Device enclosure
An element for an electronic device can include a metal exterior portion including a first material, an interior portion including a second, independently selected material, and an engagement feature formed on a surface defined by the exterior and interior portions. The engagement feature can mechanically engage a material molded to the surface. A method for forming an element for an electronic device can include joining a boss to a member, forming a feature in the member while orienting the member via the boss, and at least partially removing the boss to form the element. An electronic device can include a frame defining an interior volume of the device, a display component, a transparent cover positioned adjacent to the display component, and an encapsulating material at least partially surrounding the display component and joining the display component to the frame.
1. A method of forming an electronic device, comprising:
at least partially surrounding a periphery of a display component with a moldable material, the moldable material extending across a thickness of the periphery;
positioning a transparent cover adjacent to the display component; and
joining the display component and the transparent cover to a frame element;
the frame element at least partially defining an exterior surface of the electronic device.
2. The method of claim 1 , wherein joining includes bonding the frame element to the moldable material with an adhesive.
3. The method of claim 2 , wherein an edge of the transparent cover and an edge of the moldable material are substantially aligned in a plane and the plane is substantially parallel to and spaced apart from a wall of the frame element.
4. The method of claim 3 , wherein the plane is perpendicular to a major surface of the transparent cover.
5. The method of claim 2 , wherein the moldable material surrounds at least a portion of a bottom major surface of the display component.
6. The method of claim 2 , wherein at least partially surrounding the periphery of the display component with the moldable material comprises introducing the display component to the moldable material in moldable form.
7. The method of claim 5 , wherein the moldable material cures around the display component.
8. The method of claim 1 , wherein the moldable material is positioned entirely within an internal volume of the electronic device at least partially defined by the frame element.
9. The method of claim 1 , wherein the moldable material at least partially surrounds one, two, three, or all sides of the display component.