IP Library › Assignment 063311/0885
Patent Assignment
Reel/Frame 063311/0885

Merger

Recorded: 2023-04-13 Pages: 5
Assignor
TERADIODE, INC.
Executed: 2023-03-22
Assignee
PANASONIC CORPORATION OF NORTH AMERICA
TWO RIVERFRONT PLAZA, NEWARK, NEW JERSEY, 07102
Covered Properties (4)
Solder Sealing in High-Power Laser Devices
Patent: 9,843,164 →
Application: 15/006,733 →
Publication: US 2016/0218483
Solder Sealing in High-Power Laser Devices
Application: 15/807,824 →
Publication: US 2018/0069377
Solder Sealing in High-Power Laser Devices
Application: 16/396,926 →
Publication: US 2019/0326724
Solder Sealing in High-Power Laser Devices
Application: 16/813,893 →
Publication: US 2020/0280166
Related Assignments (5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 13, 2016
From: TAYEBATI, PARVIZ; DEUTSCH, MICHAEL
To: TERADIODE, INC.
Reel/Frame 038266/0440 →
Assignment of Assignor's Interest Nov 9, 2017
From: TAYEBATI, PARVIZ; DEUTSCH, MICHAEL
To: TERADIODE, INC.
Reel/Frame 044080/0408 →
Assignment of Assignor's Interest Mar 10, 2020
From: TAYEBATI, PARVIZ; DEUTSCH, MICHAEL
To: TERADIODE, INC.
Reel/Frame 052062/0360 →
Assignment of Assignor's Interest Nov 1, 2021
From: TAYEBATI, PARVIZ; DEUTSCH, MICHAEL
To: TERADIODE, INC.
Reel/Frame 057976/0888 →
Assignment of Assignor's Interest Nov 14, 2024
From: PANASONIC CORPORATION OF NORTH AMERICA
To: WBC PHOTONICS, INC.
Reel/Frame 069361/0616 →