RFID device

1. A process for manufacturing a transaction device comprising the steps of:

forming a metal frame defining an outer periphery, an inner periphery defined by an opening, and at least one body discontinuity from the outer periphery to the inner periphery of the metal frame;

inserting at least one electronic component into the opening, the electronic component comprising an RFID module;

disposing a non-conductive material about the electronic component; and

disposing at least one additional layer over the non-conductive material,

wherein the opening extends entirely through the card body, and the at least one additional layer comprises a first additional layer disposed on one side of the opening before inserting the at least one electrical component, and the step of disposing the non-conductive material about the at least one electronic component comprises disposing a first layer of non-conductive material in the opening between the at least one additional layer and the at least one electronic component and disposing a second layer of non-conductive material on top of the at least one electronic component.

2. The process of claim 1 , wherein the RFID module comprises an antenna connected to or configured to inductively couple to an RFID chip.

3. The process of claim 1 , wherein the at least one additional layer is a printing layer.

4. The process of claim 1 , wherein the step of disposing the at least one additional layer over the non-conductive material comprises adhesively attaching the one additional layer or laminating the at least one additional layer over the non-conductive material.

5. The process of claim 1 , further comprising disposing a second additional layer on top of the second layer of non-conductive material.

6. A transaction device comprising a molded electronic component of claim 1 .

7. A transaction device manufactured according to the process of claim 1 .

8. An RFID device comprising:

a metal frame having first and second opposite surfaces, an outer periphery, and an opening in the metal frame defining an inner periphery and extending from at least one of the opposite surfaces for a depth;

a chip layer disposed inside the opening, the chip layer comprising a substrate, an RFID transponder chip mounted to the substrate, and an module antenna in the substrate connected to the RFID transponder chip;

at least one fill layer disposed in the opening of the frame between the chip layer and one of the surfaces of the metal frame; and

at least one layer laminated over at least one surface of the metal frame,

wherein the depth of the opening extends from the first surface for less than a thickness of the metal frame such that the opening comprises a pocket having a bottom, the device further comprising a ferrite layer disposed between a first surface of the chip layer and the pocket bottom, wherein the fill layer is disposed on a second surface of the chip layer.

9. The device of claim 8 , wherein the device has only a single laminated layer extending over the first surface of the metal frame and the fill layer.

10. The RFID device of claim 8 , further comprising a hole extending between the top and bottom surfaces of the device.

11. The RFID device of claim 10 , wherein the device comprises a component of a key ring or key chain, further comprising a member disposed in the hole, the member comprising a component of an apparatus configured to hold one or more keys.

12. The RFID device of claim 8 , wherein the RFID transponder chip comprises a dual interface chip having a contact pad, and the contact pad is accessible from an outer surface of the device.

13. The RFID device of claim 8 , wherein the RFID transponder chip is completely surrounded by non-conductive material.

14. An RFID device comprising:

a metal frame having first and second opposite surfaces, an outer periphery, and an opening in the metal frame defining an inner periphery and extending from at least one of the opposite surfaces for a depth;

a chip layer disposed inside the opening, the chip layer comprising a substrate, an RFID transponder chip mounted to the substrate, and a module antenna in the substrate connected to the RFID transponder chip;

at least one fill layer disposed in the opening of the frame between the chip layer and one of the surfaces of the metal frame; and

at least one layer laminated over at least one surface of the metal frame,

wherein the depth of the opening is coextensive with the thickness of the metal frame and the metal frame comprises a discontinuity in the form of a discontinuity extending between the first and second opposite surfaces and outer and inner peripheries, the device further comprising first and second fill layers on opposite sides of the chip layer and first and second layers laminated over the opposite surfaces of the metal frame and the respective first and second fill layers.

15. An RFID device comprising:

a metal frame having first and second opposite surfaces, an outer periphery, and an opening in the metal frame defining an inner periphery and extending from at least one of the opposite surfaces for a depth;

a chip layer disposed inside the opening, the chip layer comprising a substrate, an RFID transponder chip mounted to the substrate, and a module antenna in the substrate connected to the RFID transponder chip;

at least one fill layer disposed in the opening of the frame between the chip layer and one of the surfaces of the metal frame; and

at least one layer laminated over at least one surface of the metal frame,

wherein the RFID transponder chip is embedded in a non-conductive substrate, and has a laminated fill layer in contact with at least one surface of the RFID transponder chip embedded in the non-conductive substrate.

16. The RFID device of claim 15 , wherein the laminated fill layer, a ferrite layer in contact both upper and lower surfaces of the RFID transponder chip embedded in the non-conductive substrate.

17. The RFID device of claim 15 , comprising the laminated fill layer in contact with only one surface of the RFID transponder chip embedded in the non-conductive substrate, and a ferrite layer in contact with an opposite surface of the RFID transponder chip embedded in the non-conductive substrate.