Semiconductor device package and method of manufacturing the same
A semiconductor device package includes a substrate, a first electronic component, a second electronic component, a package body and a shield. The substrate has a first surface and a second surface opposite to the first surface. The substrate defines a cavity from the second surface extending into the substrate. The first electronic component is disposed on the first surface of the substrate. The second electronic component is disposed within the cavity of the substrate. The package body is disposed on a portion of the first surface of the substrate and covers the first electronic component. The shield is disposed on external surfaces of the package body.
1. A semiconductor device package, comprising:
a first substrate having a first surface and a second surface opposite to the first surface;
a first electronic component disposed on the first surface of the first substrate;
a second electronic component disposed on the second surface of the first substrate;
a frame board disposed on the second surface of the first substrate, wherein the frame board is electrically connected to the first substrate through an adhesive element;
a first package body disposed on a portion of the first surface of the first substrate and covering the first electronic component; and
a second package body covering the second electronic component.
2. The semiconductor device package of claim 1 , wherein the frame board is disposed in or near the periphery of second surface of the first substrate.
3. The semiconductor device package of claim 1 , wherein the frame board includes conductive vias penetrating the frame board and electrically connected to the first substrate.
4. The semiconductor device package of claim 1 , further comprising a second substrate disposed between the first substrate and the frame board, wherein the second substrate has a first surface facing the first substrate and a second surface facing the second electronic component.
5. The semiconductor device package of claim 4 , wherein the second electronic component is disposed directly on the second surface of the second substrate.
6. The semiconductor device package of claim 4 , wherein the first substrate is connected to the second substrate through a conductive adhesion.
7. The semiconductor device package of claim 1 , further comprising electrical contacts disposed on a surface of the frame board facing away from the first substrate.
8. The semiconductor device package of claim 1 , wherein the first package body has a lateral surface recessed from a lateral surface of the first substrate.
9. The semiconductor device package of claim 1 , further comprising a shield disposed on external surfaces of the first package body.
10. The semiconductor device package of claim 1 , wherein a thickness of the second electronic component is greater than a thickness of the frame board.
11. The semiconductor device package of claim 1 , further comprising a heat dissipation element disposed on a backside surface of the second electronic component.
12. The semiconductor device package of claim 1 , wherein the frame board surrounds the second package body.
13. The semiconductor device package of claim 9 , wherein the shield is disposed on at least a portion of a lateral surface of the frame board.
14. The semiconductor device package of claim 9 , wherein the shield is disposed on at least a portion of the first surface of the first substrate.
15. The semiconductor device package of claim 4 , wherein the frame board includes conductive vias penetrating the frame board and electrically connected to the second substrate.
16. The semiconductor device package of claim 11 , wherein the heat dissipation element comprises a graphite film disposed on the backside surface of the second electronic component.
17. The semiconductor device package of claim 16 , wherein the heat dissipation element further comprises a conductive layer disposed on the graphite film.
18. The semiconductor device package of claim 1 , wherein a lateral surface of the first package body exposes the first surface of the first substrate.
19. The semiconductor device package of claim 1 , wherein the frame board surrounds the second electronic component.
20. The semiconductor device package of claim 9 , wherein the shield is disposed on at least a portion of a lateral surface of the first substrate.
21. A semiconductor device package, comprising:
a first substrate having a first surface and a second surface opposite to the first surface;
a first electronic component disposed on the first surface of the first substrate;
a second electronic component disposed on the second surface of the first substrate;
a frame board disposed on the second surface of the first substrate; and
a first package body disposed on a portion of the first surface of the first substrate and covering the first electronic component, wherein the first package body has a lateral surface recessed from a lateral surface of the first substrate.
22. The semiconductor device package of claim 21 , wherein the frame board surrounds the second electronic component.
23. The semiconductor device package of claim 21 , further comprising a shield disposed on external surfaces of the first package body.
24. A semiconductor device package, comprising:
a first substrate having a first surface and a second surface opposite to the first surface;
a first electronic component disposed on the first surface of the first substrate;
a second electronic component disposed on the second surface of the first substrate;
a frame board disposed on the second surface of the first substrate, wherein the frame board is electrically connected to the first substrate through an adhesive element, wherein a thickness of the second electronic component is greater than a thickness of the frame board;
a first package body disposed on a portion of the first surface of the first substrate and covering the first electronic component.