Electro-optical package and method of fabrication
An electro-optical package. In some embodiments, the package includes an electronic integrated circuit module, a first electro-optical component, and a photonic integrated circuit. The first electro-optical component may be in a top surface of the photonic integrated circuit. The electronic integrated circuit module may have a top surface facing toward and overlapping both a portion of the first electro-optical component, and a portion of the photonic integrated circuit.
1. A package, comprising:
an electronic integrated circuit module;
a first electro-optical component; and
a photonic integrated circuit,
the first electro-optical component being in a top surface of the photonic integrated circuit,
the electronic integrated circuit module comprising a redistribution layer and having a top surface facing toward and overlapping:
a portion of the first electro-optical component; and
a portion of the photonic integrated circuit.
2. The package of claim 1 , wherein the electronic integrated circuit module comprises:
an electronic integrated circuit chip having a top surface; and
a plurality of conductors protruding from the top surface of the electronic integrated circuit chip,
wherein the top surface of the electronic integrated circuit chip faces toward and overlaps:
a portion of the first electro-optical component, and
a portion of the photonic integrated circuit; and
wherein a conductive path from the electronic integrated circuit chip to the first electro-optical component extends through a conductor of the plurality of conductors.
3. The package of claim 1 , wherein the electronic integrated circuit module further comprises:
an electronic integrated circuit chip having a top surface, the redistribution layer being on the top surface of the electronic integrated circuit chip; and
a plurality of conductors protruding from a top surface of the redistribution layer,
wherein the top surface of the redistribution layer faces toward and overlaps:
a portion of the first electro-optical component; and
a portion of the photonic integrated circuit, and
wherein a conductive path from the electronic integrated circuit chip to the first electro-optical component extends through a conductor of the plurality of conductors.
4. The package of claim 3 , further comprising an underfill surrounding each of the plurality of conductors.
5. The package of claim 3 , wherein the electronic integrated circuit module comprises a physical medium dependent circuit, configured to interface with the first electro-optical component.
6. The package of claim 5 , wherein the physical medium dependent circuit is in the electronic integrated circuit chip.
7. The package of claim 5 , wherein the physical medium dependent circuit is in a chip, separate from the electronic integrated circuit chip, on a bottom surface of, and connected to, the redistribution layer.
8. The package of claim 1 , wherein the first electro-optical component is a chip embedded in a cavity in the top surface of the photonic integrated circuit.
9. The package of claim 8 , further comprising a eutectic bond between the first electro-optical component and a conductive trace on the top surface of the photonic integrated circuit.
10. The package of claim 1 , wherein the first electro-optical component is integral with the photonic integrated circuit.
11. The package of claim 1 , further comprising a second electro-optical component, wherein:
the first electro-optical component comprises a photodiode chip, and
the second electro-optical component comprises a modulator chip.
12. A method for fabricating a package, the method comprising forming a first intermediate product on a first temporary carrier, the forming of the first intermediate product comprising:
forming a redistribution layer on the first temporary carrier;
bonding a via interposer to the redistribution layer;
bonding a photonic integrated circuit to the redistribution layer; and
attaching an electronic integrated circuit module to the via interposer and to the photonic integrated circuit.
13. The method of claim 12 , further comprising:
debonding the first intermediate product from the first temporary carrier;
flipping the first intermediate product;
attaching the flipped first intermediate product to a second temporary carrier; and
forming a ball grid array on the redistribution layer.
14. A package, comprising:
an electronic integrated circuit module;
a first electro-optical component;
a photonic integrated circuit; and
a via interposer abutting against a top surface of the electronic integrated circuit module,
the first electro-optical component being in a top surface of the photonic integrated circuit,
the top surface of the electronic integrated circuit module facing toward and overlapping:
a portion of the first electro-optical component; and
a portion of the photonic integrated circuit.
15. The package of claim 14 , wherein the via interposer has:
a first surface facing the electronic integrated circuit module;
a second surface opposite the first surface; and
a plurality of conductive vias extending from the first surface to the second surface, and
the conductive vias being respectively electrically connected to a plurality of conductors on the top surface of the electronic integrated circuit module.
16. The package of claim 15 , wherein the via interposer is a separate element from the photonic integrated circuit.
17. The package of claim 16 , wherein the photonic integrated circuit has a cutout to accommodate the via interposer, and the photonic integrated circuit wraps around at least two sides of the via interposer.
18. The package of claim 17 , wherein:
the via interposer is rectangular,
the cutout is a hole, and
the photonic integrated circuit wraps around all four sides of the via interposer.
19. The package of claim 15 , further comprising a redistribution layer having a top surface and a bottom surface, the bottom surface abutting against:
the bottom surface of the photonic integrated circuit; and
the second surface of the via interposer.
20. The package of claim 19 , further comprising a plurality of conductors protruding from the top surface of the redistribution layer.
21. The package of claim 15 , wherein the via interposer is integral with the photonic integrated circuit.
22. A hybrid interposer, comprising:
an electro-optical component;
a photonic integrated circuit; and
a via interposer,
the electro-optical component being in a top surface of the photonic integrated circuit,
the via interposer begin adjacent to an edge of the photonic integrated circuit and having:
a first surface substantially level with a top surface of the photonic integrated circuit;
a second surface opposite the first surface; and
a plurality of conductive vias extending from the first surface to the second surface.
23. The hybrid interposer of claim 22 , further comprising a redistribution layer,
the photonic integrated circuit being on a bottom surface of the redistribution layer; and
the via interposer being on the bottom surface of the redistribution layer, a via of the via interposer being connected to a conductor in the redistribution layer.
24. The hybrid interposer of claim 23 , wherein the top surface of the photonic integrated circuit has:
a waveguide mode converter, and
a V-groove,
the V-groove being configured to align an optical fiber to the waveguide mode converter,
the waveguide mode converter being configured to couple light between the optical fiber and the electro-optical component.
25. The hybrid interposer of claim 24 , further comprising a plurality of conductors protruding from a top surface of the redistribution layer.