IP Library › Granted Patent US 10,624,983
Granted Patent B2
US 10,624,983 · App. 16/425,300 · Granted Apr 21, 2020

Water absorbent resin powder

Inventors: Kazushi Torii (Hyogo, JP); Kohei Omori (Hyogo, JP); Nobuya Tanaka (Hyogo, JP); Shigeru Sakamoto (Hyogo, JP); Kenji Tada (Hyogo, JP); Hironori Sato (Hyogo, JP)
Assignee: NIPPON SHOKUBAI CO., LTD.
A61L15/24B01J20/261B02C19/0056B02C19/22B29B7/422B29B7/428B29B7/429B29B9/06B29B9/12B29B15/00C08F2/10C08F6/008C08F220/06C08J3/075C08J3/12B01J2220/68B29B9/16B29B2009/125B29C48/681B29C48/687B29K2033/00B29K2105/251B29K2995/0092C08J2333/02
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Quick Facts
Patent No.
US 10,624,983
App. No.
16/425,300
Granted
Apr 21, 2020
Kind
B2
Abstract

Provided is a water absorbent resin that is useful to sanitary materials such as a disposable diaper, a sanitary napkin, and a blood absorbent for medical use each having a higher liquid permeability and a higher water absorbing speed. Further provided is a water absorbent resin powder that is useful to sanitary materials such as a disposable diaper, a sanitary napkin, and a blood absorbent for medical use each having increased in absorbency of a liquid and in heat retaining property. A gel grinding device to be used to produce a water absorbent resin, includes: a screw; a feed opening; an extrusion opening; a porous plate; and a barrel, the barrel including a return preventing member provided on an inner surface thereof, and the return preventing member satisfying at least one of specific parameters.

Claims (12)

1. A water absorbent resin powder comprising a polyacrylic acid (salt)-based water absorbent resin as a main component,

the water absorbent resin powder satisfying the following (A) to (C):

(A) the water absorbent resin powder containing particles smaller than 150 μm in a ratio of 0 mass % to 4.5 mass % before an impact resistance test, and the water absorbent resin powder containing, in a ratio of 0 mass % to 4.5 mass %, particles smaller than 150 μm and increased by the impact resistance test;

(B) the water absorbent resin powder having a saline flow conductivity (SFC) of not less than 10; and

(C) the water absorbent resin powder having a thermal conductivity of not more than 125 [mW/(m·K)].

2. The water absorbent resin powder as set forth in claim 1 , wherein the water absorbent resin powder has an absorption capacity under load (AAP) of not less than 20 [g/g].

3. The water absorbent resin powder as set forth in claim 1 , wherein the water absorbent resin powder has an internal gas bubbles ratio of 0% to 3.7%, the internal gas bubbles ratio being specified by the following equation:

(internal gas bubbles ratio)[%]={(true density)−(apparent density)}/(true density)×100.

4. The water absorbent resin powder as set forth in claim 1 , wherein the water absorbent resin powder contains at least one of a multivalent metal salt and inorganic microparticles.

5. The water absorbent resin powder as set forth in claim 1 , wherein the water absorbent resin powder has a mass average particle diameter D50 of 350 μm to 460 μm, or the water absorbent resin powder has a particle size distribution having a logarithmic standard deviation of 0.25 to 0.45.

6. The water absorbent resin powder as set forth in claim 1 , wherein the water absorbent resin powder contains, in a ratio of not more than 36 mass %, particles that pass through a sieve having a mesh size of 710 μm and do not pass through a sieve having a mesh size of 500 μm.

7. The water absorbent resin powder as set forth in claim 1 , wherein the water absorbent resin powder has a surface tension of not less than 69.0 [mN/m].

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 8, 2019
From: TORII, KAZUSHI; OMORI, KOHEI; TANAKA, NOBUYA; SAKAMOTO, SHIGERU; TADA, KENJI; SATO, HIRONORI
To: NIPPON SHOKUBAI CO., LTD.
Reel/Frame 049691/0471 →
Priority Claims (2)
JP 2013-177301 · Aug 28, 2013 · national
JP 2014-067062 · Mar 27, 2014 · national
Continuity (2)
Division 14914150
Related Publication 20190275192A1 · Sep 12, 2019