of the first trench.

20. The method as claimed in claim 15 , further comprising:

forming a liner layer in the first trench and on a sidewall of the spacer, wherein a bottom surface of the first trench is covered by the liner layer; and

forming a filling dielectric layer on the liner layer, wherein the ion implantation process further comprises implanting the dopant into the liner layer and the filling dielectric layer.