Method of forming circuit body and circuit body
A conductive portion of a circuit body is formed by performing spraying on a surface of a resin casing. For spraying of the conductive portion, a cold spray method in which metal powder and inert gas are sprayed to an object is used. A circuit component is mounted on the conductive portion. Each terminal portion of the conductive portion is provided with a connector for connection with an external circuit body. An insulating resin is laminated on a surface of the conductive portion. The circuit body is directly formed on the surface of the resin casing by a series of processes described above.
1. A circuit body, comprising:
a resin casing; and
a conductive portion which is formed on a surface of the resin casing, wherein
the conductive portion has
a first layer constituted of an aggregate of metal particles and embedded in the surface of the resin casing, and
a second layer constituted of an aggregate of metal particles and laminated on the first layer,
a density of the second layer is greater than that of the first layer, wherein
the conductive portion in which a particle diameter of the metal particles is 5 μm or more and 50 μm or less is formed in the resin casing mounted on a vehicle,
an insulating resin is laminated at least on the conductive portion, and
a circuit component is mounted on the conductive portion,
wherein the circuit component has
a connector unit to which a wire connected to an auxiliary device is connected, and
a control unit for controlling the auxiliary device.
2. The circuit body according to claim 1 , further comprising:
a terminal portion which is electrically connected to an external circuit body provided on an object to which the resin casing is assembled.
3. The circuit body according to claim 1 , further comprising:
a wire wired on the resin casing, wherein
one end of the wire is electrically connected to the circuit component.
4. The circuit body according to claim 3 , wherein
the wire is a signal circuit for transmitting a signal.