Electro-optical package and method of fabrication
An electro-optical package. In some embodiments, the electro-optical package includes a first electro-optical chip coupled to an array of optical fibers, and a first physical medium dependent integrated circuit coupled to the first electro-optical chip.
1. A system, comprising:
a first electro-optical chip coupled to an array of optical fibers; and
a first physical medium dependent integrated circuit coupled to the first electro-optical chip;
a first optical interposer chip coupled to the array of optical fibers; and
a first redistribution layer between the first physical medium dependent integrated circuit and the first optical interposer chip,
the first electro-optical chip being coupled to the array of optical fibers through the first optical interposer chip,
the first optical interposer chip comprising:
one or more waveguides; and
one or more conductive traces,
the one or more waveguides being on a first surface of the first optical interposer chip,
the one or more conductive traces being on the first surface of the first optical interposer chip,
the first surface of the first optical interposer chip being a surface of the first optical interposer chip facing the first physical medium dependent integrated circuit, and
the first redistribution layer comprising:
a layer of insulating material;
one or more conductive traces; and
one or more vias.
2. The system of claim 1 , further comprising a first via core on the first redistribution layer,
wherein the first via core comprises a plurality of vias in a dielectric,
wherein a via from among the plurality of vias extends from a first surface of the first via core to a second surface of the first via core, and
wherein the first surface of the first via core is a surface of the first via core facing the first redistribution layer.
3. The system of claim 2 , further comprising:
a second redistribution layer, parallel to the first redistribution layer, the first physical medium dependent integrated circuit being between the first redistribution layer and the second redistribution layer; and
a first array of conductors secured to the first redistribution layer and to the first optical interposer chip,
wherein the first via core is between the first redistribution layer and the second redistribution layer.
4. The system of claim 3 , wherein the first physical medium dependent integrated circuit and the first via core are part of a single silicon integrated circuit.
5. The system of claim 3 , further comprising an overmold between the first redistribution layer and the second redistribution layer, the overmold encapsulating the first physical medium dependent integrated circuit and the first via core.
6. The system of claim 3 , wherein the first optical interposer chip comprises an array of V-grooves, each optical fiber of the array of optical fibers being in a respective V-groove.
7. The system of claim 3 , further comprising:
a second array of conductors on an outer surface of the second redistribution layer; and
an organic substrate having, on its surface, a plurality of conductive pads, and a socket, between the second array of conductors and the conductive pads.
8. The system of claim 7 , wherein the socket comprises an insulating layer of elastomer and a plurality of conductors extending through the insulating layer of elastomer.
9. The system of claim 7 , wherein the first electro-optical chip comprises a modulator, the system further comprising:
a second electro-optical chip comprising a photodetector; and
a second physical medium dependent integrated circuit coupled to the second electro-optical chip.
10. The system of claim 9 , wherein:
a conductive path between the first physical medium dependent integrated circuit and the organic substrate includes a portion in a conductor of the socket; and
a conductive path between the second physical medium dependent integrated circuit and the organic substrate includes a portion in a conductor of the socket.
11. The system of claim 9 , wherein the second electro-optical chip is coupled to the array of optical fibers through the first optical interposer chip.
12. The system of claim 11 , wherein:
a conductive path between the first physical medium dependent integrated circuit and the organic substrate includes a portion in a conductor of the first via core; and
a conductive path between the second physical medium dependent integrated circuit and the organic substrate includes a portion in a conductor of the first via core.
13. The system of claim 9 , further comprising a second optical interposer chip, wherein the second electro-optical chip is coupled to the array of optical fibers through the second optical interposer chip.
14. The system of claim 13 , further comprising a second via core, wherein:
a conductive path between the first physical medium dependent integrated circuit and the organic substrate includes a portion in a conductor of the first via core; and
a conductive path between the second physical medium dependent integrated circuit and the organic substrate includes a portion in a conductor of the second via core.
15. The system of claim 1 , wherein a conductive path extending from the first electro-optical chip to the first physical medium dependent integrated circuit has a length of less than 500 microns.
16. The system of claim 15 , wherein the conductive path extending from the first electro-optical chip to the first physical medium dependent integrated circuit has a length of less than 350 microns.
17. A system comprising:
a first redistribution layer;
a via core attached to the first redistribution layer;
a physical medium dependent integrated circuit attached to the first redistribution layer;
an overmold on the via core and on the physical medium dependent integrated circuit; and
a second redistribution layer on an upper surface of the overmold.
18. The system of claim 17 , further comprising an array of conductors on the second redistribution layer.
19. The system of claim 18 , further comprising an electro-optical chip attached to an optical interposer chip comprising a plurality of conductive traces, and a plurality of V-grooves.
20. The system of claim 19 , further comprising an optical fiber in one of the plurality of V-grooves.
21. The system of claim 17 ,
wherein the via core comprises a plurality of vias in a dielectric,
wherein a via from among the plurality of vias extends from a first surface of the via core to a second surface of the via core, and
wherein the first surface of the via core is a surface of the via core facing the first redistribution layer.