Optical system and method of manufacturing the same
An optical system and a method of manufacturing an optical system are provided. The optical system includes a carrier, a light emitter, a light receiver, a block structure and an encapsulant. The light emitter is disposed on the carrier. The light receiver is disposed on the carrier and physically spaced apart from the light emitter. The light receiver has a light detecting area. The block structure is disposed on the carrier. The encapsulant is disposed on the carrier and covers the light emitter, the light receiver and the block structure. The encapsulant has a recess over the block structure.
1. An optical system, comprising:
a carrier;
a light emitter disposed on the carrier;
a light receiver disposed on the carrier and physically spaced apart from the light emitter, the light receiver having a light detecting area on a top surface of the light receiver;
a block structure disposed on the carrier and configured to block light; and
an encapsulant disposed on the carrier and covering the light emitter, the light receiver and at least a portion of the block structure,
wherein the encapsulant has a recess over the block structure.
2. The optical system of claim 1 , wherein the block structure is disposed across a portion of the light receiver.
3. The optical system of claim 1 , wherein the block structure covers at least a portion of a sidewall of the light receiver.
4. The optical system of claim 1 , wherein the light receiver is electrically connected to the carrier through a conductive wire, and the block structure is disposed across the conductive wire.
5. The optical system of claim 1 , wherein a top surface of the block structure is substantially coplanar with a bottom surface of the recess of the encapsulant.
6. The optical system of claim 1 , wherein a top surface of the block structure is spaced apart from a bottom surface of the recess of the encapsulant.
7. The optical system of claim 1 , wherein the block structure is exposed from the recess of the encapsulant.
8. The optical system of claim 7 , wherein at least a portion of a sidewall of the recess of the encapsulant is defined by the block structure.
9. The optical system of claim 1 , wherein the block structure has a top portion in contact with a bottom surface of the recess of the encapsulant.
10. The optical system of claim 1 , wherein a bottom surface of the recess of the encapsulant is higher than the light detecting area of the light receiver.
11. The optical system of claim 1 , wherein a bottom surface of the recess of the encapsulant is lower than the light detecting area of the light receiver.
12. The optical system of claim 1 , wherein the block structure is formed of silicon or epoxy.
13. An optical system, comprising:
a carrier;
a light emitter disposed on the carrier;
a light receiver disposed on the carrier and physically spaced apart from the light emitter, the light receiver having a light detecting area on a top surface of the light receiver;
an opaque material disposed between the light emitter and the light receiver, the opaque material has a curved surface; and
an encapsulant disposed on the carrier and covering the light emitter and at least a portion of the opaque material,
wherein the encapsulant has a recess over a top portion of the opaque material and the curved surface of the opaque material is at or adjacent to the top portion of the opaque material.
14. The optical system of claim 13 , wherein a top surface of the opaque material is substantially coplanar with the bottom surface of the recess.
15. The optical system of claim 13 , wherein a top surface of the opaque material is spaced apart from the bottom surface of the recess of the encapsulant.
16. The optical system of claim 13 , wherein the opaque material is exposed from the recess of the encapsulant.
17. An method of manufacturing an optical system, comprising:
(a) providing a carrier having a light emitter and a light receiver;
(b) forming an encapsulant on the carrier to cover the light emitter and the light receiver; and
(c) forming a recess on the encapsulant, wherein the recess ends before the carrier.
18. The method of claim 17 , before operation (b), further comprising forming a block structure on the carrier and between the light emitter and the light receiver, wherein the block structure is configured to block light.
19. The method of claim 18 , wherein the block structure is formed by dispensing an opaque material on the carrier.
20. The method of claim 18 , wherein in operation (c), further comprising removing a portion of the block structure.