Semiconductor package system

1. A semiconductor package system comprising:

a substrate;

a first semiconductor package on the substrate;

a second semiconductor package on the substrate, the second semiconductor package being spaced apart from the first semiconductor package in a first direction;

a first passive element on the substrate, the first passive element being spaced apart from the first semiconductor package in a second direction crossing the first direction;

a heat dissipation structure on the first semiconductor package, the second semiconductor package, and the first passive element; and

a first heat conduction layer between the first semiconductor package and the heat dissipation structure,

a sum of a height of the first semiconductor package and a thickness of the first heat conduction layer being greater than a height of the first passive element, and

the height of the first semiconductor package being greater than a height of the second semiconductor package.

2. The semiconductor package system of claim 1 , further comprising:

a second heat conduction layer provided between the second semiconductor package and the heat dissipation structure, wherein

the thickness of the first heat conduction layer is less than a thickness of the second heat conduction layer.

3. The semiconductor package system of claim 2 , wherein the first heat conduction layer and the second heat conduction layer are in physical contact with the heat dissipation structure.

4. The semiconductor package system of claim 1 , wherein

the first semiconductor package includes a first substrate, a first semiconductor chip, and a first molding layer, and

the first semiconductor chip is a system-on-chip.

5. The semiconductor package system of claim 4 , wherein the first semiconductor package further includes a first thermal conductive structure on the first molding layer.

6. The semiconductor package system of claim 5 , wherein an upper surface of the first molding layer is at a lower level than an upper surface of the second semiconductor package.

7. The semiconductor package system of claim 1 , wherein

the second semiconductor package includes a second substrate, a second semiconductor chip, a second molding layer, and a second thermal conductive structure on the second molding layer.

8. The semiconductor package system of claim 1 , further comprising:

a ground pattern on an upper surface of the substrate; and

a conductive adhesive pattern between the ground pattern and the heat dissipation structure, wherein

the heat dissipation structure includes a body portion and a leg portion,

the body portion extends in parallel to the upper surface of the substrate,

the leg portion is connected to the body portion,

the leg portion is between the substrate and the body portion, and

the heat dissipation structure is electrically connected to the ground pattern through the conductive adhesive pattern.

9. The semiconductor package system of claim 8 , wherein the thickness of the first heat conduction layer is less than a thickness of the conductive adhesive pattern.

10. The semiconductor package system of claim 1 , further comprising:

a board on a lower surface of the substrate;

conductive terminals connected to the substrate and the board; and

a second passive element on a lower surface of the board, wherein

a height of the second passive element is greater than the height of the first semiconductor package.

11. The semiconductor package system of claim 10 , further comprising:

first connection terminals between the substrate and the first semiconductor package, wherein

a pitch of the first connection terminals is smaller than a pitch of the conductive terminals.

12. A semiconductor package system comprising:

a substrate;

a first semiconductor package on an upper surface of the substrate, the first semiconductor package including a first semiconductor chip, the first semiconductor chip including one or more logic circuits;

a second semiconductor package on the upper surface of the substrate, the second semiconductor package being spaced apart from the first semiconductor package in a first direction;

a passive element on the upper surface of the substrate, the passive element being spaced apart from the first semiconductor package in a second direction crossing the first direction;

a heat dissipation structure on the first semiconductor package, the second semiconductor package, and the passive element; and

a plurality of heat conduction layers that are each in physical contact with a lower surface of the heat dissipation structure,

the plurality of heat conduction layers including a first heat conduction layer on an upper surface of the first semiconductor package, and the first heat conduction layer having a thinnest thickness among the plurality of heat conduction layers.

13. The semiconductor package system of claim 12 , wherein a height of the first semiconductor package is greater than a height of the second semiconductor package.

14. The semiconductor package system of claim 13 , wherein

the first semiconductor package further includes a first substrate, a first molding layer, and a first thermal conductive structure,

the first semiconductor chip is on the first substrate,

the first molding layer is configured to cover the first semiconductor chip, and

the first thermal conductive structure is on the first molding layer.

15. The semiconductor package system of claim 12 , wherein a sum of a height of the first semiconductor package and a thickness of the first heat conduction layer is greater than a height of the passive element.

16. The semiconductor package system of claim 12 , wherein the plurality of heat conduction layers further include a second heat conduction layer on an upper surface of the second semiconductor package.

17. The semiconductor package system of claim 16 , wherein the second semiconductor package includes a power management chip or a memory chip.

18. A semiconductor package system comprising:

a substrate;

a first semiconductor package on the substrate, the first semiconductor package including a first semiconductor chip, the first semiconductor chip including one or more logic circuits;

a second semiconductor package on the substrate;

a passive element on the substrate;

a heat dissipation structure on the first semiconductor package, the second semiconductor package, and the passive element;

a first heat conduction layer on the first semiconductor package, the first heat conduction layer in physical contact with the heat dissipation structure; and

a second heat conduction layer on the second semiconductor package, the second heat conduction layer in physical contact with the heat dissipation structure,

a thickness of the first heat conduction layer being smaller than a thickness of the second heat conduction layer,

an upper surface of the first heat conduction layer being provided at a level higher than an upper surface of the passive element, and

the upper surface of the first heat conduction layer being at a substantially same level with an upper surface of the second heat conduction layer, wherein

the second semiconductor package includes a second substrate, a second semiconductor chip, and a second molding layer,

the substrate is spaced apart from the second substrate,

the upper surface of the first heat conduction layer is at a substantially same level with a lower surface of the heat dissipation structure, and

the second semiconductor chip is a different type of semiconductor chip than the first semiconductor chip.

19. The semiconductor package system of claim 18 , further comprising:

a third semiconductor package on the substrate; and

a third heat conduction layer on the third semiconductor package, wherein

the third heat conduction layer is in physical contact with the heat dissipation structure, and

the thickness of the first heat conduction layer is smaller than a thickness of the third heat conduction layer.

20. The semiconductor package system of claim 12 , further comprising:

a ground pattern on an upper surface of the substrate; and

a conductive adhesive pattern between the ground pattern and the heat dissipation structure, wherein

the heat dissipation structure includes a body portion and a leg portion,

the body portion extends in parallel to the upper surface of the substrate,

the leg portion is connected to the body portion,

the leg portion is between the substrate and the body portion, and

the heat dissipation structure is electrically connected to the ground pattern through the conductive adhesive pattern.