On-board radiation sensing apparatus
Systems, methods, and apparatuses for providing on-board electromagnetic radiation sensing using beam splitting in a radiation sensing apparatus. The radiation sensing apparatuses can include a micro-mirror chip including a plurality of light reflecting surfaces. The apparatuses can also include an image sensor including an imaging surface. The apparatuses can also include a beamsplitter unit located between the micro-mirror chip and the image sensor. The beamsplitter unit can include a beamsplitter that includes a partially-reflective surface that is oblique to the imaging surface and the micro-mirror chip. The apparatuses can also include an enclosure configured to enclose at least the beamsplitter and a light source. With the apparatuses, the light source can be attached to a printed circuit board (PCB). Also, the enclosure can include an inner surface that has an angled reflective surface that is configured to reflect light from the light source in a direction towards the beamsplitter.
1. A radiation sensing apparatus, comprising:
a micro-mirror chip comprising a plurality of light reflecting surfaces;
an image sensor comprising an imaging surface;
a beamsplitter unit located between the micro-mirror chip and the image sensor, comprising a beamsplitter that includes a partially-reflective surface that is oblique to the imaging surface and the micro-mirror chip; and
an enclosure, either configured to:
enclose at least the beamsplitter and a light source, the light source being attached to a printed circuit board (PCB), the enclosure comprising an inner surface that comprises an angled reflective surface that is configured to reflect light from the light source in a direction towards the beamsplitter; or
enclose at least the beamsplitter, the beamsplitter and a light source being attached to a printed circuit board (PCB), and the light source being attached to the PCB by a flexible connector;
wherein the enclosure comprises a top wall and an opening with a radiation lens within the opening, the opening is located above the micro-mirror chip such that radiation that passes through the opening and the radiation lens emits onto a plurality of radiation absorption surfaces of the micro-mirror chip.
2. The radiation sensing apparatus of claim 1 , wherein the enclosure is further configured to enclose the image sensor.
3. The radiation sensing apparatus of claim 1 , wherein the image sensor is attached to a PCB.
4. The radiation sensing apparatus of claim 1 , wherein the enclosure is further configured to enclose the micro-mirror chip.
5. The radiation sensing apparatus of claim 1 , wherein the angled reflective surface is a 45-degree reflective surface that is 45 degrees from the imaging surface.
6. The radiation sensing apparatus of claim 5 , wherein the light source emits a center light ray along the z-axis, and wherein the 45-degree reflective surface is configured to reflect the center light ray at a 90-degree angle in a direction towards the beamsplitter.
7. The radiation sensing apparatus of claim 5 , wherein the partially-reflective surface of the beamsplitter is a 45-degree partially-reflective surface that is 45 degrees from the imaging surface and 45 degrees from the micro-mirror chip.
8. The radiation sensing apparatus of claim 1 , wherein the 45-degree partially-reflective surface of the beamsplitter is parallel to the angled reflective surface of the enclosure.
9. The radiation sensing apparatus of claim 1 , wherein the opening traverses the top wall from an exterior surface of the top wall to an interior surface of the top wall.
10. The radiation sensing apparatus of claim 9 , wherein a chamber is formed by the PCB and the interior surfaces of the enclosure.
11. The radiation sensing apparatus of claim 10 , wherein the chamber houses the micro-mirror chip entirely.
12. The radiation sensing apparatus of claim 10 , wherein the micro-mirror chip is partially within the opening of the enclosure and partially within the chamber.
13. The radiation sensing apparatus of claim 1 , wherein the radiation lens is embedded within a cone enclosure.
14. The radiation sensing apparatus of claim 1 , wherein the enclosure comprises a radiation filter within the opening of the enclosure and between the radiation lens and the micro-mirror chip such that radiation that emits from the radiation lens passes through the radiation filter onto the plurality of radiation absorption surfaces of the micro-mirror chip.
15. The radiation sensing apparatus of claim 1 , wherein the beamsplitter is configured to split a light ray to a first light ray and a second light ray, wherein the first light ray reflects from the first beamsplitter towards the plurality of light reflecting surfaces of the micro-mirror chip and the second light ray passes through the beamsplitter towards a sidewall of the enclosure.
