Patent Assignment
Reel/Frame 074362/0776
MERGER
Recorded: 2026-02-10
Received: 2026-04-14
Pages: 10
Assignor
CELESTIAL AI INC.
Executed: 2026-02-02
Assignee
SICILY MERGER SUB II, INC.
5488 MARVELL LANE, SANTA CLARA, CA, 95054, UNITED STATES
Covered Applications
(76)
Optically Bridged Multicomponent Package with Extended Temperature Range
App. No. 19/465,761
→
OPTICAL MULTI-CHIP INTERCONNECT BRIDGE ARCHITECTURE AND FABRICATION PROCESSES
App. No. 19/360,176
→
OPTOELECTRONIC DEVICE AND METHOD OF MANUFACTURE OF VIA-FIRST METALLIZATION SCHEME
App. No. 19/344,435
→
PLATFORM MOUNTED COPLANAR PAD ARCHITECTURE
App. No. 19/344,471
→
Optically Bridged Multicomponent Package with Extended Temperature Range
App. No. 19/287,538
→
Optically Bridged Multicomponent Package with Extended Temperature Range
App. No. 19/285,279
→
Optically Bridged Multicomponent Package with Extended Temperature Range
App. No. 19/284,688
→
Optically Bridged Multicomponent Package with Extended Temperature Range
App. No. 19/170,416
→
Optically Bridged Multicomponent Package with Extended Temperature Range
App. No. 19/170,397
→
Optically Bridged Multicomponent Package with Extended Temperature Range
App. No. 19/170,641
→
Optically Bridged Multicomponent Package with Extended Temperature Range
App. No. 19/170,583
→
Optically Bridged Multicomponent Package with Extended Temperature Range
App. No. 19/170,617
→
Optically Bridged Multicomponent Package with Extended Temperature Range
App. No. 19/170,429
→
TWO-STAGE MANUFACTURING FOR ELECTRO-ABSORPTION MODULATOR AND PHOTODIODE
App. No. 19/020,399
→
TWO-STAGE MANUFACTURING FOR ELECTRO-ABSORPTION MODULATOR AND PHOTODIODE
App. No. 19/020,447
→
Photonics IC (PIC) with Extended Operating Temperature Range
App. No. 18/983,507
→
OPTICAL RING MODULATOR
App. No. 18/920,840
→
SURFACE CLEANING APPARATUS HAVING A BRUSH MOTOR INTERNAL OF A ROTATING BRUSH AND BRUSH MOTOR FOR DRIVING A ROTATABLE BRUSHING MEMBER
App. No. 18/911,920
→
OPTOELECTRONIC DEVICE AND ARRAY THEREOF
App. No. 18/823,626
→
Optically Bridged Multicomponent Package with Extended Temperature Range
App. No. 18/742,028
→
MULTICOMPONENT PHOTONICALLY BRIDGED ASSEMBLY
App. No. 18/632,471
→
MULTICOMPONENT PHOTONICALLY INTRA-DIE BRIDGED ASSEMBLY
App. No. 18/632,658
→
STACKED-DIES OPTICALLY BRIDGED MULTICOMPONENT PACKAGE
App. No. 18/610,431
→
OPTICAL BRIDGING ELEMENT FOR SEPARATELY STACKED ELECTRICAL ICS
App. No. 18/610,502
→
OPTICAL MULTI-DIE INTERCONNECT BRIDGE WITH ELECTRICAL AND OPTICAL INTERFACES
App. No. 18/376,474
→
OPTICAL MULTI-DIE INTERCONNECT BRIDGE WITH OPTICAL INTERFACE
App. No. 18/243,474
→
OPTOELECTRONIC DEVICE AND ARRAY THEREOF
App. No. 18/317,879
→
OPTICAL MULTI-DIE INTERCONNECT BRIDGE (OMIB)
App. No. 18/123,083
→
SWITCH ASSEMBLY
