IP Library › Granted Patent US 10,873,352
Granted Patent B2
US 10,873,352 · App. 16/414,962 · Granted Dec 22, 2020

Radio-frequency module and communication apparatus

Inventor: Hiroshi Nishikawa (Kyoto, JP)
Assignee: MURATA MANUFACTURING CO., LTD.
H04B1/0475H03H9/13H03H9/205H03H9/25H03H9/542H03H9/568H03H9/64H04B1/00H05K1/0216H05K1/0243H05K1/181H04B1/18H04B1/52H05K2201/1006H05K2201/10083
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Quick Facts
Patent No.
US 10,873,352
App. No.
16/414,962
Granted
Dec 22, 2020
Kind
B2
Abstract

A radio-frequency module ( 20 ) includes a module substrate ( 50 ) and a filter ( 21 ). The filter ( 21 ) has a sensitive GND electrode and a non-sensitive GND electrode that are connected to an external-connection ground terminal of the module substrate ( 50 ), and parallel-arm resonators. An inductance component generated by the sensitive GND electrode shifts, by a first shift amount, an attenuation pole that corresponds to a parallel-arm resonator and that is formed near a pass band. An inductance component generated by the non-sensitive GND electrode shifts, by a second shift amount, an attenuation pole that corresponds to a parallel-arm resonator and that is formed near the pass band. The first shift amount is larger than the second shift amount, and the distance between the sensitive GND electrode and the external-connection ground terminal is smaller than the distance between the non-sensitive GND electrode and the external-connection ground terminal.

Claims (15)

1. A radio-frequency module comprising:

a module substrate having a first main surface and a second main surface that face away from each other and a plurality of external-connection ground terminals;

a circuit element mounted on the first main surface of the module substrate; and

a switch IC mounted on the second main surface of the module substrate, wherein

the circuit element has

a circuit substrate,

an input electrode and an output electrode that are disposed on the circuit substrate,

a first ground electrode disposed on the circuit substrate and connected to one of the plurality of external-connection ground terminals, and

a second ground electrode disposed on the circuit substrate and connected to one of the plurality of external-connection ground terminals,

the first ground electrode is connected, on the circuit substrate, to an electrode or a wiring line that is disposed on the circuit substrate,

the second ground electrode is not connected to either of the electrode and the wiring line that are disposed on the circuit substrate, and

a distance between the first ground electrode and a first external-connection ground terminal connected to the first ground electrode is smaller than a distance between the second ground electrode and the first external-connection ground terminal connected to the second ground electrode in plan view of the module substrate.

2. A communication apparatus comprising:

the radio-frequency module according to claim 1 ; and

an RF signal processing circuit that processes a radio-frequency signal received from the radio-frequency module.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 17, 2019
From: NISHIKAWA, HIROSHI
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 049208/0341 →
Priority Claims (1)
JP 2016-254496 · Dec 27, 2016 · national
Continuity (2)
Continuation PCTJP2017045403 · Dec 18, 2017
Related Publication 20190273521A1 · Sep 5, 2019