16. The radiation sensing apparatus of claim 15 , wherein each light reflecting surface of the plurality of light reflecting surfaces of the micro-mirror chip reflects a light ray that is split at the partially-reflective surface of the beamsplitter to a third light ray and a fourth light ray such that only the third light ray passes through the partially-reflective surface to the imaging surface of the image sensor.
17. A radiation sensing apparatus, comprising:
a micro-mirror chip comprising a plurality of light reflecting surfaces;
an image sensor comprising an imaging surface;
a beamsplitter unit located between the micro-mirror chip and the image sensor, comprising a beamsplitter that includes a partially-reflective surface that is oblique to the imaging surface and the micro-mirror chip; and
a housing including a chamber, the chamber configured to enclose the micro-mirror chip, the image sensor, and the beamsplitter when attached to a printed circuit board (PCB), and the chamber comprising an angled reflective surface that is configured to reflect light from a light source in a direction towards the beamsplitter,
wherein the housing comprises a top wall and an opening, wherein the micro-mirror chip is housed partially within the opening of the housing and partially within the chamber;
wherein the enclosure comprises a top wall and an opening with a radiation lens within the opening, the opening is located above the micro-mirror chip such that radiation that passes through the opening and the radiation lens emits onto a plurality of radiation absorption surfaces of the micro-mirror chip.
18. A radiation sensing apparatus, comprising:
a micro-mirror chip comprising a plurality of light reflecting surfaces;
an image sensor comprising an imaging surface;
a beamsplitter unit located between the micro-mirror chip and the image sensor, comprising a beamsplitter that includes a partially-reflective surface that is oblique to the imaging surface and the micro-mirror chip; and
a housing including a chamber, the chamber configured to enclose the micro-mirror chip, the image sensor, and the beamsplitter when attached to a printed circuit board (PCB), and the chamber comprising an angled reflective surface that is oblique to the imaging surface and the micro-mirror chip and that is configured to reflect light from a light source in a direction towards the beamsplitter;
wherein the housing comprises a top wall and an opening, wherein the micro-mirror chip is housed partially within the opening of the housing and partially within the chamber.
19. A radiation sensing apparatus, comprising:
a micro-mirror chip comprising a plurality of light reflecting surfaces;
an image sensor comprising an imaging surface;
a beamsplitter unit located between the micro-mirror chip and the image sensor, comprising a beamsplitter that includes a partially-reflective surface that is oblique to the imaging surface and the micro-mirror chip; and
an enclosure, either configured to:
enclose at least the beamsplitter and a light source, the light source being attached to a printed circuit board (PCB), the enclosure comprising an inner surface that comprises an angled reflective surface that is configured to reflect light from the light source in a direction towards the beamsplitter; or
enclose at least the beamsplitter, the beamsplitter and a light source being attached to a printed circuit board (PCB), and the light source being attached to the PCB by a flexible connector;
wherein the enclosure comprises a top wall and an opening, wherein a chamber is formed by the PCB and an interior surfaces of the enclosure, wherein the micro-mirror chip is housed partially within the opening of the enclosure and partially within the chamber.
20. A radiation sensing apparatus, comprising:
a micro-mirror chip comprising a plurality of light reflecting surfaces;
an image sensor comprising an imaging surface;
a beamsplitter unit located between the micro-mirror chip and the image sensor, comprising a beamsplitter that includes a partially-reflective surface that is oblique to the imaging surface and the micro-mirror chip; and
an enclosure, either configured to:
enclose at least the beamsplitter and a light source, the light source being attached to a printed circuit board (PCB), the enclosure comprising an inner surface that comprises an angled reflective surface that is configured to reflect light from the light source in a direction towards the beamsplitter; or
enclose at least the beamsplitter, the beamsplitter and a light source being attached to a printed circuit board (PCB), and the light source being attached to the PCB by a flexible connector;
wherein the beamsplitter is configured to split a light ray to a first light ray and a second light ray, wherein the first light ray reflects from the first beamsplitter towards the plurality of light reflecting surfaces of the micro-mirror chip and the second light ray passes through the beamsplitter towards a sidewall of the enclosure.