Systems and methods for post-treatment of dry adhesive microstructures
Provided are systems and methods for the post-treatment of dry adhesive microstructures. The microstructures may be post-treated to comprise mushroom-like flaps at their tips to interface with the contact surface. In some aspects, a change in material composition of the microstructures in a dry adhesive may affect mechanical properties to enhance or diminish overall adhesive performance. For example, conductive additives can be added to the material to improve adhesive performance. In other aspects, microstructures comprising conductive material may allow for pre-load engagement sensing systems to be integrated into the microstructures.
1. An integrated engagement sensing system in a gripping surface, comprising:
a backing layer comprising a first material having a first electrical conductivity;
a plurality of microstructure stalks comprising a second material having a second electrical conductivity, wherein an end of each microstructure stalk of said plurality of microstructure stalks is coupled to said backing layer, and wherein each microstructure stalk is configured to couple to at least one neighboring microstructure stalk when said gripping surface is in an engaged state, and wherein said second electrical conductivity is higher than said first electrical conductivity;
a plurality of sensing electrodes disposed on or adjacent to said backing layer, wherein any two sensing electrodes of said plurality of sensing electrodes are configured to measure voltage; and
one or more computer processors operatively coupled to said plurality of sensing electrodes, wherein said one or more computer processors are individually or collectively programmed to (i) apply a current to said backing layer, (ii) receive a reading of said voltage, and (iii) based on said reading of said voltage, determine said engaged state of said gripping surface.
2. The system of claim 1 , wherein a change in said reading of said voltage is indicative of an engaged state.
3. The system of claim 1 , wherein said current is direct current, and said engaged state is determined when each microstructure stalk contacts at least one neighboring microstructure stalk.
4. The system of claim 1 , wherein said current is an alternating current, and said engaged state is determined when each microstructure stalk achieves near contact with at least one neighboring microstructure stalk.
5. The system of claim 1 , wherein said second electrical conductivity is at least one or more magnitudes higher than said first electrical conductivity.
6. The system of claim 1 , wherein said one or more computer processors are individually or collectively programmed to perform a mechanical action on said gripping surface based at least in part on said engaged state.
7. The system of claim 6 , wherein said mechanical action is an application or release of shear load.
8. The system of claim 6 , wherein said mechanical action is an application or release of pre-load.
9. The system of claim 1 , wherein each microstructure stalk of said plurality of microstructure stalks includes a first surface and a second surface, wherein said first surface has a greater surface area than said second surface.
10. The system of claim 1 , wherein each microstructure stalk of said plurality of microstructure stalks comprises post-treated tips.
11. A method for sensing engagement of a gripping surface, comprising:
(a) applying a current to a backing layer of a gripping surface, wherein an end of each microstructure stalk of a plurality of microstructure stalks is attached to said backing layer;
(b) measuring a voltage or current between a first reference point and a second reference point, wherein said first and second reference points are located on said backing layer;
(c) opening a conductive pathway between said first and second reference points through said plurality of microstructure stalks, wherein each microstructure stalk is coupled to at least one neighboring microstructure stalk when said gripping surface is in an engaged state and wherein said plurality of microstructure stalks has a higher conductivity than said backing layer; and
(d) determining, from a change in said voltage or current, said engaged state of said gripping surface.
12. The method of claim 11 , wherein a change in a reading of said voltage or current is indicative of an engaged state.
13. The method of claim 11 , wherein said plurality of microstructure stalks has an electrical conductivity at least one or more magnitudes higher than an electrical conductivity of said backing layer.
14. The method of claim 11 , wherein said current is direct current, and said engaged state is determined when each microstructure stalk contacts at least one neighboring microstructure stalk.
15. The method of claim 11 , wherein said current is an alternating current, and said engaged state is determined when each microstructure stalk achieves near contact with at least one neighboring microstructure stalk.
16. The method of claim 11 , further comprising performing a mechanical action on said gripping surface based at least in part on said engaged state.
17. The method of claim 16 , wherein said mechanical action is an application or release of shear load.
18. The method of claim 16 , wherein said mechanical action is an application or release of pre-load.
19. The method of claim 11 , wherein each microstructure stalk of said plurality of microstructure stalks includes a first surface and a second surface, wherein said first surface has a greater surface area than said second surface.
20. The method of claim 11 , wherein each microstructure stalk of said plurality of microstructure stalks comprises post-treated tips.