Display device and method of manufacturing the same
A display device includes: a substrate; a sealing substrate opposing the substrate, and including a first surface adjacent to the substrate and a second surface opposing the first surface; a pixel unit between the substrate and the sealing substrate; a sealing member between the substrate and the sealing substrate, spaced apart from the pixel unit, and bonding the substrate and the sealing substrate to each other; a touch sensing unit on the second surface of the sealing substrate; a touch pad on the second surface of the sealing substrate, and overlapping the sealing member; and a touch circuit board on the touch pad and connected to the touch pad. The touch pad includes: a first conductive pad; and a second conductive pad on the first conductive pad, and having an area less than an area of the first conductive pad.
1. A display device comprising:
a substrate;
a sealing substrate opposing the substrate, and comprising a first surface adjacent to the substrate and a second surface opposing the first surface;
a pixel unit between the substrate and the sealing substrate;
a sealing member between the substrate and the sealing substrate, spaced apart from the pixel unit, and bonding the substrate and the sealing substrate to each other;
a touch sensing unit on the second surface of the sealing substrate;
a touch pad on the second surface of the sealing substrate, and overlapping the sealing member; and
a touch circuit board on the touch pad and connected to the touch pad,
wherein the touch pad comprises:
a first conductive pad; and
a second conductive pad on the first conductive pad, the second conductive pad having an area less than an area of the first conductive pad, and
wherein the second conductive pad is ultrasonically bonded to the touch circuit board, and
wherein the first conductive pad comprises a transparent conductive material.
2. The display device of claim 1 , wherein the first conductive pad comprises at least one of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium tin zinc oxide (ITZO).
3. The display device of claim 1 , wherein the second conductive pad comprises at least one of Ag, Mg, Al, Mo, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, Ti, Sn, or Cu.
4. The display device of claim 1 , wherein the second conductive pad has a multilayer structure in which a plurality of layers are stacked.
5. The display device of claim 1 , wherein the second conductive pad has an area less than or equal to ½ of the area of the first conductive pad.
6. The display device of claim 1 , wherein the first conductive pad is apart from the touch circuit board, and the second conductive pad directly contacts the touch circuit board.
7. The display device of claim 1 , wherein the sealing member comprises glass frit or a polymer resin.
8. The display device of claim 1 , wherein the touch circuit board comprises a base film, a cover film, and a wiring pattern portion between the base film and the cover film.
9. The display device of claim 8 , wherein the wiring pattern portion directly contacts the second conductive pad, and is ultrasonically bonded to the second conductive pad.
10. The display device of claim 8 , wherein the wiring pattern portion comprises at least one of Ag, Mg, Al, Mo, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, Ti, Sn, or Cu.
11. The display device of claim 1 , wherein the second conductive pad has a closed loop shape that overlaps an edge portion of the first conductive pad in a plan view.
12. The display device of claim 11 , wherein the second conductive pad further comprises a third conductive pad extending from the second conductive pad in the closed loop shape.
13. The display device of claim 1 , wherein the second conductive pad is formed as a plurality of lines or a plurality of islands.
14. The display device of claim 13 , wherein the second conductive pad has a zigzag shape.
15. A method of manufacturing a display device, the method comprising:
locating a pixel unit on a substrate;
locating a touch pad on a sealing substrate, the touch pad comprising a first conductive pad, and a second conductive pad on the first conductive pad and having an area less than an area of the first conductive pad;
locating a curable material between the substrate and the sealing substrate to overlap the touch pad;
outputting a laser beam toward the curable material through at least a part of the touch pad;
forming a sealing member by curing the curable material;
locating a touch circuit board on the touch pad; and
ultrasonically bonding the second conductive pad and the touch circuit board to each other, and
wherein the first conductive pad comprises a transparent conductive material.
16. The method of claim 15 , wherein the first conductive pad comprises at least one of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium tin zinc oxide (ITZO).
17. The method of claim 15 , wherein the second conductive pad comprises at least one of Ag, Mg, Al, Mo, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Ca, Ti, Sn, or Cu.
18. The method of claim 15 , wherein the second conductive pad has a multilayer structure in which a plurality of layers are stacked.
19. The method of claim 15 , wherein the second conductive pad has an area less than or equal to ½ of the area of the first conductive pad.
20. The method of claim 15 , wherein the sealing member comprises glass frit or a polymer resin.