IP Library Granted Patent US 10,222,677
Granted Patent B2
US 10,222,677 · App. 15/833,990 · Granted Mar 5, 2019

Optoelectronic device

Inventors: Guomin Yu (Glendora, CA); Hooman Abediasl (Pasadena, CA); Damiana Lerose (Pasadena, CA); Amit Singh Nagra (Altadena, CA); Pradeep Srinivasan (Fremont, CA); Haydn Frederick Jones (Reading, GB); Andrew George Rickman (Marlborough, GB); Aaron John Zilkie (Pasadena, CA)
Assignee: Rockley Photonics Limited
G02F1/2257H01L31/02327H01L31/0312H01L31/03048H01L31/1105G02F2001/212G02F2201/12G02F2202/10G02F2202/101
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Quick Facts
Patent No.
US 10,222,677
App. No.
15/833,990
Granted
Mar 5, 2019
Kind
B2
Abstract

An optoelectronic device and method of making the same. The device comprising: a substrate; an epitaxial crystalline cladding layer, on top of the substrate; and an optically active region, above the epitaxial crystalline cladding layer; wherein the epitaxial crystalline cladding layer has a refractive index which is less than a refractive index of the optically active region, such that the optical power of the optoelectronic device is confined to the optically active region.

Claims (39)

1. A detector remodulator comprising:

a silicon on insulator (SOI) chip having a silicon substrate, an insulator layer and a topmost silicon layer;

a detector coupled to a first input waveguide;

a modulator, coupled to a second input waveguide and an output waveguide; and

an electrical circuit connecting the detector to the modulator;

wherein the modulator includes a waveguide including:

a modulation region at which a semiconductor junction is set across the waveguide of the modulator, the junction comprising a first doped region and a second doped region;

wherein:

the electrical circuit is connected to a first electrical pad on a first side of the modulation region, the first electrical pad forming a contact directly to the first doped region,

the electrical circuit is connected to a second electrical pad on a second side of the modulation region, the second electrical pad forming a contact directly to the second doped region, and

the electrical circuit comprises a signal path from the detector to the modulator, the signal path having a portion in an integrated circuit; and wherein

the modulator is located at a portion of the SOI chip at which the topmost silicon layer and the insulator of the silicon on insulator chip have been replaced by a cladding layer on top of the substrate; the modulation region of the modulator comprising an optically active region, above the cladding layer; wherein the cladding layer has a refractive index which is less than a refractive index of the optically active region, such that an optical mode of the modulator is confined to the optically active region.

2. The detector remodulator of claim 1 , wherein the detector is located at a second portion of the SOI chip at which the topmost silicon layer and the insulator layer of the silicon on insulator chip have been replaced by a cladding layer on top of the substrate, the detector comprising an optically active region, above the cladding layer; and

wherein the cladding layer has a refractive index which is less than a refractive index of the optically active region, such that an optical mode of the detector is confined to the optically active region.

3. The detector remodulator of claim 1 , wherein the optically active region is formed of: SiGeSn, GeSn, InGaNAs, or InGaNAsSb; and wherein the optically active region is formed of Si x Ge 1-x-y Sn y where 5%≤x≤20%, 1%≤y≤10%.

4. The detector remodulator of claim 1 , wherein the cladding layer is formed of a crystalline epitaxial material.

5. The detector remodulator of claim 4 , wherein the cladding layer is formed of silicon or SiGe and is epitaxially grown silicon or SiGe.

6. The detector remodulator of claim 1 , further comprising a silicon seed layer between the cladding layer and the optically active region.

7. The detector remodulator of claim 1 , wherein the first input waveguide, the detector, the modulator, the second input waveguide, and output waveguide are arranged within the same horizontal plane as one another.

8. The detector remodulator of claim 1 , wherein the semiconductor junction of the modulation region is a p-i-n junction having a p-doped region, an intrinsic region, and an n-doped region, wherein the first electrical pad forms a contact directly to the p-doped region of the p-i-n junction and the second electrical pad forms a contact directly to the n-doped region of the p-i-n junction.

9. The detector remodulator of claim 1 , wherein the detector comprises a waveguide portion with a semiconductor junction set horizontally across the waveguide portion, and wherein the semiconductor junction of the detector is a p-i-n junction.

10. The detector remodulator of claim 1 , wherein the modulator is an electro-absorption modulator (EAM).

11. The detector remodulator of claim 1 , wherein the modulator is a Mach-Zehnder modulator (MZM); and wherein each arm of the MZM includes a modulation region and a phase shift region in addition to the modulation region; and wherein, in each arm, the phase shift region has a lower speed than the modulation region.

