Methods of forming source/drain contacts in field-effect transistors

1. A method comprising:

forming a first dummy source/drain (S/D) contact over a first epitaxial S/D feature and a second dummy S/D contact over a second epitaxial S/D feature, wherein the first and the second dummy S/D contacts are formed in an interlayer dielectric (ILD) layer, and wherein the first dummy S/D contact includes a first dielectric material and the second dummy S/D contact includes a second dielectric material different from the first dielectric material;

removing a portion of the first dummy S/D contact, a portion of the second dummy S/D contact, and a portion of the ILD layer disposed between the first and the second dummy S/D contacts to form a first trench;

removing a remaining portion of the first dummy S/D contact to form a second trench; and

forming a metal S/D contact in the first and the second trenches.

2. The method of claim 1 , wherein the removing of the remaining portion of the first dummy S/D contact includes selectively etching the first dielectric material relative to the ILD layer and the second dielectric material.

3. The method of claim 1 , wherein forming the first dummy S/D contact and the second dummy S/D contact includes:

forming a third trench to expose the first epitaxial S/D feature and a fourth trench to expose the second epitaxial S/D feature in the ILD layer;

depositing the first dielectric material in the third trench and the fourth trench;

removing the first dielectric material from the fourth trench to expose the second epitaxial S/D feature;

depositing the second dielectric material in the fourth trench; and

planarizing a top surface of the second dielectric material to form the first dummy S/D contact and the second dummy S/D contact.

4. The method of claim 1 , wherein the first dielectric material is carbon-containing, and wherein the second dielectric material is oxygen-containing.

5. The method of claim 1 , wherein a sidewall of the first trench is defined by the second dielectric material.

6. The method of claim 1 , wherein a width of the first trench extends through the second dielectric material such that a sidewall of the first trench is defined by the ILD layer.

7. The method of claim 2 , wherein the removing of the portions of the first dummy S/D contact, the second dummy S/D contact, and the ILD layer includes forming a patterned resist layer over the ILD layer and etching the portions of the first dummy S/D contact, the second dummy S/D contact, and the ILD layer exposed by the patterned resist layer.

8. A method, comprising:

etching an interlayer dielectric (ILD) layer to form a first trench exposing a first source/drain (S/D) feature and a second trench exposing a second S/D feature;

forming a first dielectric feature and a second dielectric feature in the first trench and the second trench, respectively; and

replacing the first dielectric feature with an S/D contact configured to be coupled with the first S/D feature, wherein the replacing includes:

etching portions of the first and the second dielectric features and a portion of the ILD layer disposed therebetween to form a third trench having a width spanning from the first dielectric feature to the second dielectric feature,

etching a remaining portion of the first dielectric feature to form a fourth trench that exposes the first S/D features, and

depositing a conductive material in the third and the fourth trenches to form the S/D contact.

9. The method of claim 8 , wherein a top surface of a portion of the ILD layer exposed by the third trench is above the first and the second S/D features.

10. The method of claim 8 , further comprising forming a barrier layer in the third and the fourth trenches before the depositing of the conductive material.

11. The method of claim 8 , further comprising forming a silicide layer over each of the first and the second S/D features before the depositing of the conductive material.

12. The method of claim 8 , wherein the width of the third trench extends partially through the second dielectric feature, such that a sidewall of the third trench is defined by the second dielectric feature.

13. The method of claim 8 , wherein the etching of the portions of the first and the second dielectric features includes forming a patterned resist layer over the portions of the first and the second dielectric features, and wherein the etching of a remaining portion of the first dielectric feature includes selectively etching the first dielectric feature relative to the ILD layer and the second dielectric feature.

14. The method of claim 1 , further comprising:

recessing a top portion of the S/D contact; and

forming a third dielectric material over the recessed S/D contact.

15. The method of claim 8 , wherein the first dielectric feature and the second dielectric feature have different compositions.

16. A method, comprising:

forming a first source/drain (S/D) feature and a second S/D feature adjacent to the first S/D feature over a semiconductor substrate;

depositing an interlayer dielectric (ILD) layer over the first and the second S/D features;

forming a first dielectric feature and a second dielectric feature in the ILD layer to contact the first S/D feature and the second S/D feature, respectively;

forming a trench that extends laterally from the first dielectric feature to the second dielectric feature;

extending the trench vertically to expose the first S/D feature; and

forming an S/D contact in the trench to contact the first S/D feature, such that a first sidewall of the S/D contact is defined by the ILD layer and a second sidewall of the S/D contact is defined by the second dielectric feature.

17. The method of claim 16 , wherein the forming of the trench removes a portion of each of the first dielectric feature, the second dielectric feature, and the ILD layer disposed between the first dielectric feature and the second dielectric feature.

18. The method of claim 16 , wherein the first dielectric feature and the second dielectric feature differ in composition, and wherein the extending of the trench removes a remaining portion of the first dielectric feature without substantially removing the second dielectric feature or the ILD layer.

19. The method of claim 16 , further comprising forming a silicide layer over the first S/D feature before forming the S/D contact.

20. The method of claim 16 , wherein forming the S/D contact results in a portion of a bottom surface of the S/D contact being defined by the second dielectric feature.