Semiconductor device and method of fabrication
A method of fabricating a semiconductor device, including performing the following steps in the following sequence: providing a substrate including first and second gate regions separated by a trench formed in the substrate and growing a thin oxide layer on each of the first and second gate regions. The method further includes removing the thin oxide layer from the second gate region, and growing a thick oxide layer on the second gate region.
1. A method of fabricating a semiconductor device, said method comprising performing the following steps in the following sequence:
providing a substrate comprising first and second gate regions separated by a trench formed in said substrate wherein said substrate is divided into a first area which includes said first gate region and a first part of said trench and a second area which includes said second gate region and a second part of said trench;
growing a thin oxide layer on each of said first and second gate regions wherein said thin oxide layer has a thickness in the range of 18 A to 32 A;
depositing a polysilicon layer on said thin oxide layer;
depositing a photoresist layer on said layer of polysilicon, exposing said photoresist and removing said photoresist layer from said second area;
removing said polysilicon layer from said second area;
removing said thin oxide layer from said second gate region using a wet etch, wherein said polysilicon layer in said first area protects said thin oxide layer in said first gate region;
thermally growing a thick oxide layer on said second gate region and on said polysilicon layer in said first area, wherein said thick oxide layer has a thickness in the range of 60 A to 180 A;
depositing a further photoresist layer on said thick oxide layer, exposing said further photoresist and removing said further photoresist layer from said first area;
removing said thick oxide layer from said polysilicon layer in said first area;
depositing a further polysilicon layer over said first and second areas; and
selectively removing portions of said further polysilicon layer using a photoresist and dry etching to form two gates of said semiconductor device.
2. The method as claimed in claim 1 , which further comprises providing a Shallow Trench Isolation (STI) material in said trench.
3. The method as claimed in claim 2 , wherein said step of removing said thin oxide layer from said second gate region reduces a surface level of said STI material by no more than 60 angstrom.
4. The method as claimed in claim 2 , wherein, after removing said thin oxide layer, a first surface level of said STI material in said first area differs by no more than 60 angstrom from a second surface level of said STI material in said second area.
5. The method as claimed in claim 2 , wherein, after removing said thin oxide layer, a surface level of said STI material in said second area is at least 100 angstrom above a surface of said second gate region.
6. The method as claimed in claim 2 , wherein, after removing said thin oxide layer, a surface level of said STI material in said second area is at least 180 angstrom above a surface of said second gate region.
7. The method as claimed in claim 1 , wherein said first and second parts of said trench together form the whole of said trench.
8. The method as claimed in claim 1 , wherein said polysilicon layer is removed from said second area using dry etching.
9. The method as claimed in claim 1 , wherein said substrate is a silicon substrate.
10. The method as claimed in claim 1 , wherein said semiconductor device is a dual gate semiconductor device.
11. The method as claimed in claim 1 , and further comprising:
performing polysilicon re-oxidation to oxidise the polysilicon layer and further polysilicon layer of said two gates, wherein the re-oxidation thickness is increased to 60 A.