Method of manufacturing multilayer ceramic electronic component
A method of manufacturing a multilayer ceramic electronic component includes: preparing a plurality of first ceramic sheets; forming internal electrode patterns on the first ceramic sheets using a conductive paste, respectively; stacking the first ceramic sheets on which the internal electrode pattern is formed to form a ceramic body including internal electrodes disposed therein to face each other; forming electrode layers by transferring a nickel-containing sheet on both end surfaces of the ceramic body in a length direction of the ceramic body so as to be connected to the internal electrodes, respectively; forming electrically insulating layers by attaching a second ceramic sheet for forming an electrically insulating layer to the electrode layers, respectively; and preparing external electrodes by forming plating layers on one surface of the ceramic body in a thickness direction of the ceramic body, to be connected to the electrode layers, respectively.
1. A method of manufacturing a multilayer ceramic electronic component, the method comprising:
forming first ceramic sheets by applying slurry including a ceramic powder, a binder, and a solvent onto carrier films, respectively;
respectively forming internal electrode patterns on the first ceramic sheets using a conductive paste;
stacking the first ceramic sheets on which the internal electrode patterns are respectively formed, so as to form a ceramic body including internal electrodes which are disposed therein to face each other and which are stacked in a thickness direction of the ceramic body;
forming a nickel-containing sheet by applying a conductive metal paste containing nickel on a film;
forming electrode layers by transferring the nickel-containing sheet from the film onto both end surfaces of the ceramic body in a length direction of the ceramic body so as to be connected to the internal electrodes, respectively, the length direction being transverse to the thickness direction;
forming electrically insulating layers by attaching a second ceramic sheet to the electrode layers, respectively;
after forming the electrode layers and the electrically insulating layers, simultaneously sintering the ceramic body, the electrode layers, and the electrically insulating layers; and
forming external electrodes by forming plating layers on one surface of the ceramic body in the thickness direction of the ceramic body, to be connected to the electrode layers, respectively, so that the external electrodes are connected to the internal electrodes through the electrode layers, respectively.
2. The method of claim 1 , further comprising:
forming seed layers on the one surface of the ceramic body in the thickness direction of the ceramic body, to be electrically connected to the electrode layers, respectively,
wherein forming the plating layer comprises forming a respective one of the plating layers on a respectively one of the seed layers.
3. The method of claim 2 , wherein forming the seed layers comprises forming the seed layers only on the one surface of the ceramic body in the thickness direction of the ceramic body.
4. The method of claim 1 , further comprising:
forming the second ceramic sheet on the film, such that the nickel-containing sheet is formed on the second ceramic sheet
and the electrode layers and the electrically insulating layers are formed simultaneously on each end surface of the ceramic body in the length direction of the ceramic body.
5. The method of claim 1 , comprising providing the one surface of the ceramic body in the thickness direction of the ceramic body as a mounting surface of the multilayer ceramic electronic component to mount the multilayer ceramic electronic component on a board.
6. The method of claim 1 , compromising:
providing a thickness T1 of each of the electrode layers in a central region of the ceramic body in the thickness direction of the ceramic body and a thickness T2 of each of the electrode layers at a point at which an outermost internal electrode among the internal electrodes is positioned to satisfy 0.8≤T2/T1≤1.2.
7. The method of claim 1 , comprising providing:
a thickness T1 of each of the electrode layers in a central region of the ceramic body in the thickness direction of the ceramic body, a thickness T2 of each of the electrode layers at a point at which an outermost internal electrode among the internal electrodes is positioned, and a thickness T3 of each of the electrode layers in corner portions of the ceramic body to satisfy 0.8≤T2/T1≤1.2 and 0.4≤T3/T1≤1.0.
8. A method of manufacturing a multilayer ceramic electronic component, the method comprising:
forming first ceramic sheets by applying slurry including a ceramic powder, a binder, and a solvent onto carrier films, respectively;
respectively forming internal electrode patterns on the first ceramic sheets using a conductive paste;
stacking the first ceramic sheets on which the internal electrode patterns are respectively formed, so as to form a ceramic body including internal electrodes which are disposed therein to face each other and which are stacked in a thickness direction of the ceramic body;
forming a nickel-containing sheet by applying a conductive metal paste containing nickel on a film;
forming electrode layers by transferring the nickel-containing sheet from the film onto both end surfaces of the ceramic body in a length direction of the ceramic body in a green chip state so as to be connected to the internal electrodes, respectively, the length direction being transverse the thickness direction;
forming electrically insulating layers by attaching a second ceramic sheet to the electrode layers, respectively; and
forming external electrodes by forming plating layers on one surface of the ceramic body in the thickness direction of the ceramic body, to be connected to the electrode layers, respectively, so that the external electrodes are connected to the internal electrodes through the electrode layers, respectively.
9. The method of claim 8 , further comprising:
forming seed layers on the one surface of the ceramic body in the thickness direction of the ceramic body, to be electrically connected to the electrode layers, respectively,
wherein forming the plating layer comprises forming a respective one of the plating layers on a respectively one of the seed layers.
10. The method of claim 9 , wherein forming the seed layers comprises forming the seed layers only on the one surface of the ceramic body in the thickness direction of the ceramic body.
11. The method of claim 8 , further comprising:
after forming the electrode layers and the electrically insulating layers, simultaneously sintering the ceramic body, the electrode layers, and the electrically insulating layers.
12. The method of claim 8 , further comprising:
forming the second ceramic sheet on the film, such that the nickel-containing sheet is formed on the second ceramic sheet and the electrode layers and the electrically insulating layers are formed simultaneously on each end surface of the ceramic body in the length direction of the ceramic body.
13. The method of claim 12 , further comprising:
after forming the electrode layers and the electrically insulating layers, simultaneously sintering the ceramic body, the electrode layers, and the electrically insulating layers.
14. The method of claim 8 , comprising:
providing the one surface of the ceramic body in the thickness direction of the ceramic body as a mounting surface of the multilayer ceramic electronic component to mount the multilayer ceramic electronic component on a board.
15. The method of claim 8 , comprising:
providing a thickness T1 of each of the electrode layers in a central region of the ceramic body in the thickness direction of the ceramic body and a thickness T2 of each of the electrode layers at a point at which an outermost internal electrode among the internal electrodes is positioned to satisfy 0.8≤T2/T1≤1.2.
16. The method of claim 8 , comprising:
providing a thickness T1 of each of the electrode layers in a central region of the ceramic body in the thickness direction of the ceramic body, a thickness T2 of each of the electrode layers at a point at which an outermost internal electrode among the internal electrodes is positioned, and a thickness T3 of each of the electrode layers in corner portions of the ceramic body to satisfy 0.8≤T2/T1≤1.2 and 0.4≤T3/T1≤1.0.