Trilayer Josephson junction structure with small air bridge and no interlevel dielectric for superconducting qubits
A technique relates to a trilayer Josephson junction structure. A dielectric layer is on a base electrode layer that is on a substrate. A counter electrode layer is on the dielectric layer. First and second counter electrodes are formed from the counter electrode layer. First and second dielectric layers are formed from the dielectric layer. First and second base electrodes are formed from base electrode layer. The first counter electrode, first dielectric layer, and first base electrode form a first stack. The second counter electrode, second dielectric layer, and second base electrode form a second stack. A shunting capacitor is between first and second base electrodes. An ILD layer is deposited on the substrate, the first and second counter electrodes, and the first and second base electrodes. A contact bridge connects the first and second counter electrodes. An air gap is formed underneath the contact bridge by removing ILD.
1. A Josephson junction structure, the structure comprising:
a first stack and a second stack formed on a substrate, a portion of the first stack having a different width from and a portion of the second stack, the first stack comprising a first counter electrode formed on a first dielectric layer which is formed on a first base electrode, the second stack comprising a second counter electrode formed on a second dielectric layer which is formed on a second base electrode, the first stack forming a Josephson junction;
a contact bridge comprising a continuous piece of superconducting material, the continuous piece of the superconducting material formed on a top surface of both the first stack and the second stack, the top surface being parallel to the substrate, the contact bridge being in direct contact with the first counter electrode; and
an air gap underneath the contact bridge, a part of the contact bridge directly opposing a part of the substrate, wherein the substrate is not a superconducting material.
2. The structure of claim 1 , wherein the air gap underneath the contact bridge vertically extends between the contact bridge and the substrate.
3. The structure of claim 1 ,
wherein the second counter electrode is disconnected from the first counter electrode.
4. The structure of claim 3 , wherein the first base electrode and the second base electrode are on the substrate.
5. The structure of claim 3 , wherein the contact bridge connect the first counter electrode and the second counter electrode.
6. The structure of claim 3 , wherein the air gap underneath the contact bridge horizontally extends between the first counter electrode and the second counter electrode.
7. The structure of claim 3 , wherein the air gap underneath the contact bridge horizontally extends between the first base electrode and the second base electrode.
8. The structure of claim 3 , wherein the first dielectric layer and the second dielectric layer comprise a material, the material selected from the group consisting of hafnium oxide and aluminum oxide.
9. The structure of claim 3 , wherein the first base electrode and the second base electrode comprise a material, the material selected from the group consisting of niobium, titanium nitride, and aluminum.
10. The structure of claim 3 , wherein the first base electrode and the second base electrode are interdigitated electrodes on the substrate.
11. A method of configuring a Josephson junction structure, the method comprising:
forming a first stack and a second stack formed on a substrate a portion of the first stack having a different width from a portion of the second stack, the first stack forming a Josephson junction, the first stack comprising a first counter electrode formed on a first dielectric layer which is formed on a first base electrode, the second stack comprising a second counter electrode formed on a second dielectric layer which is formed on a second base electrode;
forming a contact bridge comprising a continuous piece of superconducting material, the continuous piece of the superconducting material formed on a top surface of both the first stack and the second stack, the top surface being parallel to the substrate, the contact bridge being in direct contact with the first counter electrode; and
forming an air gap underneath the contact bridge, a part of the contact bridge directly opposing a part of the substrate wherein the substrate is not a superconducting material.
12. The method of claim 11 , wherein the air gap underneath the contact bridge vertically extends between the contact bridge and the substrate.
13. The method of claim 11 ,
wherein the second counter electrode is disconnected from the first counter electrode.
14. The method of claim 13 , wherein the first base electrode and the second base electrode are on the substrate.
15. The method of claim 13 , wherein the contact bridge connect the first counter electrode and the second counter electrode.
16. The method of claim 13 , wherein the air gap underneath the contact bridge horizontally extends between the first counter electrode and the second counter electrode.
17. The method of claim 13 , wherein the air gap underneath the contact bridge horizontally extends between the first base electrode and the second base electrode.
18. The method of claim 13 , wherein the first dielectric layer and the second dielectric layer comprise a material, the material selected from the group consisting of hafnium oxide and aluminum oxide.
19. The method of claim 13 , wherein the first base electrode and the second base electrode comprise a material, the material selected from the group consisting of niobium, titanium nitride, and aluminum.
20. The method of claim 13 , wherein the first base electrode and the second base electrode are interdigitated electrodes on the substrate.