Apparatus for true power shedding via switchable electrical connections
Described herein are mechanisms and methods for blocking the propagation of signals to Integrated Circuit (IC) components that have been power gated, rather than simply suffering from leakage through signals that might not be parked in a low state. In some embodiments, switches that block the flow of current in such signals may enable turning off power to any IC component and not just to circuits on an IC component that make sole use of protocols that are friendly to power gating. This may advantageously increase power savings, by permitting more portions of a system in an idle state to be power gated, or by reducing or eliminating leakage in signals on boundaries of blocks being power gated, or both.
1. An apparatus comprising:
an interposer interconnect element;
an Integrated Circuit (IC) component fastened to and electrically connected to the interposer interconnect element;
a first switchable electrical connection to carry, from the interposer interconnect element to the IC component, a supply voltage;
a second switchable electrical connection to carry, from the interposer interconnect element to the IC component, a signal interface, wherein the signal interface comprises at least one of: one or more data signals, and one or more control signals, and wherein the first switchable electrical connection and the second switchable electrical connection are operable to open in a sequence; and
a third switchable electrical connection to carry, from the interposer interconnect element to the IC component a ground voltage, wherein the third switchable electrical connection is closed prior to the second switchable electrical connection is closed, and wherein the second switchable electrical connection is closed prior to the first electrical connection is closed.
2. The apparatus of claim 1 , wherein the first switchable electrical connection and the second switchable electrical connection are operable to both be open at a same time.
3. The apparatus of claim 1 , comprising:
a pull-up resistor on the interposer interconnect element coupled between the supply voltage and the signal interface.
4. The apparatus of claim 1 ,
wherein a switch for the second switchable electrical connection is located on an interconnect substrate.
5. The apparatus of claim 1 ,
wherein the interposer interconnect element is dynamically programmable.
6. The apparatus of claim 1 ,
wherein a switch for the second switchable electrical connection is configurable to create an open circuit for an interface that carries a ground voltage, or the signal interface.
7. The apparatus of claim 1 ,
wherein the IC component is a first IC component; and
wherein the second switchable electrical connection is to supply, from the interposer interconnect element to both the first IC component and a second IC component, one of: a ground voltage, or the signal interface.
8. The apparatus of claim 7 ,
wherein a switch, for the second switchable electrical connection is configurable to create both an open circuit between the interposer interconnect element and the first IC component, and an open circuit between the interposer interconnect element and the second IC component.
9. The apparatus of claim 1 ,
wherein the supply voltage is a first supply voltage; and
wherein an additional switchable electrical connection is to carry, from the interposer interconnect element to the IC component, a second supply voltage.
10. The apparatus of claim 1 , wherein the first switchable electrical connection is closed after the second switchable electrical connection is closed.
11. An apparatus comprising:
a dynamically-programmable interposer interconnect element;
an Integrated Circuit (IC) component mounted on and electrically connected to the dynamically-programmable interposer interconnect element;
a first electrical connection to carry, from the dynamically-programmable interposer interconnect element to the IC component, a supply voltage;
a second electrical connection to carry, from the dynamically-programmable interposer interconnect element to the IC component, a signal interface, wherein the signal interface comprises at least one of: one or more data signals, and one or more control signals;
a third switchable electrical connection to carry, from the dynamically-programmable interposer interconnect element to the IC component a ground voltage, wherein the third switchable electrical connection is closed prior to the second switchable electrical connection is closed, and wherein the second switchable electrical connection is closed prior to the first electrical connection is closed;
a first switch to disconnect the first electrical connection; and
a second switch to disconnect the second electrical connection, wherein the first switch and the second switch are operable to open in a sequence.
12. The apparatus of claim 11 , wherein the second electrical connection is to further carry an additional supply voltage,
wherein the additional supply voltage comprises one of: a ground voltage, or a positive supply voltage.
13. The apparatus of claim 11 , wherein the first switch is to close the first electrical connection after the second switch is to close the second switchable electrical connection.
14. The apparatus of claim 11 , comprising:
a pull-up resistor on the dynamically-programmable interposer interconnect element coupled between the supply voltage and the signal interface.
15. The apparatus of claim 11 ,
wherein the second switch is configurable to disconnect the second electrical connection by creation of an open circuit in the second electrical connection.
16. The apparatus of claim 12 ,
wherein the IC component is a first IC component; and
wherein the second electrical connection is to supply, from the dynamically-programmable interposer interconnect element to both the first IC component and a second IC component, one of: the additional supply voltage, or the signal interface.
17. A system comprising a power source and a component coupled to the power source, the component including:
an interposer interconnect element;
an Integrated Circuit (IC) component fastened to and electrically connected to the interposer interconnect element;
a first switchable electrical connection to carry, from the interposer interconnect element to the IC component, a supply voltage;
a second switchable electrical connection to carry, from the interposer interconnect element to the IC component, a signal interface, wherein the signal interface comprises at least one of: one or more data signals, and one or more control signals, and wherein the first switchable electrical connection and the second switchable electrical connection are operable to open in a sequence; and
a third switchable electrical connection to carry, from the interposer interconnect element to the IC component a ground voltage, wherein the third switchable electrical connection is closed prior to the second switchable electrical connection is closed, and wherein the second switchable electrical connection is closed prior to the first electrical connection is closed.
18. The system of claim 17 ,
wherein the first switchable electrical connection and the second switchable electrical connection are operable to both be open at a same time.
19. The system of claim 17 ,
wherein the interposer interconnect element is dynamically programmable; and
wherein a switch for the second switchable electrical connection is configurable to create an open circuit for an interface that carries an additional supply voltage, or the signal interface.
20. The system of claim 17 ,
wherein the IC component is a first IC component;
wherein the second switchable electrical connection is to supply, from the interposer interconnect element to both the first IC component and a second IC component, one of: a voltage-supply interface, or the signal interface; and
wherein a switch, for the second switchable electrical connection, is configurable to create both an open circuit between the interposer interconnect element and the first IC component, and an open circuit between the interposer interconnect element and the second IC component.