MEMS posting for increased thermal dissipation

1. A Micro-Electromechanical System (MEMS) device comprising:

a piston layer suspended over a surface of a substrate by posts at corners thereof, the piston layer including an electrostatically deflectable piston and a number of flexures through which the piston is coupled to the posts;

a first reflective surface over a top surface of the piston;

a faceplate suspended over the piston layer, the faceplate including a second reflective surface on a top surface of the faceplate, and an aperture through which the piston exposed; and

a plurality of thermal sinking structures projecting from the surface of the substrate and extending through void spaces between the posts, the flexures and the piston of the piston layer to provide thermal management of the piston layer,

wherein the thermal sinking structures substantially fill the void spaces without contacting either the flexures or the piston to provide first thermal gaps separating the thermal sinking structures from the flexures and the piston, and without altering a deflection gap between the piston and the surface of the substrate, and

wherein electrostatic deflection of the piston brings light reflected from the first reflective surface into interference with light reflected from the second reflective surface.

2. The device of claim 1 , wherein the thermal sinking structures extend through the piston layer to a position under the faceplate to provide thermal management of the faceplate layer, and wherein the thermal sinking structures do not contact the faceplate to provide second thermal gaps between the thermal sinking structures and the faceplate.

3. The device of claim 1 , wherein the thermal sinking structures extend through the piston layer to connect with the faceplate to suspend the faceplate over the piston layer, and to provide thermal management of the faceplate.

4. The device of claim 3 , wherein the thermal sinking structures have an annular cross-section in a plane parallel to the surface of the substrate, and comprise a first material enclosing a second material.

5. The device of claim 4 , wherein the second material is electrically conductive to electrically couple the faceplate to an electrical potential of a structure in the substrate.

6. The device of claim 3 , wherein the thermal sinking structures have an overall triangular cross-section in the plane parallel to the surface of the substrate.

7. The device of claim 1 , wherein the first reflective surface is on a mirror supported above and separated from the piston by a central post extending from the piston to the mirror.

8. The device of claim 7 , wherein the central post has an annular cross-section in a plane parallel to the top surface of the piston, and comprises a first material enclosing an open cavity in a center of the central post.

9. The device of claim 7 , wherein the central post has an annular cross-section in a plane parallel to the top surface of the piston, and comprises a first material enclosing a second material.

10. A method of fabricating a Micro-Electromechanical System (MEMS) device, comprising:

depositing and patterning a first sacrificial layer over a surface of a substrate;

depositing a mechanical layer on the patterned first sacrificial layer to form posts at corners of the MEMS device, and to form a piston layer including a piston and a number of flexures through which the piston is coupled to the posts;

depositing a second sacrificial layer over the mechanical layer, and patterning the second sacrificial layer and the first sacrificial layer to form openings for a plurality of thermal sinking structures extending from the surface of the substrate;

depositing a faceplate layer to form a faceplate over the second sacrificial layer and to fill the openings to form the thermal sinking structures; and

at least partially removing the first sacrificial layer and/or the second sacrificial layer to release the piston layer,

wherein the thermal sinking structures substantially fill a void spaces in the piston layer between the posts, the flexures and the piston of the piston layer without contacting either the flexures or the piston to provide first thermal gaps separating the thermal sinking structures from the flexures and the piston, without altering a deflection gap between the piston and the surface of the substrate, and

wherein patterning the first and/or second sacrificial layer to form openings for the thermal sinking structures comprises forming openings having an annular cross-section in a plane parallel to the surface of the substrate, and wherein filling the openings comprises filling the openings with a first and/or second material enclosing a portion of material of the first and/or second sacrificial layer.

11. The method of claim 10 , wherein the material of the first and second sacrificial layers have greater thermal conductivity than a surrounding gas.

12. The method of claim 10 , wherein the first material comprises silicon germanium (SiGe) and the material of the first and second sacrificial layers germanium (Ge).

13. A two-dimensional spatial light modulator comprising:

a piston layer suspended over a surface of a substrate by posts at corners thereof, the piston layer including an electrostatically deflectable piston and a number of flexures through which the piston is coupled to the posts;

a faceplate suspended over the piston layer, the faceplate including an aperture through which the piston exposed; and

a plurality thermal sinking structures projecting from the surface of the substrate and extending through void spaces between the posts, the flexures and the piston of the piston layer to connect with the faceplate to suspend the faceplate over the piston layer, and to provide thermal management of the faceplate,

wherein the thermal sinking structures have an annular cross-section in a plane parallel to the surface of the substrate, and comprise a first material enclosing a second material, and has a greater thermal conductivity than the first material.

14. The modulator of claim 13 wherein the second material is electrically conductive to electrically couple the faceplate to an electrical potential of a structure in the substrate.

15. The modulator of claim 13 wherein the thermal sinking structures substantially fill the void spaces without contacting either the flexures or the piston to provide thermal management of the piston layer, and wherein thermal gaps separating the thermal sinking structures from the flexures and the piston, and without altering a deflection gap between the piston and the surface of the substrate.

16. The modulator of claim 13 further comprising a first reflective surface on a top surface of the faceplate, and a second reflective surface over the a top surface of the piston, and wherein electrostatic deflection of the piston brings light reflected from the first reflective surface into constructive or destructive interference with light reflected from the second reflective surface.

17. The modulator of claim 16 , wherein the second reflective surface is on a mirror supported above and separated from the piston by a central post extending from the piston to the mirror.

18. The modulator of claim 17 , wherein the central post has an annular cross-section in a plane parallel to the top surface of the piston, and comprises a first material enclosing an open cavity in a center of the central post.

19. The modulator of claim 18 , wherein the central post has an annular cross-section in a plane parallel to the top surface of the piston, and comprises a third material enclosing a fourth material.

20. The modulator of claim 13 wherein the thermal sinking structures have an overall triangular cross-section in the plane parallel to the surface of the substrate.