IP Library › Patent Application 16423901
Patent Application
App. No. 16/423,901

High Efficiency Thermal Management Device for Use With Components Having High Heat Flux Values

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Quick Facts
Patent No.
US None
App. No.
16/423,901
Abstract

High efficiency heat management devices for use with a component, are disclosed and include: at least one porous filled channel configuration component or at least one foam filled channel configuration component, wherein the at least one porous filled channel configuration component or at least one foam filled channel configuration component comprises a channel base and a surface; at least one jet impingement of at least one thermal management liquid or gas; at least one jet inlet, wherein the at least one jet inlet directs the at least one jet impingement of a liquid or a gas onto the surface of the at least one porous filled channel configuration component or at least one foam filled channel configuration component; and at least one thermal management liquid or gas exit channel.

Claims (26)

1 . A high efficiency heat management device for use with a component, comprising:

at least one porous filled channel configuration component or at least one foam filled channel configuration component, wherein the least one porous filled channel configuration component or at least one foam filled channel configuration component comprises a channel base and a surface;

at least one jet impingement of at least one coolant;

at least one jet inlet, wherein the at least one jet inlet directs the at least one jet impingement of a liquid or a gas onto the surface of the at least one porous filled channel configuration component or at least one foam filled channel configuration component; and

at least one coolant exit channel.

2 . The high efficiency heat management device for use with a component of claim 1 , wherein the at least one porous filled channel configuration component or at least one foam filled channel configuration component is at least partially filled.

3 . The high efficiency heat management device for use with a component of claim 1 , wherein the at least one porous filled channel configuration component or at least one foam filled channel configuration component is completely filled.

4 . The high efficiency heat management device for use with a component of claim 1 , wherein the at least one porous filled channel configuration component or at least one foam filled channel configuration component comprises a confined geometry.

5 . The high efficiency heat management device for use with a component of claim 1 , wherein the at least one porous filled channel configuration component or at least one foam filled channel configuration component comprises an unconfined geometry.

6 . The high efficiency heat management device for use with a component of claim 1 , wherein the at least one coolant comprises a liquid or a gas.

7 . The high efficiency heat management device for use with a component of claim 6 , wherein the at least one coolant comprises water, a nanofluid, or a combination thereof.

8 . The high efficiency heat management device for use with a component of claim 1 , wherein the at least one jet inlet comprises a shape, wherein the shape is square or rectangular.

9 . The high efficiency heat management device for use with a component of claim 1 , wherein the at least one jet inlet has a two-dimensional configuration or a three-dimensional configuration.

10 . The high efficiency heat management device for use with a component of claim 1 , wherein the at least one jet inlet has a vertical enclosure having a top, a bottom, and at least one side.

11 . The high efficiency heat management device for use with a component of claim 1 , wherein the at least one jet inlet has a tapered directional component coupled with the bottom of the vertical enclosure.

12 . The high efficiency heat management device for use with a component of claim 1 , further comprising at least one component having a high heat flux value, wherein the component has a top surface.

13 . The high efficiency heat management device for use with a component of claim 12 , wherein the channel base of the at least one porous filled channel configuration component or at least one foam filled channel configuration component is operationally near, coupled with, or connected to the top surface of the component.

14 . A high efficiency heat management device for use with a component, comprises:

at least one porous filled channel configuration component or at least one foam filled channel configuration component, wherein the at least one porous filled channel configuration component or at least one foam filled channel configuration component comprises a channel base and a surface;

at least one jet impingement of at least one thermal management liquid or gas;

at least one jet inlet, wherein the at least one jet inlet directs the at least one jet impingement of a liquid or a gas onto the surface of the at least one porous filled channel configuration component or at least one foam filled channel configuration component; and

at least one thermal management liquid or gas exit channel.

15 . The high efficiency heat management device for use with a component of claim 14 , wherein the at least one porous filled channel configuration component or at least one foam filled channel configuration component is at least partially filled.

16 . The high efficiency heat management device for use with a component of claim 14 , wherein the at least one porous filled channel configuration component or at least one foam filled channel configuration component is completely filled.

17 . The high efficiency heat management device for use with a component of claim 14 , wherein the at least one thermal management liquid or gas comprises water, a nanofluid, or a combination thereof.

18 . The high efficiency heat management device for use with a component of claim 14 , wherein the at least one jet inlet comprises a shape, wherein the shape is square or rectangular.