IP Library Granted Patent US 11,040,478
Granted Patent B2
US 11,040,478 · App. 16/400,038 · Granted Jun 22, 2021

Mold changing apparatus

Inventor: Yu-Hui Chen (New Taipei, TW)
Assignee: KING YUAN FU PACKAGING CO., LTD.
B29C51/36B29C51/428
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,040,478
App. No.
16/400,038
Granted
Jun 22, 2021
Kind
B2
Abstract

A molding changing apparatus having a holder, a cooling plate, and a mold set coupled to the cooling plate is disclosed. The cooling plate has at least one connecting pin disposed on the surface which is reverse to the surface where the mold set is disposed, and the holder has at least one pneumatic pin receptacle disposed thereon. The connecting pin of the cooling plate can be inserted into the connecting hole of the pneumatic pin receptacle of the holder, and the connecting pin is fastened by the pneumatic pin receptacle, thereby connecting the mold set and the cooling plate to the holder. Through the use of the connecting pin and the pneumatic pin receptacle, the mold set and the cooling plate on the holder can be changed rapidly and the efficiency of the plastic vacuum forming with mold sets is enhanced.

Claims (14)

1. A mold changing apparatus comprising:

a holder, comprising an accommodating space;

at least one pneumatic pin receptacle, disposed in the accommodating space of the holder and comprising a connecting hole;

at least one connecting pin, wherein the connecting pin is to be inserted into the connecting hole of the pneumatic pin receptacle, and the pneumatic pin receptacle fastens or releases the connecting pin;

a cooling plate, coupled to the connecting pin, wherein the cooling plate is held firmly to the holder by the connecting pin and the pneumatic pin receptacle and covers the accommodating space of the holder; and

a mold set coupled to the cooling plate.

2. The mold changing apparatus of claim 1 , wherein the pneumatic pin receptacle comprises a body, a movable part, a plurality of elastic units and a plurality of spheres, wherein the body comprises an extension tube, the movable part comprises a protrusion ring for accommodating part of the extension tube, the elastic units are disposed between the body and the movable part, and the spheres are disposed between the protrusion ring and the extension tube.

3. The mold changing apparatus of claim 2 , wherein the pneumatic pin receptacle comprises an air-pressure chamber and the movable part is disposed therein, wherein the air-pressure chamber is fluidly connected to a pump, and the pump is used to change the air pressure inside the air-pressure chamber to make the movable part move along the air-pressure chamber and relative to the body.

4. The mold changing apparatus of claim 2 , wherein the connecting pin comprises a protruding unit, wherein the protruding unit of the connecting pin is fastened by the spheres to fasten the connecting pin to the pneumatic pin receptacle.

5. The mold changing apparatus of claim 4 , wherein the extension tube protrudes from the body, and a plurality of through holes are disposed on the extension tube protruding out of the body, wherein the spheres fasten the protruding unit via the through holes of the extension tube.

6. The mold changing apparatus of claim 1 , further comprising a pump fluidly connected to the pneumatic pin receptacle, wherein the pump is used to control the connection between the pneumatic pin receptacle and the connecting pin.

7. The mold changing apparatus of claim 1 , wherein an enclosed space is formed between the mold set and the cooling plate, and the cooling plate comprises a plurality of perforations fluidly connecting the enclosed space and the accommodating space of the holder.

8. The mold changing apparatus of claim 7 , wherein the holder is fluidly connected to a pump, and the pump is used to change the air pressure inside the accommodating space and the enclosed space to make a plastic material on the mold set to conform to the surface of the mold set.

9. The mold changing apparatus of claim 1 , wherein the mold set comprises a plurality of molds.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 1, 2019
From: CHEN, YU-HUI
To: KING YUAN FU PACKAGING CO., LTD.
Reel/Frame 049041/0478 →
Priority Claims (1)
TW 107214949 · Nov 2, 2018 · national
Continuity (1)
Related Publication 20200139609A1 · May 7, 2020