App. No. 17/909,344
→
THERMOSONIC BONDING FOR SECURING PHOTONIC COMPONENTS
App. No. 17/839,405
→
INTEGRATION OF PHOTONIC COMPONENTS ON SOI PLATFORM
App. No. 17/738,945
→
OPTICAL RING MODULATOR
App. No. 17/753,231
→
SILICON PHOTONIC INTERPOSER WITH TWO METAL REDISTRIBUTION LAYERS
App. No. 17/596,252
→
OPTOELECTRONIC DEVICE AND METHOD OF MANUFACTURE THEREOF
App. No. 17/364,837
→
OPTOELECTRONIC DEVICE AND ARRAY THEREOF
App. No. 17/349,835
→
INTEGRATED STRUCTURE AND MANUFACTURING METHOD THEREOF
App. No. 17/324,953
→
WAVEGUIDE TYPE PHOTODETECTOR AND METHOD OF MANUFACTURE THEREOF
App. No. 17/059,088
→
INTEGRATION OF PHOTONIC COMPONENTS ON SOI PLATFORM
App. No. 17/055,114
→
OPTOELECTRONIC DEVICE AND METHOD OF MANUFACTURE THEREOF
App. No. 17/092,151
→
INTERPOSER
App. No. 16/899,264
→
ROUTING PROTOCOL AND DISTRIBUTED ROUTER
App. No. 16/875,886
→
WAVEGUIDE MIRROR AND METHOD OF FABRICATING A WAVEGUIDE MIRROR
App. No. 16/866,419
→
SWITCH WITH A SHUFFLE
App. No. 16/846,213
→
OPTICAL ENGINE
App. No. 16/836,815
→
CO-PACKAGED OPTICS AND TRANSCEIVER
App. No. 16/824,609
→
LEAF SWITCH MODULE AND OPTOELECTRONIC SWITCH
App. No. 16/496,337
→
OPTOELECTRONIC SWITCH WITH REDUCED FIBRE COUNT
App. No. 16/491,561
→
WAVEGUIDE MODULATOR STRUCTURES
App. No. 16/550,141
→
OPTOELECTRONIC SWITCH
App. No. 16/487,782
→
COPACKAGING OF ASIC AND SILICON PHOTONICS
App. No. 16/505,674
→
OPTOELECTRONIC DEVICE
App. No. 16/420,096
→
ELECTRO-OPTICAL PACKAGE AND METHOD OF FABRICATION
App. No. 16/393,763
→
OPTICAL ENGINE
App. No. 16/383,309
→
ELECTRO-OPTICAL PACKAGE AND METHOD OF FABRICATION
App. No. 16/382,076
→
WAVEGUIDE MIRROR AND METHOD OF FABRICATING A WAVEGUIDE MIRROR
App. No. 16/368,605
→
ELECTRO-ABSORPTION MODULATOR
App. No. 16/286,533
→
OPTOELECTRONIC DEVICE
App. No. 16/275,157
→
INTEGRATED STRUCTURE AND MANUFACTURING METHOD THEREOF
App. No. 16/317,171
→
QUANTUM CONFINED STARK EFFECT ELECTROABSORPTION MODULATOR ON A SOI PLATFORM
App. No. 16/315,569
→
OPTICAL MODULATORS
App. No. 16/195,774
→
OPTOELECTRONIC DEVICE
App. No. 16/144,994
→
DRIVER FOR OPTICAL MODULATOR
App. No. 15/982,928
→
WAVEGUIDE MODULATOR STRUCTURES
App. No. 15/927,943
→
COPACKAGING OF ASIC AND SILICON PHOTONICS
App. No. 15/862,463
→
OPTOELECTRONIC DEVICE
App. No. 15/833,990
→
OPTOELECTRONIC DEVICE
App. No. 15/700,055
→
OPTOELECTRONIC DEVICE
App. No. 15/700,053
→
OPTOELECTRONIC SWITCH
App. No. 15/644,710
→
OPTOELECTRONIC SWITCH ARCHITECTURES
App. No. 15/521,600
→
OPTICAL SWITCH ARCHITECTURE
App. No. 15/461,421
→
OPTOELECTRONIC SWITCH
App. No. 15/390,348
→
OPTOELECTRONIC COMPONENT
App. No. 15/321,723
→
OPTOELECTRONIC SWITCH
App. No. 15/317,897
→
OPTOELECTRONIC SWITCH
App. No. 15/072,314
→
OPTICAL BRIDGE
App. No. 14/868,116
→
BURST-MODE RECEIVER
App. No. 14/813,081
→