Raised via for terminal connections on different planes

1. A method comprising:

forming a metal layer extending into openings of a dielectric layer to contact a first metal pad and a second metal pad;

forming a component device overlapping a first portion of the metal layer, wherein the forming the component device comprises:

depositing a conductive layer over the metal layer;

depositing an insulator over the conductive layer; and

patterning the conductive layer and the insulator;

forming a raised via on the metal layer, wherein the metal layer has a second portion directly underlying the raised via;

etching the metal layer to separate the first portion and the second portion of the metal layer from each other;

encapsulating the raised via and the component device in an encapsulant;

after the encapsulating, revealing the raised via and a top terminal of the component device in a same process; and

forming a redistribution line connecting the raised via to the component device.

2. The method of claim 1 , wherein the forming the component device further comprises:

after the conductive layer and the insulator are patterned, forming an additional dielectric layer to embed remaining portions of the conductive layer and the insulator therein; and

patterning the additional dielectric layer.

3. The method of claim 2 , wherein the patterning the additional dielectric layer results in the metal layer to be revealed.

4. The method of claim 2 further comprising, before the conductive layer is deposited, forming a bottom terminal on the first portion of the metal layer.

5. The method of claim 1 , wherein the raised via and the top terminal of the component device are revealed in a planarization process, and wherein top surfaces of the raised via, the top terminal, and the encapsulant are coplanar.

6. The method of claim 1 , wherein the metal layer further comprises a third portion extending into an additional opening in the dielectric layer to contact a third metal pad, and the method further comprises:

when the metal layer is etched, removing the third portion of the metal layer to expose the third metal pad; and

forming a bond structure on the third metal pad.

7. The method of claim 1 further comprising planarizing the metal layer to form a planar top surface, wherein the component device and the raised via are formed on the planar top surface.

8. The method of claim 1 , wherein the same process comprises etching the encapsulant.

9. A method comprising:

forming a first dielectric layer to cover edge portions of a first metal pad;

depositing a metal layer, wherein the metal layer comprises a first portion extending into an opening in the first dielectric layer to contact the first metal pad, and a second portion overlapping a portion of the first dielectric layer;

forming a bottom terminal on the first portion of the metal layer;

forming a capacitor overlapping the bottom terminal;

forming a raised via on a third portion of the metal layer;

encapsulating the raised via and the capacitor in an encapsulant;

revealing a top terminal of the capacitor and the raised via; and

electrically connecting the top terminal to the raised via.

10. The method of claim 9 further comprising, after the metal layer is deposited, planarizing the metal layer.

11. The method of claim 9 , wherein the forming the capacitor comprises:

depositing a bottom capacitor electrode, an insulator over the bottom capacitor electrode, and a top capacitor electrode over the insulator layer-by-layer; and

patterning the bottom capacitor electrode, the insulator, and the top capacitor electrode.

12. The method of claim 9 further comprising planarizing the encapsulant until both of the top terminal of the capacitor and the raised via are exposed.

13. The method of claim 9 further comprising etching the metal layer to remove a portion of the metal layer between the capacitor and the raised via.

14. The method of claim 9 further comprising etching-through the encapsulant to reveal a second metal pad.

15. The method of claim 14 further comprising forming a wire bond on the second metal pad.

16. A method comprising:

forming a metal layer comprising a planar top surface, wherein the metal layer comprises a first via portion and a second via portion extending through an underlying dielectric layer to contact a first metal pad and a second metal pad, respectively;

forming a passive device on the metal layer and overlapping the first via portion;

forming a raised via on the metal layer and overlapping the second via portion, wherein the raised via is electrically connected to a bottom terminal of the passive device, and wherein a top end of the passive device and the raised via are at a same level, and the passive device and the raised via have substantially a same height;

etching a portion of the metal layer, with the portion of the metal layer connecting the first via portion to the second via portion being removed in the etching; and

electrically connecting a top terminal of the passive device to the raised via.

17. The method of claim 16 , wherein after the metal layer is etched, the underlying dielectric layer is exposed.

18. The method of claim 16 further comprising forming an encapsulant encapsulating the passive device and the raised via therein.

19. The method of claim 18 further comprising forming a wire bond in the encapsulant.

20. The method of claim 16 further comprising forming a dielectric layer on sidewalls of the passive device, wherein the etching a portion of the metal layer is performed after the dielectric layer is formed.