IP Library › Granted Patent US 10,811,190
Granted Patent B2
US 10,811,190 · App. 16/380,128 · Granted Oct 20, 2020

Multilayer ceramic capacitor, printed circuit board and package

Inventor: Hirokazu Orimo (Tokyo, JP)
Assignee: TAIYO YUDEN CO., LTD.
H01G4/2325H01G4/012H01G4/248H01G4/30H05K1/111H05K1/181H05K13/0419H05K2201/10015
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Quick Facts
Patent No.
US 10,811,190
App. No.
16/380,128
Granted
Oct 20, 2020
Kind
B2
Abstract

A multilayer ceramic capacitor includes an element body in which a dielectric layer and an internal electrode layer are laminated; a first external electrode that is provided at one end of the element body and is connected to a part of the internal electrode layer; and a second external electrode that is provided at an other end of the element body and is connected to that part of the internal electrode layer which is not connected to the first external electrode, in which the first external electrode and the second external electrode each have a linear groove.

Claims (12)

1. A multilayer ceramic capacitor, comprising: an element body in which a dielectric layer and an internal electrode layer are laminated; a first external electrode that is provided at one end of the element body, wherein the first external electrode is connected to a first part of the internal electrode layer; and a second external electrode that is provided at another end of the element body, wherein the second external electrode is connected to a second part of the internal electrode layer, the first part of the internal electrode layer is different from the second part of the internal electrode layer, each of the first external electrode and the second external electrode comprises four external electrode layers, each of the first external electrode and the second external electrode has a first area and a second area, an outermost external electrode layer, of the four external electrode layers, of each of the first external electrode and the second external electrode has the first area, an innermost external electrode layer, of the four external electrode layers, of each of the first external electrode and the second external electrode has the second area, each of the first external electrode and the second external electrode has a linear groove only in the corresponding first area, of the outermost external electrode layer, opposite to the corresponding second area, of the innermost external electrode layer, in contact with the element body, and the first area of the outermost external electrode layer of each of the first external electrode and the second external electrode is a region where the first external electrode, the second external electrode, and the element body are overlapped from a perspective view of the multilayer ceramic capacitor; wherein a depth of the linear groove is in a range of 1 um to 10 um.

2. The multilayer ceramic capacitor according to claim 1 , wherein the four external electrode layers of each of the first external electrode and the second external electrode are laminated metallic layers.

3. The multilayer ceramic capacitor according to claim 1 , wherein the outermost external electrode layer of each of the first external electrode and the second external electrode is a metallic layer containing tin as a main constituent.

4. The multilayer ceramic capacitor according to claim 1 , wherein each of the first external electrode and the second external electrode includes one of a nickel plating film or a copper plating film.

5. A printed circuit board, comprising: a land pattern to which a first external electrode and a second external electrode of a multilayer ceramic capacitor are joined by a solder, wherein the multilayer ceramic capacitor includes: an element body in which a dielectric layer and an internal electrode layer are laminated, the first external electrode that is provided at one end of the element body, wherein the first external electrode is connected to a first part of the internal electrode layer, and the second external electrode that is provided at another end of the element body, wherein the second external electrode is connected to a second part of the internal electrode layer, the first part of the internal electrode layer is different from the second part of the internal electrode layer, each of the first external electrode and the second external electrode comprises four external electrode layers, each of the first external electrode and the second external electrode has a first area and a second area, an outermost external electrode layer, of the four external electrode layers, of each of the first external electrode and the second external electrode has the first area, an innermost external electrode layer, of the four external electrode layers, of each of the first external electrode and the second external electrode has the second area, each of the first external electrode and the second external electrode has a linear groove only in the corresponding first area, of the outermost external electrode layer, opposite to the corresponding second area, of the innermost external electrode layer, in contact with the element body, the first area of the outermost external electrode layer of each of the first external electrode and the second external electrode is a region where the first external electrode, the second external electrode, and the element body are overlapped from a perspective view of the multilayer ceramic capacitor, and the linear groove of each of the first external electrode and the second external electrode is filled with the solder; wherein a depth of the linear groove is in a range of 1 um to 10 um.

6. The printed circuit board according to claim 5 , wherein the linear groove is provided below a center in a height direction of each of the first external electrode and the second external electrode, with a mounting surface to which the multilayer ceramic capacitor is mounted as a reference.

7. A multilayer ceramic capacitor, comprising: an element body in which a dielectric layer and an internal electrode layer are laminated; a first external electrode that is provided at one end of the element body, wherein the first external electrode is connected to a first part of the internal electrode layer, the first external electrode comprises a nickel paste layer, a copper plating layer, and a nickel plating layer, and the copper plating layer is between the nickel paste layer and the nickel plating layer; and a second external electrode that is provided at another end of the element body, wherein the second external electrode is connected to a second part of the internal electrode layer, the first part of the internal electrode layer is different from the second part of the internal electrode layer, each of the first external electrode and the second external electrode comprises four external electrode layers, and an outermost external electrode layer, of the four external electrode layers, of each of the first external electrode and the second external electrode has a linear groove; wherein a depth of the linear groove is in a range of 1 um to 10 um.

8. The multilayer ceramic capacitor according to claim 7 , wherein

the outermost external electrode layer of each of the first external electrode and the second external electrode has a first area,

an innermost external electrode layer, of the four external electrode layers, of each of the first external electrode and the second external electrode has a second area, and

the linear groove is only in the first area opposite to the second area in contact with the element body.

9. The multilayer ceramic capacitor according to claim 8 , wherein the first area of the outermost external electrode layer of each of the first external electrode and the second external electrode is a region where the first external electrode, the second external electrode, and the element body are overlapped from a perspective view of the multilayer ceramic capacitor.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 23, 2019
From: ORIMO, HIROKAZU
To: TAIYO YUDEN CO., LTD.
Reel/Frame 049268/0639 →
Priority Claims (1)
JP 2018-076505 · Apr 12, 2018 · national
Continuity (1)
Related Publication 20190318874A1 · Oct 17, 2019