Interlayers and associated systems, devices, and methods
Embodiments related to interlayers (e.g., interlayers comprising a transition metal oxide, a transition metal oxynitride, and/or a transition metal nitride) and associated systems, devices (e.g., photovoltaic devices), and methods are disclosed. In some embodiments, a system for exciton transfer includes a substrate including an inorganic semiconductor. An interlayer may be disposed on the substrate, and a layer including a material that undergoes singlet exciton fission when exposed to electromagnetic radiation may be disposed on the interlayer. The interlayer may be disposed between the substrate and the layer. In some embodiments, a method for manufacturing a system for exciton transfer involves depositing an interlayer onto a substrate that includes an inorganic semiconductor. The method may also include depositing a layer including a material that undergoes singlet exciton fission when exposed to electromagnetic radiation onto the interlayer.
1. A system for exciton transfer comprising:
a substrate comprising an inorganic semiconductor;
a transition metal nitride interlayer disposed on the substrate;
an electron selective contact electrically connected to and disposed on a first surface of the substrate;
a hole selective contact electrically connected to and disposed on the first surface of the substrate; and
a layer disposed on the transition metal nitride interlayer, wherein the layer comprises a material that undergoes singlet exciton fission when exposed to electromagnetic radiation, wherein the transition metal nitride interlayer is disposed between the substrate and the layer.
2. The system of claim 1 , wherein the inorganic semiconductor is silicon.
3. The system of claim 2 , wherein the inorganic semiconductor is n-doped silicon.
4. The system of claim 1 , wherein the transition metal nitride interlayer comprises a hafnium nitride.
5. The system of claim 4 , wherein the hafnium nitride has the chemical formula Hf 3 N 4 .
6. The system of claim 1 , wherein the layer comprises tetracene, a tetracene derivative, anthracene, anthracene derivatives, or a combination thereof.
7. The system of claim 1 , wherein the transition metal nitride interlayer has a thickness of less than 10 Angstroms.
8. A system for exciton transfer comprising:
a substrate comprising an inorganic semiconductor;
an interlayer, comprising a transition metal nitride, a transition metal oxide, and/or a transition metal oxynitride disposed on the substrate;
an electron selective contact electrically connected to and disposed on a first surface of the substrate;
a hole selective contact electrically connected to and disposed on the first surface of the substrate; and
a layer disposed on the interlayer, wherein the layer comprises a material that undergoes singlet exciton fission when exposed to electromagnetic radiation, wherein the interlayer is disposed between the substrate and the layer.
9. The system of claim 8 , wherein the transition metal nitride comprises hafnium.
10. The system of claim 9 , wherein the interlayer comprises hafnium oxide.
11. The system of claim 9 , wherein the interlayer comprises hafnium oxynitride.
12. The system of claim 8 , wherein the inorganic semiconductor is silicon.
13. The system of claim 12 , wherein the inorganic semiconductor is n-doped silicon.
14. The system of claim 8 , wherein the layer comprises tetracene, a tetracene derivative, anthracene, anthracene derivatives, or a combination thereof.
15. The system of claim 8 , wherein the interlayer has a thickness of less than 10 Å.
16. A system for exciton transfer comprising:
a substrate comprising an inorganic semiconductor;
an interlayer, comprising a transition metal and nitrogen;
an electron selective contact electrically connected to and disposed on a first surface of the substrate;
a hole selective contact electrically connected to and disposed on the first surface of the substrate; and
a layer disposed on the interlayer, wherein the layer comprises a material that undergoes singlet exciton fission when exposed to electromagnetic radiation, wherein the interlayer is disposed between the substrate and the layer.
17. The system of claim 16 , wherein the transition metal is hafnium.
18. The system of claim 16 , wherein the interlayer comprises a transition metal nitride.
19. The system of claim 16 , wherein the interlayer comprises a transition metal oxynitride.
20. The system of claim 18 , wherein the interlayer further comprises a transition metal oxide.
21. The system of claim 16 , wherein the inorganic semiconductor is silicon.
22. The system of claim 16 , wherein the interlayer further comprises hafnium oxide.
23. The system of claim 16 , wherein the interlayer further comprises hafnium oxynitride.
24. The system of claim 16 , wherein the layer comprises tetracene, a tetracene derivative, anthracene, anthracene derivatives, or a combination thereof.
25. The system of claim 16 , wherein the interlayer has a thickness of less than 10 Å.
26. The system of claim 8 , wherein the interlayer comprises the transition metal nitride.
27. The system of claim 8 , wherein the interlayer comprises the transition metal oxide.
28. The system of claim 8 , wherein the interlayer comprises the transition metal oxynitride.
29. The system of claim 1 , wherein the transition metal nitride interlayer further comprises a transition metal oxide.
30. The system of claim 1 , wherein the transition metal nitride interlayer further comprises a transition metal oxynitride.
31. The system of claim 1 , wherein the system is configured to generate photocurrent when exposed to the electromagnetic radiation.
32. The system of claim 8 , wherein the system is configured to generate photocurrent when exposed to the electromagnetic radiation.
33. The system of claim 16 , wherein the system is configured to generate photocurrent when exposed to the electromagnetic radiation.
34. The system of claim 1 , wherein the transition metal nitride interlayer is disposed directly against the substrate and the layer.
35. The system of claim 8 , wherein the interlayer is disposed directly against the substrate and the layer.
36. The system of claim 16 , wherein the interlayer is disposed directly against the substrate and the layer.