IP Library Granted Patent US 11,130,845
Granted Patent B2
US 11,130,845 · App. 16/404,269 · Granted Sep 28, 2021

Thermal interface materials including polymeric phase-change materials

Inventors: Dylan J. Boday (Tucson, AZ); Joseph Kuczynski (North Port, FL); Timothy C. Mauldin (San Diego, CA)
Assignee: International Business Machines Corporation
C08G81/021C08F299/0485C08G63/676C08G65/3322C09K5/00C09K5/02C09K5/06H01L23/3737H01L23/4275H01L24/29H01L24/32H01L24/83H01L2224/2919H01L2224/83201
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Quick Facts
Patent No.
US 11,130,845
App. No.
16/404,269
Granted
Sep 28, 2021
Kind
B2
Abstract

In an embodiment, an article of manufacture includes a first component, a second component, and a thermal interface material. The thermal interface material is disposed between the first component and the second component and includes a polymeric phase-change material. In another embodiment, an article of manufacture includes a first component, a second component, and a thermal interface material disposed between the first component and the second component, the thermal interface material including a polymeric phase-change material, the polymeric phase-change material including a block copolymer formed from a diene, the diene formed from a vinyl-terminated fatty acid monomer having a chemical formula C 2 H 4 —R—C(O)OH and an ethylene glycol monomer having a chemical formula C 2n H 4n+2 O n+1 .

Claims (47)

1. An article of manufacture, comprising:

a first component;

a second component; and

a thermal interface material disposed between the first component and the second component, the thermal interface material comprising a polymeric phase-change material comprising a block copolymer formed from a diene, the diene formed from a vinyl-terminated fatty acid monomer and an ethylene glycol monomer.

2. The article of manufacture of claim 1 , wherein the first component comprises a semiconductor die.

3. The article of manufacture of claim 1 , wherein the second component comprises a heat sink.

4. The article of manufacture of claim 1 , wherein:

the vinyl-terminated fatty acid monomer has a chemical formula C 2 H 4 —R—C(O)OH;

the ethylene glycol monomer has a chemical formula C 2n H 4n+2 O n+1 ;

R corresponds to a chain length (x) of at least 8 carbon atoms between a terminal vinyl group and a carbonyl group; and

n is greater than or equal to 1.

5. The article of manufacture of claim 4 , wherein the ethylene glycol monomer comprises ethylene glycol.

6. The article of manufacture of claim 4 , wherein n is 2 or more.

7. The article of manufacture of claim 6 , wherein the ethylene glycol monomer comprises tetraethylene glycol.

8. The article of manufacture of claim 4 , wherein the thermal interface material has a structure represented by:

wherein x is at least 8 carbon atoms and n is greater than or equal to 1.

9. The article of manufacture of claim 1 , wherein the polymeric phase-change material has a melting transition temperature (T m ) in a range of 0° C. to 100° C.

10. The article of manufacture of claim 1 , wherein the polymeric phase-change material has a melting enthalpy in a range of 200 J/g to 400 J/g.

11. The article of manufacture of claim 1 , wherein the polymeric phase-change material has a thermal stability parameter (T d ) of 5% mass loss at a temperature that is in a range of 250° C. to 450° C.

12. The article of manufacture of claim 1 , wherein the polymeric phase-change material has a melting transition temperature (T m ) in a range of 0° C. to 100° C., a melting enthalpy in a range of 200 J/g to 400 J/g, and a thermal stability parameter (T d ) of 5% mass loss at a temperature that is in a range of 250° C. to 450° C.

13. An article of manufacture, comprising:

a first component;

a second component; and

a thermal interface material disposed between the first component and the second component, the thermal interface material comprising a polymeric phase-change material, the polymeric phase-change material comprising a block copolymer formed from a diene, the diene formed from a vinyl-terminated fatty acid monomer having a chemical formula C 2 H 4 —R—C(O)OH and an ethylene glycol monomer having a chemical formula C 2n H 4n+2 O n+1 , wherein:

R corresponds to a chain length (x) of at least 8 carbon atoms between a terminal vinyl group and a carbonyl group; and

n is greater than 2.

14. The article of manufacture of claim 13 , wherein the thermal interface material has a structure represented by:

wherein x is at least 8 carbon atoms and n is greater than 2.

15. The article of manufacture of claim 13 , wherein n is equal to 4.

16. The article of manufacture of claim 13 , wherein the ethylene glycol monomer comprises tetraethylene glycol.

17. The article of manufacture of claim 13 , wherein:

the first component comprises a semiconductor die; and

the second component comprises a heat sink.

18. The article of manufacture of claim 13 , wherein the polymeric phase-change material has one or more of:

a melting transition temperature (T m ) in a range of 0° C. to 100° C.,

a melting enthalpy in a range of 200 J/g to 400 J/g, or

a thermal stability parameter (T d ) of 5% mass loss at a temperature that is in a range of 250° C. to 450° C.

19. An article of manufacture, comprising:

a first component;

a second component; and

a thermal interface material disposed between the first component and the second component, the thermal interface material comprising a polymeric phase-change material, the polymeric phase-change material comprising a block copolymer formed from a diene, the diene formed from a vinyl-terminated fatty acid monomer having a chemical formula C 2 H 4 —R—C(O)OH and an ethylene glycol monomer having a chemical formula C 2n H 4n+2 O n+1 , wherein:

the polymeric phase-change material has one or more of a melting transition temperature (T m ) in a range of 0° C. to 100° C., a melting enthalpy in a range of 200 J/g to 400 J/g, or a thermal stability parameter (T d ) of 5% mass loss at a temperature that is in a range of 250° C. to 450° C.;

R corresponds to a chain length (x) of at least 8 carbon atoms between a terminal vinyl group and a carbonyl group; and

n is greater than or equal to 1.

20. The article of manufacture of claim 19 , wherein:

the first component comprises a semiconductor die; and

the second component includes a heat sink.

Assignments (2)
SECURITY INTEREST Recorded Jan 31, 2020
From: BLUESTEM BRANDS, INC.
To: CERBERUS BUSINESS FINANCE, LLC
Reel/Frame 051690/0046 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 6, 2019
From: BODAY, DYLAN J.; KUCZYNSKI, JOSEPH; MAULDIN, TIMOTHY C.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 049093/0416 →
Continuity (3)
Division 16238735 · Jan 3, 2019
Division 14954409 · Nov 30, 2015
Related Publication 20190256665A1 · Aug 22, 2019