IP Library Granted Patent US 10,769,340
Granted Patent B2
US 10,769,340 · App. 16/411,209 · Granted Sep 8, 2020

Automatic moving of probe locations for parasitic extraction

Inventors: Sridhar Srinivasan (Tualatin, OR); Yi-Ting Lee (Zhubei, TW); Patrick D. Gibson (Tualatin, OR); Padmaja Susarla (McLean, VA); Alex Thompson (Tigard, OR)
Assignee: Mentor Graphics Corporation
G06F30/39
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Quick Facts
Patent No.
US 10,769,340
App. No.
16/411,209
Granted
Sep 8, 2020
Kind
B2
Abstract

Probe location candidates for parasitic extraction are identified from geometric elements on a probe layer. The probe layer is a physical layer of a layout design for a circuit design predetermined for placing one or more new probes. The probe location candidates are geometric elements on the probe layer within a boundary of an area having a predetermined size and covering an original probe location or having a distance from the original probe location less than a predetermined value. Moreover, the probe location candidates are conductively connected to the original probe location. One or more new probe locations on the probe location candidates are selected based on predetermined criteria. From the layout design, a parasitic resistance value for parasitic resistance between a geometric element representing a circuit pad or another device pin and the new one or more probe locations is extracted.

Claims (34)

1. A method, executed by at least one processor of a computer, comprising:

identifying probe location candidates for parasitic extraction from geometric elements on a probe layer, the probe layer being a physical layer of a layout design for a circuit design predetermined for placing one or more new probes, the probe location candidates being geometric elements on the probe layer within a boundary of an area having a predetermined size and covering an original probe location or having a distance from the original probe location less than a predetermined value, the probe location candidates being conductively connected to the original probe location, and the original probe location being on a geometric element representing a device pin of the circuit design on another physical layer;

selecting one or more new probe locations on the probe location candidates based on predetermined criteria; and

extracting, from the layout design, a parasitic resistance value for parasitic resistance between a geometric element representing a circuit pad or another device pin and the new one or more probe locations.

2. The method recited in claim 1 , further comprising:

conducting an ESD analysis based on the parasitic resistance value; and

reporting the parasitic resistance value, the result of the ESD analysis, or both.

3. The method recited in claim 1 , wherein the original probe location is an electrode of a diode, the probe layer is a diffusion layer, and the probe location candidates comprise a guard ring for the diode.

4. The method recited in claim 1 , where the original probe location is a gate electrode of a transistor and the probe layer is a metal layer.

5. The method recited in claim 1 , wherein the area forms a halo surrounding a location on the probe layer corresponding to the original probe location.

6. The method recited in claim 1 , wherein the predetermined criteria comprise distance from the original probe location, distance between the one or more new probe locations, configuration of the one or more new probe locations, or any combination thereof.

7. One or more non-transitory computer-readable media storing computer-executable instructions for causing one or more processors to perform a method, the method comprising:

identifying probe location candidates for parasitic extraction from geometric elements on a probe layer, the probe layer being a physical layer of a layout design for a circuit design predetermined for placing one or more new probes, the probe location candidates being geometric elements on the probe layer within a boundary of an area having a predetermined size and covering an original probe location or having a distance from the original probe location less than a predetermined value, the probe location candidates being conductively connected to the original probe location, and the original probe location being on a geometric element representing a device pin of the circuit design on another physical layer;

selecting one or more new probe locations on the probe location candidates based on predetermined criteria; and

extracting, from the layout design, a parasitic resistance value for parasitic resistance between a geometric element representing a circuit pad or another device pin and the new one or more probe locations.

8. The one or more non-transitory computer-readable media recited in claim 7 , wherein the method further comprises:

conducting an ESD analysis based on the parasitic resistance value; and

reporting the parasitic resistance value, the result of the ESD analysis, or both.

9. The one or more non-transitory computer-readable media recited in claim 7 , wherein the original probe location is an electrode of a diode, the probe layer is a diffusion layer, and the probe location candidates comprise a guard ring for the diode.

10. The one or more non-transitory computer-readable media recited in claim 7 , where the original probe location is a gate electrode of a transistor and the probe layer is a metal layer.

11. The one or more non-transitory computer-readable media recited in claim 7 , wherein the area forms a halo surrounding a location on the probe layer corresponding to the original probe location.

12. The one or more non-transitory computer-readable media recited in claim 7 , wherein the predetermined criteria comprise distance from the original probe location, distance between the one or more new probe locations, configuration of the one or more new probe locations, or any combination thereof.

13. A method, executed by at least one processor of a computer, comprising:

selecting a cell port of a first cell conductively connected to an original probe location as a new probe location, the original probe location being on a geometric element representing a device pin of the circuit design on a physical layer of a layout design of a circuit design or a cell port of a second cell, the second cell being inside the first cell; and

extracting, from the layout design, a parasitic resistance value for parasitic resistance between a geometric element representing a circuit pad or another device pin and the new probe location.

14. The method recited in claim 13 , wherein the method further comprises:

conducting an ESD analysis based on the parasitic resistance value; and

reporting the parasitic resistance value, the result of the ESD analysis, or both.

15. One or more non-transitory computer-readable media storing computer-executable instructions for causing one or more processors to perform a method, the method comprising:

selecting a cell port of a first cell conductively connected to an original probe location as a new probe location, the original probe location being on a geometric element representing a device pin of the circuit design on a physical layer of a layout design of a circuit design or a cell port of a second cell, the second cell being inside the first cell; and

extracting, from the layout design, a parasitic resistance value for parasitic resistance between a geometric element representing a circuit pad or another device pin and the new probe location.

16. The one or more non-transitory computer-readable media recited in claim 15 , wherein the method further comprises:

conducting an ESD analysis based on the parasitic resistance value; and

reporting the parasitic resistance value, the result of the ESD analysis, or both.

Assignments (5)
MERGER AND CHANGE OF NAME Recorded Jun 29, 2021
From: MENTOR GRAPHICS CORPORATION; SIEMENS INDUSTRY SOFTWARE INC.
To: SIEMENS INDUSTRY SOFTWARE INC.
Reel/Frame 056713/0076 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 5, 2019
From: LEE, YI-TING
To: MENTOR GRAPHICS (IRELAND) LIMITED, TAIWAN BRANCH
Reel/Frame 049372/0910 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 5, 2019
From: MENTOR GRAPHICS (IRELAND) LIMITED, TAIWAN BRANCH
To: MENTOR GRAPHICS CORPORATION
Reel/Frame 049372/0942 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 4, 2019
From: SUSARLA, PADMAJA; THOMPSON, ALEX
To: MENTOR GRAPHICS CORPORATION
Reel/Frame 049363/0589 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 4, 2019
From: SRINIVASAN, SRIDHAR; GIBSON, PATRICK D.
To: MENTOR GRAPHICS CORPORATION
Reel/Frame 049363/0947 →