Solder sealing in high-power laser devices

1. A wavelength beam combining laser system comprising:

a beam emitter configured to emit a plurality of discrete beams and having first and second opposed surfaces;

focusing optics for focusing the plurality of beams toward a dispersive element;

the dispersive element for receiving and dispersing the received focused beams;

a partially reflective output coupler positioned to receive the dispersed beams, transmit a first portion of the dispersed beams therethrough as a multi-wavelength output beam, and reflect a second portion of the dispersed beams back toward the dispersive element;

a first electrode mount disposed proximate the first surface of the beam emitter;

a second electrode mount (i) disposed proximate the second surface of the beam emitter and (ii) electrically insulated from the first electrode mount except for any electrical connection through the beam emitter;

a thermal bonding layer disposed at an interface between the first electrode mount and the first surface of the beam emitter, the thermal bonding layer (i) improving thermal conduction between the first electrode mount and the beam emitter, (ii) comprising a thermal bonding material, and (iii) being in direct mechanical contact with the beam emitter and the first electrode mount; and

disposed along the interface between the first electrode mount and the first surface of the beam emitter, a sealing material for preventing or retarding movement of the thermal bonding material out of the thermal bonding layer,

wherein the sealing material and the thermal bonding material comprise different materials.

2. The laser system of claim 1 , wherein the dispersive element comprises a diffraction grating.

3. The laser system of claim 1 , wherein the beam emitter comprises a diode bar.

4. The laser system of claim 1 , wherein the sealing material and the thermal bonding material are substantially mutually insoluble, such that no more than 10% of one of the sealing material or the thermal bonding material is soluble in the other.

5. The laser system of claim 1 , wherein a melting point of the sealing material is higher than a melting point of the thermal bonding material.

6. The laser system of claim 1 , wherein the thermal bonding material comprises indium.

7. The laser system of claim 1 , wherein no portion of the sealing material is disposed between the beam emitter and the first electrode mount.

8. The laser system of claim 1 , wherein the sealing material comprises at least one of copper, aluminum, nickel, or chromium.

9. The laser system of claim 1 , wherein the sealing material is electrically conductive.

10. The laser system of claim 1 , wherein the sealing material is in direct mechanical contact with an external surface of the first electrode mount that is not in contact with the thermal bonding layer.

11. The laser system of claim 1 , wherein the sealing material is in direct mechanical contact with an external surface of the first electrode mount that does not face toward the beam emitter.

12. The laser system of claim 1 , further comprising a second thermal bonding layer disposed along at least a portion of an interface between the second electrode mount and the second surface of the beam emitter, the second thermal bonding layer (i) improving thermal conduction between the second electrode mount and the beam emitter, (ii) comprising a second thermal bonding material, and (iii) being in direct mechanical contact with the beam emitter and the second electrode mount.

13. The laser system of claim 12 , further comprising, disposed along at least a portion of the interface between the second electrode mount and the second surface of the beam emitter, a second sealing material for preventing or retarding movement of the second thermal bonding material out of the second thermal bonding layer.

14. The laser system of claim 12 , wherein the second thermal bonding material and the thermal bonding material comprise different materials.

15. The laser system of claim 1 , wherein the thermal bonding layer consists of the thermal bonding material.

16. The laser system of claim 1 , further comprising an electrically conductive housing disposed below and electrically insulated from the first electrode mount.

17. The laser system of claim 16 , wherein the housing defines therein one or more channels for flow of cooling liquid therethrough.

18. The laser system of claim 16 , further comprising an electrically insulating layer disposed between the housing and the first electrode mount.

19. A wavelength beam combining laser system comprising:

a beam emitter configured to emit a plurality of discrete beams and having first and second opposed surfaces;

focusing optics for focusing the plurality of beams toward a dispersive element;

the dispersive element for receiving and dispersing the received focused beams;

a partially reflective output coupler positioned to receive the dispersed beams, transmit a first portion of the dispersed beams therethrough as a multi-wavelength output beam, and reflect a second portion of the dispersed beams back toward the dispersive element;

a first electrode mount disposed proximate the first surface of the beam emitter;

a thermal bonding layer disposed at an interface between the first electrode mount and the first surface of the beam emitter, the thermal bonding layer (i) improving thermal conduction between the first electrode mount and the beam emitter, (ii) comprising a thermal bonding material, and (iii) being in direct mechanical contact with the beam emitter and the first electrode mount; and

disposed along the interface between the first electrode mount and the first surface of the beam emitter, a sealing material for preventing or retarding movement of the thermal bonding material out of the thermal bonding layer,

wherein (i) the sealing material is in direct mechanical contact with an external surface of the beam emitter that does not face toward the first electrode mount, and (ii) the sealing material and the thermal bonding material comprise different materials.

20. The laser system of claim 19 , wherein the sealing material and the thermal bonding material are substantially mutually insoluble, such that no more than 10% of one of the sealing material or the thermal bonding material is soluble in the other.

21. A wavelength beam combining laser system comprising:

a beam emitter configured to emit a plurality of discrete beams and having first and second opposed surfaces;

focusing optics for focusing the plurality of beams toward a dispersive element;

the dispersive element for receiving and dispersing the received focused beams;

a partially reflective output coupler positioned to receive the dispersed beams, transmit a first portion of the dispersed beams therethrough as a multi-wavelength output beam, and reflect a second portion of the dispersed beams back toward the dispersive element;

a first electrode mount disposed proximate the first surface of the beam emitter;

a thermal bonding layer disposed at an interface between the first electrode mount and the first surface of the beam emitter, the thermal bonding layer (i) improving thermal conduction between the first electrode mount and the beam emitter, (ii) comprising a thermal bonding material, and (iii) being in direct mechanical contact with the beam emitter and the first electrode mount; and

disposed along the interface between the first electrode mount and the first surface of the beam emitter, a sealing material for preventing or retarding movement of the thermal bonding material out of the thermal bonding layer,

wherein (i) the thermal bonding layer is unexposed and surrounded on all sides by the sealing material, the first electrode mount, and the beam emitter, and (ii) the sealing material and the thermal bonding material comprise different materials.

22. The laser system of claim 21 , wherein the sealing material and the thermal bonding material are substantially mutually insoluble, such that no more than 10% of one of the sealing material or the thermal bonding material is soluble in the other.