IP Library Granted Patent US 11,333,907
Granted Patent B2
US 11,333,907 · App. 16/383,309 · Granted May 17, 2022

Optical engine

Inventors: David Arlo Nelson (Fort Collins, CO); Vivek Raghuraman (Santa Clara, CA); David Erich Tetzlaff (Minnetonka, MN); Karlheinz Muth (Richardson, TX); Vivek Raghunathan (Mountain View, CA)
Assignee: Rockley Photonics Limited
G02F1/0121H03F1/3241H03F3/217H03F3/245H03K17/687H04B10/505H04B10/588H03K19/20
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Quick Facts
Patent No.
US 11,333,907
App. No.
16/383,309
Granted
May 17, 2022
Kind
B2
Abstract

A system including an optical engine. In some embodiments, the system includes an integrated circuit in a first-level package, and the system includes the optical engine, in the first-level package, and the optical engine includes an electro-optical chip.

Claims (31)

1. A system, comprising:

a first integrated circuit in a first-level package; and

an optical engine, in the first-level package,

the optical engine comprising a first electro-optical chip,

wherein the optical engine is configured to exchange data with the first integrated circuit at a first symbol rate, and an electrical connection between the optical engine and the first integrated circuit exhibits a loss of less than 10 dB at a Nyquist frequency corresponding to the first symbol rate.

2. The system of claim 1 , wherein the optical engine further comprises:

a second integrated circuit comprising a first analog circuit for interfacing to the first electro-optical chip.

3. The system of claim 2 , wherein:

the first electro-optical chip comprises a photodetector;

the optical engine further comprises a second electro-optical chip comprising an optical modulator; and

the second integrated circuit further comprises a second analog circuit for interfacing to the optical modulator.

4. The system of claim 3 , wherein the first analog circuit is a linear modulator driver, and the second analog circuit is a transimpedance amplifier.

5. The system of claim 2 , wherein the second integrated circuit further comprises a retiming circuit.

6. The system of claim 5 , wherein the second integrated circuit further comprises a physical coding sublayer circuit.

7. The system of claim 2 , wherein the optical engine is connected to a substrate of the first-level package through a reworkable interface.

8. The system of claim 7 , wherein the reworkable interface is a socketed interface.

9. The system of claim 2 , wherein the second integration circuit comprises an equalization circuit.

10. The system of claim 2 , wherein the first electro-optical chip comprises an optical PAM-4 modulator configured to driven by a two-bit control signal.

11. The system of claim 2 , comprising:

a plurality of optical engines including the optical engine; and

a management circuit, configured to manage the plurality of optical engines.

12. The system of claim 2 , comprising an enclosure having a front panel, the first-level package being in the enclosure, the system further comprising a front panel package comprising a laser connected through an optical fiber to the first-level package.

13. The system of claim 12 , wherein the front panel package has a QSFP-DD or OSFP-DD form factor and the optical fiber connects a first interface of the front panel package to the first-level package, the first interface being on the outside of the front panel.

14. The system of claim 2 , wherein the first integrated circuit is a packet-switching digital integrated circuit.

15. The system of claim 1 , wherein the first electro-optical chip comprises an optical PAM-4 modulator configured to driven by a two-bit control signal.

16. The system of claim 1 , comprising:

a plurality of optical engines including the optical engine; and

a management circuit, configured to manage the plurality of optical engines.

17. The system of claim 1 , comprising an enclosure having a front panel, the first-level package being in the enclosure, the system further comprising a front panel package comprising a laser connected through an optical fiber to the first-level package.

18. The system of claim 17 , wherein the front panel package has a QSFP-DD or OSFP-DD form factor and the optical fiber connects a first interface of the front panel package to the first-level package, the first interface being on the outside of the front panel.

19. The system of claim 1 , wherein the first integrated circuit is a packet-switching digital integrated circuit.

Assignments (8)
MERGER Recorded Feb 10, 2026
From: CELESTIAL AI INC.
To: SICILY MERGER SUB II, INC.
Reel/Frame 074362/0776 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 12, 2025
From: ROCKLEY PHOTONICS LTD.
To: CELESTIAL AI INC.
Reel/Frame 073203/0118 →
RELEASE OF SECURITY INTEREST - REEL/FRAME 060204/0749 Recorded Mar 19, 2023
From: WILMINGTON SAVINGS FUND SOCIETY, FSB, AS COLLATERAL AGENT
To: ROCKLEY PHOTONICS LIMITED
Reel/Frame 063264/0333 →
RELEASE OF PATENT SECURITY INTEREST - SUPER SENIOR INDENTURE - REEL/FRAME 061768/0082 Recorded Mar 19, 2023
From: WILMINGTON SAVINGS FUND SOCIETY, FSB, AS COLLATERAL AGENT
To: ROCKLEY PHOTONICS LIMITED
Reel/Frame 063264/0416 →
SECURITY INTEREST Recorded Mar 19, 2023
From: ROCKLEY PHOTONICS LIMITED
To: WILMINGTON SAVINGS FUND SOCIETY, FSB, AS COLLATERAL AGENT
Reel/Frame 063287/0879 →
SECURITY INTEREST - SUPER SENIOR INDENTURE Recorded Oct 25, 2022
From: ROCKLEY PHOTONICS LIMITED
To: WILMINGTON SAVINGS FUND SOCIETY, FSB, AS COLLATERAL AGENT
Reel/Frame 061768/0082 →
SECURITY INTEREST Recorded May 27, 2022
From: ROCKLEY PHOTONICS LIMITED
To: WILMINGTON SAVINGS FUND SOCIETY, FSB, AS COLLATERAL AGENT
Reel/Frame 060204/0749 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 3, 2020
From: NELSON, DAVID ARLO; RAGHURAMAN, VIVEK; TETZLAFF, DAVID ERICH; MUTH, KARLHEINZ; RAGHUNATHAN, VIVEK
To: ROCKLEY PHOTONICS LIMITED
Reel/Frame 053684/0724 →
Continuity (4)
Continuation In Part 15982928 · May 17, 2018
Provisional Application 62656748 · Apr 12, 2018
Provisional Application 62510211 · May 23, 2017
Related Publication 20190243164A1 · Aug 8, 2019
Cited By (2)
US 1,069,740 US 1,077,762