Integral conduit modular lighting
An integral conduit modular lighting system that has a light board having circuitry that is secured to a heat sink with an adhesive layer. The heat sink has a gasket in order to securely connect the lighting system to a preexisting conduit body such that the lighting system withstand a high pressure wash without leakage to the board. The heat sink also has opening that mate with openings of preexisting electrical conduit bodies to provide installation of the modular lighting system to existing electrical conduit bodies.
1. A method of manufacturing a device for illumination comprising:
providing an integral light module comprising an array of light sources arranged on a substrate having a first side and a second side defining opposing planar surfaces;
adhering the substrate to a heat sink with an adhesive layer;
securing a lens to the heat sink against the adhesive layer to seal the substrate from water; and
securing a gasket to a side of the heat sink opposite the substrate.
2. The method of claim 1 , wherein the substrate is a printed circuit board.
3. The method of claim 1 further comprising
pressing the gasket against a conduit body to provide a water tight seal.
4. The method of claim 3 wherein the gasket is made of a flexible material that deforms when the gasket is pressed against the conduit body.
5. The method of claim 3 wherein the array of light sources are light emitting diodes.
6. The method of claim 1 further comprising:
mounting the heat sink to a body to prevent water from entering the conduit body.
7. The method of claim 6 , wherein the heat sink includes at least one mounting hole for securely mounting the integral light module in a fixed position relative to the conduit body.
8. The method of claim 6 , wherein the conduit body comprises an industry standard electrical junction box.
9. The method of claim 6 , wherein when the integral light module is securely mounted to the conduit body the gasket engages the conduit body to prevent water from entering the conduit body.
10. The method of claim 1 , wherein the heat sink includes an opening disposed through the heat sink to provide a pathway to the integral light module.