Solder sealing in high-power laser devices

1. A laser apparatus comprising:

a beam emitter having first and second opposed surfaces;

a first electrode mount disposed proximate the first surface of the beam emitter;

a thermal bonding layer disposed at an interface between the first electrode mount and the first surface of the beam emitter, the thermal bonding layer (i) improving thermal conduction between the first electrode mount and the beam emitter, (ii) comprising a thermal bonding material, and (iii) being in direct mechanical contact with the beam emitter and the first electrode mount; and

disposed along the interface between the first electrode mount and the first surface of the beam emitter, a sealing material for preventing or retarding movement of the thermal bonding material out of the thermal bonding layer,

wherein the sealing material and the thermal bonding material (i) comprise different materials and (ii) are substantially mutually insoluble, such that no more than 10% of one of the sealing material or the thermal bonding material is soluble in the other.

2. The laser apparatus of claim 1 , wherein the sealing material is electrically conductive.

3. The laser apparatus of claim 1 , wherein the sealing material is in direct mechanical contact with an external surface of the beam emitter that does not face toward the first electrode mount.

4. The laser apparatus of claim 1 , wherein the thermal bonding layer consists of a single thermal bonding material.

5. The laser apparatus of claim 1 , further comprising an electrically conductive housing disposed below and electrically insulated from the first electrode mount.

6. The laser apparatus of claim 5 , wherein the housing defines therein one or more channels for the flow of cooling liquid therethrough.

7. The laser apparatus of claim 5 , further comprising an electrically insulating layer disposed between the housing and the first electrode mount.

8. A laser apparatus comprising:

a beam emitter having first and second opposed surfaces;

a first electrode mount disposed proximate the first surface of the beam emitter;

a thermal bonding layer disposed at an interface between the first electrode mount and the first surface of the beam emitter, the thermal bonding layer (i) improving thermal conduction between the first electrode mount and the beam emitter, (ii) comprising a thermal bonding material, and (iii) being in direct mechanical contact with the beam emitter and the first electrode mount; and

disposed along the interface between the first electrode mount and the first surface of the beam emitter, a sealing material for preventing or retarding movement of the thermal bonding material out of the thermal bonding layer,

wherein (i) no portion of the sealing material is disposed between the beam emitter and the first electrode mount, and (ii) the sealing material and the thermal bonding material comprise different materials.

9. The laser apparatus of claim 8 , wherein the sealing material is electrically conductive.

10. A laser apparatus comprising:

a beam emitter having first and second opposed surfaces;

a first electrode mount disposed proximate the first surface of the beam emitter;

a thermal bonding layer disposed at an interface between the first electrode mount and the first surface of the beam emitter, the thermal bonding layer (i) improving thermal conduction between the first electrode mount and the beam emitter, (ii) comprising a thermal bonding material, and (iii) being in direct mechanical contact with the beam emitter and the first electrode mount; and

disposed along the interface between the first electrode mount and the first surface of the beam emitter, a sealing material for preventing or retarding movement of the thermal bonding material out of the thermal bonding layer,

wherein (i) the sealing material is in direct mechanical contact with an external surface of the first electrode mount that is not in contact with the thermal bonding layer, and (ii) the sealing material and the thermal bonding material comprise different materials.

11. The laser apparatus of claim 10 , wherein the sealing material is electrically conductive.

12. A laser apparatus comprising:

a beam emitter having first and second opposed surfaces;

a first electrode mount disposed proximate the first surface of the beam emitter;

a thermal bonding layer disposed at an interface between the first electrode mount and the first surface of the beam emitter, the thermal bonding layer (i) improving thermal conduction between the first electrode mount and the beam emitter, (ii) comprising a thermal bonding material, and (iii) being in direct mechanical contact with the beam emitter and the first electrode mount; and

disposed along the interface between the first electrode mount and the first surface of the beam emitter, a sealing material for preventing or retarding movement of the thermal bonding material out of the thermal bonding layer,

wherein (i) the sealing material is in direct mechanical contact with an external surface of the first electrode mount that does not face toward the beam emitter, and (ii) the sealing material and the thermal bonding material comprise different materials.

13. The laser apparatus of claim 12 , wherein the sealing material is electrically conductive.

14. A laser apparatus comprising:

a beam emitter having first and second opposed surfaces;

a first electrode mount disposed proximate the first surface of the beam emitter;

a thermal bonding layer disposed at an interface between the first electrode mount and the first surface of the beam emitter, the thermal bonding layer (i) improving thermal conduction between the first electrode mount and the beam emitter, (ii) comprising a thermal bonding material, and (iii) being in direct mechanical contact with the beam emitter and the first electrode mount;

disposed along the interface between the first electrode mount and the first surface of the beam emitter, a sealing material for preventing or retarding movement of the thermal bonding material out of the thermal bonding layer;

a second electrode mount (i) disposed proximate the second surface of the beam emitter and (ii) electrically insulated from the first electrode mount except for any electrical connection through the beam emitter;

a second thermal bonding layer disposed along at least a portion of an interface between the second electrode mount and the second surface of the beam emitter, the second thermal bonding layer (i) improving thermal conduction between the second electrode mount and the beam emitter, and (ii) comprising a second thermal bonding material; and

disposed along at least a portion of the interface between the second electrode mount and the second surface of the beam emitter, a second sealing material for preventing or retarding movement of the second thermal bonding material out of the second thermal bonding layer,

wherein the sealing material and the thermal bonding material comprise different materials.

15. The laser apparatus of claim 14 , wherein a melting point of the sealing material is higher than a melting point of the thermal bonding material.

16. The laser apparatus of claim 14 , wherein the thermal bonding material comprises indium.

17. The laser apparatus of claim 14 , wherein the sealing material comprises at least one of copper, aluminum, nickel, or chromium.

18. The laser apparatus of claim 14 , wherein the second thermal bonding material and the thermal bonding material comprise different materials.

19. The laser apparatus of claim 14 , wherein the beam emitter comprises a diode bar configured to emit a plurality of discrete beams.

20. The laser apparatus of claim 14 , wherein the sealing material is electrically conductive.