12. The detector remodulator of claim 1 , wherein the electrical circuit is surface mounted.

13. A detector remodulator comprising:

a silicon on insulator (SOI) chip having a silicon substrate, an insulator layer and a topmost silicon layer;

a detector coupled to a first input waveguide;

a modulator, coupled to a second input waveguide and an output waveguide; and

an electrical circuit connecting the detector to the modulator;

wherein the modulator includes a waveguide including:

a modulation region at which a semiconductor junction is set across the waveguide of the modulator, the junction comprising a first doped region and a second doped region;

wherein:

the electrical circuit is connected to a first electrical pad on a first side of the modulation region, the first electrical pad forming a contact directly to the first doped region,

the electrical circuit is connected to a second electrical pad on a second side of the modulation region, the second electrical pad forming a contact directly to the second doped region, and

the electrical circuit comprises a signal path from the detector to the modulator, the signal path having a portion in an integrated circuit; and wherein

the detector is located at a portion of the SOI chip at which the topmost silicon layer and the insulator of the silicon on insulator chip have been replaced by a cladding layer on top of the substrate; the detector comprising an optically active region above the cladding layer; wherein the cladding layer has a refractive index which is less than a refractive index of the optically active region, such that an optical mode of the detector is confined to the optically active region.

14. The detector remodulator of claim 13 , wherein the cladding layer is formed of a crystalline epitaxial material.

15. The detector remodulator of claim 14 , wherein the cladding layer is formed of silicon or SiGe and is epitaxially grown silicon or SiGe.

16. The detector remodulator of claim 13 , wherein the electrical circuit is surface mounted.

Assignments (8)
MERGER Recorded Feb 10, 2026
From: CELESTIAL AI INC.
To: SICILY MERGER SUB II, INC.
Reel/Frame 074362/0776 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 12, 2025
From: ROCKLEY PHOTONICS LTD.
To: CELESTIAL AI INC.
Reel/Frame 073203/0118 →
RELEASE OF SECURITY INTEREST - REEL/FRAME 060204/0749 Recorded Mar 19, 2023
From: WILMINGTON SAVINGS FUND SOCIETY, FSB, AS COLLATERAL AGENT
To: ROCKLEY PHOTONICS LIMITED
Reel/Frame 063264/0333 →
RELEASE OF PATENT SECURITY INTEREST - SUPER SENIOR INDENTURE - REEL/FRAME 061768/0082 Recorded Mar 19, 2023
From: WILMINGTON SAVINGS FUND SOCIETY, FSB, AS COLLATERAL AGENT
To: ROCKLEY PHOTONICS LIMITED
Reel/Frame 063264/0416 →
SECURITY INTEREST Recorded Mar 19, 2023
From: ROCKLEY PHOTONICS LIMITED
To: WILMINGTON SAVINGS FUND SOCIETY, FSB, AS COLLATERAL AGENT
Reel/Frame 063287/0879 →
SECURITY INTEREST - SUPER SENIOR INDENTURE Recorded Oct 25, 2022
From: ROCKLEY PHOTONICS LIMITED
To: WILMINGTON SAVINGS FUND SOCIETY, FSB, AS COLLATERAL AGENT
Reel/Frame 061768/0082 →
SECURITY INTEREST Recorded May 27, 2022
From: ROCKLEY PHOTONICS LIMITED
To: WILMINGTON SAVINGS FUND SOCIETY, FSB, AS COLLATERAL AGENT
Reel/Frame 060204/0749 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 28, 2018
From: YU, GUOMIN; ABEDIASL, HOOMAN; LEROSE, DAMIANA; NAGRA, AMIT SINGH; SRINIVASAN, PRADEEP; JONES, HAYDN FREDERICK; RICKMAN, ANDREW GEORGE; ZILKIE, AARON JOHN
To: ROCKLEY PHOTONICS LIMITED
Reel/Frame 045379/0831 →
Priority Claims (3)
GB 1403191.8 · Feb 24, 2014 · national
GB 1611427.4 · Jun 30, 2016 · national
GB 1711525.4 · Jul 18, 2017 · national
Continuity (18)
Continuation In Part 15700053 · Sep 8, 2017
Continuation In Part 15700055 · Sep 8, 2017
Continuation In Part 15369804 · Dec 5, 2016
Continuation In Part 14629922 · Feb 24, 2015
Continuation In Part PCTEP2016077338 · Nov 10, 2016
Continuation In Part 15833990 · Dec 6, 2017
Continuation In Part PCTEP2017080216 · Nov 23, 2017
Continuation 15700053 · Sep 8, 2017
Continuation In Part 15700055 · Sep 8, 2017
Provisional Application 62528900 · Jul 5, 2017
Provisional Application 62254674 · Nov 12, 2015
Provisional Application 62351189 · Jun 16, 2016
Provisional Application 62351189 · Jun 16, 2016
Provisional Application 62359595 · Jul 7, 2016
Provisional Application 62426117 · Nov 23, 2016
Provisional Application 62427132 · Nov 28, 2016
Provisional Application 62528900 · Jul 5, 2017
Related Publication 20180101082A1 · Apr 12, 2018