IP Library Granted Patent US 11,595,019
Granted Patent B2
US 11,595,019 · App. 16/375,512 · Granted Feb 28, 2023

Acoustic wave resonator, filter, and multiplexer

Inventors: Naoki Kakita (Tokyo, JP); Osamu Kawachi (Tokyo, JP); Rei Oikawa (Tokyo, JP)
Assignee: TAIYO YUDEN CO., LTD.
H03H9/02574H01L41/047H01L41/083H01L41/312H03H3/08H03H9/02559H03H9/02834
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Quick Facts
Patent No.
US 11,595,019
App. No.
16/375,512
Granted
Feb 28, 2023
Kind
B2
Abstract

An acoustic wave resonator includes: a support substrate; a piezoelectric substrate located on the support substrate; a first amorphous layer that is in contact with the support substrate and is mainly composed of one or more constituent elements of the support substrate; a second amorphous layer that is in contact with the piezoelectric substrate and the first amorphous layer, is mainly composed of one or more constituent elements of the piezoelectric substrate, and is thinner than the first amorphous layer; and a pair of comb-shaped electrodes that is located on an opposite surface of the piezoelectric substrate from the support substrate, each of the pair of comb-shaped electrodes including electrode fingers.

Claims (47)

1. An acoustic wave resonator comprising:

a support substrate;

a piezoelectric substrate located on the support substrate;

a first amorphous layer that is in contact with the support substrate and is mainly composed of one or more constituent elements of the support substrate;

a second amorphous layer that is in contact with the piezoelectric substrate and the first amorphous layer, is mainly composed of one or more constituent elements of the piezoelectric substrate, and is thinner than the first amorphous layer; and

a pair of comb-shaped electrodes that is located on an opposite surface of the piezoelectric substrate from the support substrate, each of the pair of comb-shaped electrodes including electrode fingers,

wherein

a thickness of the piezoelectric substrate is less than an average pitch of the electrode fingers of one of the pair of comb-shaped electrodes, and

a thickness of the second amorphous layer is equal to or less than 0.8 times a thickness of the first amorphous layer.

2. The acoustic wave resonator according to claim 1 , wherein

the piezoelectric substrate is a monocrystalline substrate, and

the support substrate is a monocrystalline substrate, a polycrystalline substrate, or a sintered body substrate.

3. The acoustic wave resonator according to claim 2 , wherein

the piezoelectric substrate is a lithium tantalite substrate or a lithium niobate substrate, and

the support substrate is a sapphire substrate, a spinel substrate, a silicon substrate, a crystal substrate, a quartz substrate, or an alumina substrate.

4. The acoustic wave resonator according to claim 3 , wherein

a total atomic concentration of an element other than oxygen among the one or more constituent elements of the support substrate in the first amorphous layer is higher than a total atomic concentration of an element other than oxygen among the one or more constituent elements of the piezoelectric substrate, and

a total atomic concentration of an element other than oxygen among the one or more constituent elements of the piezoelectric substrate in the second amorphous layer is higher than a total atomic concentration of an element other than oxygen among the one or more constituent elements of the support substrate.

5. The acoustic wave resonator according to claim 1 , wherein

the pair of comb-shaped electrodes excites an SH wave.

6. The acoustic wave resonator according to claim 1 , wherein

the second amorphous layer is equal to or less than 1 nm.

7. The acoustic wave resonator according to claim 6 , wherein

the second amorphous layer is equal to or greater than 0.1 nm.

8. The acoustic wave resonator according to claim 7 , wherein

the first amorphous layer is equal to or less than 5 nm and is equal or greater than 0.5 nm.

9. A filter comprising:

an acoustic wave resonator including:

a support substrate,

a piezoelectric substrate located on the support substrate,

a first amorphous layer that is in contact with the support substrate and is mainly composed of one or more constituent elements of the support substrate,

a second amorphous layer that is in contact with the piezoelectric substrate and the first amorphous layer, is mainly composed of one or more constituent elements of the piezoelectric substrate, and is thinner than the first amorphous layer, and

a pair of comb-shaped electrodes that is located on an opposite surface of the piezoelectric substrate from the support substrate, each of the pair of comb-shaped electrodes including electrode fingers,

wherein

a thickness of the piezoelectric substrate is less than an average pitch of the electrode fingers of one of the pair of comb-shaped electrodes, and

a thickness of the second amorphous layer is equal to or less than 0.8 times a thickness of the first amorphous layer.

10. A multiplexer comprising:

a filter including an acoustic wave resonator, wherein

the acoustic wave resonator includes:

a support substrate,

a piezoelectric substrate located on the support substrate,

a first amorphous layer that is in contact with the support substrate and is mainly composed of one or more constituent elements of the support substrate,

a second amorphous layer that is in contact with the piezoelectric substrate and the first amorphous layer, is mainly composed of one or more constituent elements of the piezoelectric substrate, and is thinner than the first amorphous layer, and

a pair of comb-shaped electrodes that is located on an opposite surface of the piezoelectric substrate from the support substrate, each of the pair of comb-shaped electrodes including electrode fingers,

wherein

a thickness of the piezoelectric substrate is less than an average pitch of the electrode fingers of one of the pair of comb-shaped electrodes, and

a thickness of the second amorphous layer is equal to or less than 0.8 times a thickness of the first amorphous layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 4, 2019
From: KAKITA, NAOKI; KAWACHI, OSAMU; OIKAWA, REI
To: TAIYO YUDEN CO., LTD.
Reel/Frame 048797/0707 →
Priority Claims (2)
JP JP2018-081065 · Apr 20, 2018 · national
JP JP2018-095422 · May 17, 2018 · national
Continuity (1)
Related Publication 20190326878A1 · Oct 24, 2019
Cited By (1)
US 12,244,300