IP Library Granted Patent US 11,453,958
Granted Patent B2
US 11,453,958 · App. 16/389,347 · Granted Sep 27, 2022

Heat-insulating shield member and single crystal manufacturing apparatus having the same

Inventor: Yohei Fujikawa (Hikone, JP)
Assignee: SHOWA DENKO K.K.
C30B25/08C30B25/105C30B25/12C30B29/06C30B29/36C30B35/002
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Quick Facts
Patent No.
US 11,453,958
App. No.
16/389,347
Granted
Sep 27, 2022
Kind
B2
Abstract

The present invention provides a heat-insulating shield member, wherein the heat-insulating shield member is arranged and used between a SiC source housing ( 3 ) and a substrate support ( 4 ) in a single crystal manufacturing apparatus ( 10 ), wherein the single crystal manufacturing apparatus ( 10 ) comprises a crystal growth container ( 2 ) and a heating member ( 5 ) arranged on an outer periphery of the crystal growth container ( 2 ), wherein the crystal growth container ( 2 ) includes the SiC source housing ( 3 ) disposed at a lower portion of the apparatus, and the substrate support ( 4 ) which is arranged above the SiC source housing ( 3 ) and supports a substrate (S) used for crystal growth so as to face the SiC source housing ( 3 ), and wherein the single crystal manufacturing apparatus ( 10 ) is configured to grow a single crystal (W) from a SiC source (M) on the substrate (S) by sublimating the SiC source (M) from the SiC source housing ( 3 ).

Claims (55)

1. A heat-insulating shield member, wherein

the heat-insulating shield member is arranged and used between a SiC source housing and a substrate support in a single crystal manufacturing apparatus,

wherein the single crystal manufacturing apparatus comprises

a crystal growth container and

a heating member arranged on an outer periphery of the crystal growth container,

wherein the crystal growth container includes

the SiC source housing, wherein the SiC source housing is disposed at a lower portion of the apparatus,

the substrate support, wherein the substrate support is arranged above the SiC source housing and supports a substrate so as to face the SiC source housing,

the heat-insulating shield member which is arranged and used between the SiC source housing and the substrate support, and

a supporting rod which supports a center of the heat-insulating shield member from a lower side,

wherein the single crystal manufacturing apparatus is configured to grow a single crystal from a SiC source on the substrate by sublimating the SiC source from the SiC source housing,

wherein the heat-insulating shield member contains a low thermally conductive carbon material having thermal conductivity lower than graphite,

the low thermally conductive carbon material consists of carbon,

a diameter of the heat-insulating shield member is smaller than an inner diameter of the crystal growth container, and

the heat-insulating shield member is made of a heat-insulating material having thermal conductivity of 1 to 3.25 W/m·K in at least a thickness direction at room temperature.

2. The heat-insulating shield member according to claim 1 , wherein the low thermally conductive carbon material is either a carbon fiber material or expanded graphite.

3. The heat-insulating shield member according to claim 1 , wherein the low thermally conductive carbon material is a graphite material having thermal anisotropy.

4. The heat-insulating shield member according to claim 1 , wherein the heat-insulating shield member has a structure in which a heat-insulating material is surrounded by a graphite material.

5. The heat-insulating shield member according to claim 1 , wherein the heat-insulating shield member has a surface which is coated by a metal carbide layer.

6. A single crystal manufacturing apparatus comprising:

a crystal growth container and

a heating member arranged on an outer periphery of the crystal growth container,

wherein the crystal growth container includes

a SiC source housing disposed at a lower portion of the apparatus,

a substrate support which is arranged above the SiC source housing and supports a substrate so as to face the SiC source housing,

a heat-insulating shield member which is arranged and used between the SiC source housing and the substrate support, and

a supporting rod which supports a center of the heat-insulating shield member from a lower side,

wherein the heat-insulating shield member contains a low thermally conductive carbon material having thermal conductivity lower than graphite,

wherein the low thermally conductive carbon material consists of carbon, and a diameter of the heat-insulating shield member is smaller than an inner diameter of the crystal growth container,

wherein the single crystal manufacturing apparatus is configured to grow a single crystal from a SiC source on the substrate by sublimating the SiC source from the SiC source housing, and

the heat-insulating shield member is made of a heat-insulating material having thermal conductivity of 1 to 3.25 W/m·K in at least a thickness direction at room temperature.

7. The heat-insulating shield member according to claim 1 , wherein

the heat-insulating shield member is made of the low thermally conductive carbon material.

8. The heat-insulating shield member according to claim 1 , wherein the heat-insulating shield member is made of porous carbon.

9. The heat-insulating shield member according to claim 1 , wherein the heat-insulating shield member is made of a graphite material in which thermal conductivity thereof is anisotropic in the thickness direction and a direction orthogonal to the thickness direction, and is formed by pressing expanded graphite into a compacted sheet shape.

10. The single crystal manufacturing apparatus according to claim 6 , wherein

the heat-insulating shield member is arranged between the SiC source housing and the substrate support in a single crystal manufacturing apparatus.

11. The single crystal manufacturing apparatus according to claim 6 , wherein

the heat-insulating shield member is made of the low thermally conductive carbon material.

12. The single crystal manufacturing apparatus according to claim 6 , wherein

the heat-insulating shield member is made of porous carbon.

13. The single crystal manufacturing apparatus according to claim 6 , wherein

the heat-insulating shield member is made of a graphite material in which thermal conductivity thereof is anisotropic in the thickness direction and a direction orthogonal to the thickness direction, and is formed by pressing expanded graphite into a compacted sheet shape.

14. The heat-insulating shield member according to claim 1 , wherein the heat-insulating shield member has a circular flat plate shape, and the crystal growth container has a columnar crucible shape.

15. The heat-insulating shield member according to claim 1 , wherein the heat-insulating shield member consists of the low thermally conductive carbon material.

16. The single crystal manufacturing apparatus according to claim 6 , wherein the heat-insulating shield member has a circular flat plate shape, and the crystal growth container has a columnar crucible shape.

17. The single crystal manufacturing apparatus according to claim 6 , wherein the heat-insulating shield member consists of the low thermally conductive carbon material.

18. The single crystal manufacturing apparatus according to claim 6 , wherein the heat-insulating shield member satisfies at least one selected from the following characteristics (i) to (iv):

(i) the low thermally conductive carbon material consists of a carbon fiber material,

(ii) the low thermally conductive carbon material consists of expanded graphite,

(iii) the low thermally conductive carbon material consists of a graphite material having thermal anisotropy,

(iv) the heat-insulating shield member has a structure in which a heat-insulating material is surrounded by a graphite material, and

(v) the heat-insulating shield member has a surface which is coated by a metal carbide layer.

19. The heat-insulating shield member according to claim 1 , wherein the thermal conductivity of the heat-insulating shield member in the thickness direction is smaller than the thermal conductivity of the heat-insulating shield member in the plane direction.

20. The single crystal manufacturing apparatus according to claim 6 , wherein the thermal conductivity of the heat-insulating shield member in the thickness direction is smaller than the thermal conductivity of the heat-insulating shield member in the plane direction.

Assignments (3)
CHANGE OF ADDRESS Recorded Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →
CHANGE OF NAME Recorded Jun 23, 2023
From: SHOWA DENKO K.K.
To: RESONAC CORPORATION
Reel/Frame 064082/0513 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 22, 2019
From: FUJIKAWA, YOHEI
To: SHOWA DENKO K.K.
Reel/Frame 048958/0818 →