Pellicle for an EUV lithography mask and a method of manufacturing thereof

1. A pellicle for an EUV photo mask, comprising:

a first capping layer;

a matrix layer disposed over the first capping layer;

a second capping layer disposed over the matrix layer; and

a metallic layer disposed over the second capping layer.

2. The pellicle of claim 1 , wherein the matrix layer is made of a silicide.

3. The pellicle of claim 2 , wherein the silicide is MoSi or ZrSi.

4. The pellicle of claim 1 , wherein the first capping layer and the second capping layer are made of one or more of silicon oxide, silicon nitride, silicon oxynitride, SiC and SiCN.

5. The pellicle of claim 4 , wherein the first capping layer and the second capping layer are made of a same material.

6. The pellicle of claim 4 wherein the first capping layer and the second capping layer are made of different materials from each other.

7. The pellicle of claim 1 , wherein the metallic layer is one or more of a Ru layer, a Mo layer and a Zr layer.

8. A pellicle for an EUV photo mask, comprising:

a first capping layer;

a matrix layer disposed over the first capping layer;

a stable layer disposed over the matrix layer;

a second capping layer disposed over the stable layer; and

a metallic layer disposed over the stable layer.

9. The pellicle of claim 8 , wherein the stable layer is one or more of a Nb layer, a boron layer and a carbon layer.

10. The pellicle of claim 9 , wherein the matrix layer is made of a silicide.

11. The pellicle of claim 10 , wherein the silicide is one or more of MoSi, ZrSi and NbSi.

12. The pellicle of claim 8 , wherein the first capping layer and the second capping layer are made of one or more of silicon oxide, silicon nitride, silicon oxynitride, SiC and SiCN.

13. The pellicle of claim 12 , wherein the first capping layer and the second capping layer are made of a same material.

14. The pellicle of claim 12 , wherein the first capping layer and the second capping layer are made of different materials from each other.

15. The pellicle of claim 10 , wherein the metallic layer is one or more of a Ru layer, a Mo layer and a Zr layer.

16. The pellicle of claim 8 , wherein a thickness of the stable layer is in a range from 0.5 nm to 10 nm.

17. The pellicle of claim 8 , wherein:

the matrix layer is one of a poly silicon layer and an amorphous silicon layer, and

the stable layer is one or more of a MoSi layer, a ZrSi layer, and a NbSi layer.

18. A method of manufacturing a pellicle for an EUV photo mask, the method comprising:

forming a first capping layer over a front surface of a substrate;

forming a first base matrix layer over the first capping layer;

forming a second base matrix layer over the first base matrix layer;

forming an alloy, as an alloy matrix layer, from the first base matrix layer and the second base matrix layer by a thermal operation;

forming a second capping layer over the alloy matrix layer;

forming a backside coating layer on a back surface of the substrate;

forming a first opening in the backside coating layer by patterning the backside coating layer;

forming a second opening in the substrate by etching the substrate through the first opening; and

forming one or more metallic layers over the second capping layer.

19. The method of claim 18 , wherein the first base matrix layer is poly silicon or amorphous silicon, and the second base matrix layer is one or more of Mo, Zr and Nb.

20. The method of claim 19 , wherein the metallic layer is one or more of a Zr layer.