Defect inspection and review using transmissive current image of charged particle beam system
A system is disclosed. In one embodiment, the system includes a scanning electron microscopy sub-system including an electron source configured to generate an electron beam and an electron-optical assembly including one or more electron-optical elements configured to direct the electron beam to the specimen. In another embodiment, the system includes one or more grounding paths coupled to the specimen, the one or more grounding paths configured to generate one or more transmission signals based on one or more received electron beam-induced transmission currents. In another embodiment, the system includes a controller configured to: generate control signals configured to cause the scanning electron microscopy sub-system to scan the portion of the electron beam across a portion of the specimen; receive the transmission signals via the one or more grounding paths; and generate transmission current images based on the transmission signals.
1. A system, comprising:
a scanning electron microscopy sub-system comprising:
an electron source configured to generate an electron beam;
an electron-optical assembly including one or more electron-optical elements configured to direct a portion of the electron beam onto a first side of a specimen, wherein the specimen includes a 3D-NAND device including a pattern of high-aspect-ratio holes;
one or more grounding paths coupled to a second side of the specimen different from the first side, wherein the one or more grounding paths comprise one or more grounding pins coupled to the second side of the specimen and one or more connecting traces, wherein a first grounding pin is coupled to a first connecting trace and a second grounding pin is coupled to a second connecting trace, the one or more grounding paths configured to receive one or more electron beam-induced transmission currents transmitted through the specimen and generate one or more transmission signals based on the one or more electron beam-induced transmission currents transmitted through the specimen; and
a controller including one or more processors configured to execute a set of program instructions stored in memory, the set of program instructions configured to cause the one or more processors to:
generate one or more control signals configured to cause the scanning electron microscopy sub-system to scan the portion of the electron beam across a portion of the specimen;
receive the one or more transmission signals via the one or more grounding paths;
generate one or more transmission current images based on the one or more transmission signals; and
identify one or more characteristics of one or more of the high-aspect-ratio holes of the 3D-NAND device based on the one or more transmission current images.
2. The system of claim 1 , wherein the one or more transmission current images are further based on the one or more control signals.
3. The system of claim 2 , wherein generating the one or more transmission current images based on the one or more transmission signals and the one or more control signals comprises:
identifying a pixel location based on the one or more control signals;
identifying a pixel gray level based on the one or more transmission signals; and
generating a pixel in a transmission current image based on the pixel location and the pixel gray level.
4. The system of claim 1 , wherein the identify one or more characteristics of one or more of the high-aspect-ratio holes of the 3D-NAND device based on the one or more transmission current images comprises:
identify one or more under-etched high-aspect-ratio holes of the 3D-NAND device based on the one or more transmission current images.
5. The system of claim 1 , wherein the one or more grounding paths comprise:
one or more amplifiers configured to receive the one or more electron beam-induced transmission currents; and
an analog-digital (AD) converter device configured to receive the one or more transmission currents and generate the one or more transmission signals.
6. The system of claim 1 , wherein the scanning electron microscopy sub-system further comprises:
a detector assembly configured to detect a plurality of electrons emanating from a surface of the specimen to form one or more scanning electron microscopy images.
7. The system of claim 6 , wherein forming the one or more scanning electron microscopy images is performed concurrently with generating the one or more transmission current images.
8. The system of claim 1 , wherein the first side of the specimen comprises a front side of the specimen, and the second side of the specimen comprises a back side of the specimen.
9. A system, comprising:
a controller including one or more processors configured to execute a set of program instructions stored in memory, the set of program instructions configured to cause the one or more processors to:
generate one or more control signals configured to scan a portion of an electron beam across a portion of a first side of a specimen, wherein the specimen includes a 3D-NAND device including a pattern of high-aspect-ratio holes;
receive one or more transmission signals via one or more grounding paths coupled to a second side of the specimen, wherein the one or more grounding paths comprise one or more grounding pins coupled to the second side of the specimen and one or more connecting traces, wherein a first grounding pin is coupled to a first connecting trace and a second grounding pin is coupled to a second connecting trace;
generate one or more transmission current images based on the one or more transmission signals; and
identify one or more characteristics of one or more of the high-aspect-ratio holes of the 3D-NAND device based on the one or more transmission current images.
10. The system of claim 9 , wherein the one or more transmission current images are further based on one or more scan signals.
11. The system of claim 10 , wherein generating the one or more transmission current images based on the one or more transmission signals and the one or more scan signals comprises:
identifying a pixel location based on the one or more control signals;
identifying a pixel gray level based on the one or more transmission signals; and
generating a pixel in a transmission current image based on the pixel location and the pixel gray level.
12. The system of claim 9 , wherein the identify one or more characteristics of one or more of the high-aspect-ratio holes of the 3D-NAND device based on the one or more transmission current images comprises:
identify one or more under-etched high-aspect-ratio holes of the 3D-NAND device based on the one or more transmission current images.
13. The system of claim 9 , wherein the one or more grounding paths comprise:
one or more amplifiers configured to receive one or more transmission currents; and
an analog-digital (AD) converter device configured to receive the one or more transmission currents and generate the one or more transmission signals.
14. The system of claim 9 , further comprising:
a detector assembly configured to detect a plurality of electrons emanating from a surface of the specimen to form one or more scanning electron microscopy images.
15. The system of claim 14 , wherein forming the one or more scanning electron microscopy images is performed concurrently with generating the one or more transmission current images.
16. The system of claim 9 , wherein the first side of the specimen comprises a front side of the specimen, and the second side of the specimen comprises a back side of the specimen.
17. A method, comprising:
generating an electron beam with an electron source;
scanning at least one portion of the electron beam across a portion of a specimen, wherein the specimen includes a 3D-NAND device including a pattern of high-aspect-ratio holes;
measuring one or more electron beam-induced transmission currents transmitted through the specimen via one or more grounding paths coupled to a second side of the specimen and one or more connecting traces, wherein the one or more grounding paths comprise one or more grounding pins coupled to the second side of the specimen and the one or more connecting traces, wherein a first grounding pin is coupled to a first connecting trace and a second grounding pin is coupled to a second connecting trace;
generating one or more transmission signals based on the one or more electron beam-induced transmission currents transmitted through the specimen;
generating one or more transmission current images based on the one or more transmission signals; and
identifying one or more characteristics of one or more of the high-aspect-ratio holes of the 3D-NAND device based on the one or more transmission current images.