Electrostatic discharge resistant pressure sensor

1. A pressure sensor comprising:

a housing;

a pressure chamber defined within the housing;

a pressure transducer comprising a bridge circuit;

a header that seals the pressure chamber and supports the pressure transducer in the pressure chamber; and

a plurality of pins that extend through respective openings in the header and electrically connect the bridge circuit of the pressure transducer in the pressure chamber to sensor electronics outside the pressure chamber, the pins being electrically insulated from the header, wherein the header is configured so that the electrical insulation of at least one pin from the header is less than the electrical insulation of the remaining pins from the header, and wherein the at least one pin comprises a ground pin of the bridge circuit.

2. The pressure sensor recited in claim 1 , wherein the header is configured so that electrostatic discharge pulses up to a predetermined magnitude are directed through the at least one pin instead of the remaining pins.

3. The pressure sensor recited in claim 1 , further comprising a glass material that is disposed in the openings, connects the pins to the header, and electrically insulates the pins from the header, wherein the header is configured so that the amount of glass material that electrically insulates the at least one pin is less than the amount of glass material that electrically insulates the remaining pins.

4. The pressure sensor recited in claim 3 , wherein the glass material fills an annular space between the pins and a sidewall of their respective openings.

5. The pressure sensor recited in claim 3 , wherein the opening associated with the at least one pin has a diameter that is smaller than the diameter of the openings associated with the remaining pins.

6. A pressure sensor header that supports a pressure transducer in a pressure chamber and through which a plurality of pins extend to electrically connect the pressure transducer to electronics outside the pressure chamber, the header comprising:

openings through which the pins extend; and

a glass insulating material that fills space between the pins and their respective openings and electrically insulates the pins from the header,

wherein the header is configured so that at least one opening is smaller than the remaining openings so that the glass insulating material in the at least one opening provides a degree of electrical insulation between the header and any pin extending through the at least one opening that is less than a degree of electrical insulation that the glass insulating material provides between the header and the remaining pins, wherein the pressure transducer that the header is configured to support comprises a bridge circuit, and wherein the at least one opening is configured to receive a ground pin of the bridge circuit.

7. The pressure sensor header recited in claim 6 , wherein the amount of glass material that fills the space in the at least one opening is less than the amount of glass material that fills the remaining openings.

8. The pressure sensor header recited in claim 6 , wherein the glass material fills an annular space between the pins and a sidewall of their respective openings.

9. The pressure sensor header recited in claim 6 , wherein the at least one opening has a diameter that is smaller than the diameter of the remaining openings.

10. The pressure sensor header recited in claim 6 , wherein the header is configured so that electrostatic discharge pulses up to a predetermined magnitude are directed through the ground pin extending through the at least one opening.

11. A method for providing electrostatic discharge protection to a pressure sensor including a pressure sensor header that supports a pressure transducer comprising a bridge circuit in a pressure chamber, the sensor header including openings through which a plurality of pins of the bridge circuit extend to electrically connect the pressure transducer to electronics outside the pressure chamber, the sensor further including a glass insulating material that fills space between the pins and their respective openings and electrically insulates the pins from the header, the method comprising configuring the header so that at least one opening is smaller than the remaining openings so that the glass insulating material in the at least one opening provides a degree of electrical insulation between the header and a ground pin of the bridge circuit extending through the at least one opening that is less than a degree of electrical insulation that the glass insulating material provides between the header and the remaining pins of the bridge circuit.

12. The method recited in claim 11 , wherein configuring the header so that at least one opening is smaller than the remaining openings comprises configuring the header so that the at least one opening has a diameter that is smaller than the diameter of the remaining openings.

13. The method recited in claim 11 , further comprising filling the space between the openings and the pins extending through the openings with a glass material that seals the openings and electrically insulates the pins from the header, wherein the amount of glass material that fills the space in the at least one opening is less than the amount of glass material that fills the remaining openings.

14. The method recited in claim 13 , wherein filling the space between the openings and the pins extending through the openings with a glass material comprises centering the pins in their respective openings and filling an annular space between the pins and a sidewall of their respective openings with the glass material.