Protection film and electronic device including the same
A protection film for an electronic device includes an adhesive layer including a first surface to which an electronic device is attached, and a film layer which contacts a second surface of the adhesive layer and includes at least one member, where a thickness of the adhesive layer satisfies Inequality 1: z ≤(5.1 x +57.4)·ln( y )−(14.7 x +140.5) where z is the thickness of the adhesive layer in terms of micrometers, x is a modulus of a member of the film layer which directly contacts the adhesive layer in terms of gigapascals, and y is a total thickness of the film layer in terms of micrometers.
1. A protection film for an electronic device, the protection film comprising:
an adhesive layer including a first surface to which an electronic device is attached; and
a film layer which contacts a second surface of the adhesive layer and comprises at least one member,
wherein the thickness of the adhesive layer satisfies Inequality 1:
z ≤(5.1 x +57.4)·ln( y )−(14.7 x +140.5)
where z is a thickness of the adhesive layer in terms of micrometers, x is a modulus of a member of the film layer which directly contacts the adhesive layer in terms of gigapascals, and y is a total thickness of the film layer in terms of micrometers.
2. The protection film of claim 1 , wherein the thickness of the adhesive layer is 100 micrometers or more.
3. The protection film of claim 1 , wherein the adhesive layer comprises a pressure sensitive adhesive, and the pressure sensitive adhesive has a modulus of about 10 megapascals or less at a temperature of −20 degrees Celsius or lower.
4. The protection film of claim 1 , wherein the film layer further comprises a base layer which directly contacts the adhesive layer.
5. The protection film of claim 4 , wherein the base layer has a modulus of about 2 gigapascals to about 9 gigapascals.
6. The protection film of claim 4 , wherein the base layer has a thickness of about 25 micrometers to 75 micrometers.
7. The protection film of claim 4 , comprising a bent region in which a contact surface between the base layer and the adhesive layer has a radius of curvature of about 0.5 R or more.
8. The protection film of claim 7 , wherein the radius of curvature is about 0.8 R to about 1.0 R.
9. The protection film of claim 1 , wherein the film layer further comprises a base layer and a functional layer, and a surface of the base layer directly contacts the adhesive layer.
10. The protection film of claim 9 , wherein the functional layer comprises a hard-coating layer which directly contacts the second surface of the base layer and an anti-fingerprint coating layer which directly contacts the hard-coating layer.
11. The protection film of claim 9 , wherein the film layer further comprises a primer layer which directly contacts the second surface of the base layer and a hard-coating layer which directly contacts the primer layer.
12. The protection film of claim 1 , wherein the adhesive layer comprises a first region in which tensile stress acts and a second region in which compressive stress acts.
13. The protection film of claim 12 , wherein the first region and the second region have different thicknesses from each other.
14. The protection film of claim 12 , wherein the second region contacts the film layer.
15. The protection film of claim 12 , comprising a folding region, wherein the tensile stress of the first region increases as a distance to the folding region decreases, and the compressive stress of the second region increases as the distance to the folding region decreases.
16. An electronic device comprising:
a body which comprises at least one member; and
a protection film which is attached onto at least a portion of a surface of the body,
wherein the protection film comprises an adhesive layer which comprises a first surface attached to the surface of the body and a film layer which contacts a second surface of the adhesive layer and comprises at least one member, and a thickness of the adhesive layer satisfies Inequality 2:
z ≤(5.1 x +57.4)·ln( y )−(14.7 x +140.5) (2)
where z is the thickness of the adhesive layer in terms of micrometers, x is a modulus of a member of the film layer which directly contacts the adhesive layer in terms of gigapascals, and y is a total thickness of the film layer in terms of micrometers.
17. The electronic device of claim 16 , wherein a member of the body to which the protection film is directly attached has a modulus of 50 gigapascals or more.
18. The electronic device of claim 16 , wherein the body comprises a foldable display device.
19. The electronic device of claim 18 , wherein the foldable display device comprises an organic light emitting display panel.
20. The electronic device of claim 19 , wherein the foldable display device comprises at least one folding region, and the protection film is disposed to overlap the at least one folding region.
21. The electronic device of claim 19 , wherein the organic light emitting display panel comprises:
a substrate;
an organic light emitting layer which is disposed on the substrate; and
a cover glass which is disposed on the organic light emitting layer,
wherein the cover glass contacts the adhesive layer.
22. The electronic device of claim 16 , comprising a folding region, wherein the adhesive layer further comprises inclined side surfaces.
23. The electronic device of claim 22 , wherein an angle defined by a tangent to a side surface of the film layer and an inclined side surface of the inclined side surfaces is about 2 degrees to about 25 degrees.