Vias with multiconnection via structures
Improving an initial via in a circuit comprises: obtaining layout information associated with an initial via structure in a circuit, the initial via comprising an initial lower metal enclosure and an initial upper metal enclosure connected by an initial cut; determining layout information associated with a multiconnection via structure comprising a plurality of sibling vias having at least one additional upper metal enclosure and at least one additional lower metal enclosure; updating the layout information associated with the initial via with the layout information associated with the multiconnection via structure; and outputting the updated layout information. The plurality of sibling vias are connected by a plurality of corresponding sibling cuts, and the multiconnection via structure has lower resistance than the initial via structure. In some embodiments, the multiconnection via is efficiently represented in using a master template.
1. A method, comprising:
obtaining layout information associated with an initial via in a circuit, the initial via comprising an initial lower metal enclosure and an initial upper metal enclosure connected by an initial cut;
determining layout information associated with a multiconnection via structure comprising: a plurality of sibling vias having at least one additional upper metal enclosure and at least one additional lower metal enclosure, and the initial via; wherein:
the plurality of sibling vias are connected by a plurality of corresponding sibling cuts; and
the multiconnection via structure has lower resistance than the initial via structure;
updating the layout information associated with the initial via with the layout information associated with the multiconnection via structure comprising the plurality of sibling vias and the initial via; and
outputting the updated layout information.
2. The method of claim 1 , wherein the plurality of sibling vias are electrically connected to the initial via.
3. The method of claim 1 , wherein the multiconnection via structure is represented using a master template.
4. The method of claim 1 , wherein:
the multiconnection via structure is represented using a master template; and
the master template includes configuration data that specifies how to derive the multiconnection via structure based on the initial via structure.
5. The method of claim 1 , wherein the determination of the layout information associated with the multiconnection via structure includes selecting among a plurality of pre-defined multiconnection via structures associated with the initial via.
6. The method of claim 1 , wherein the determination of the layout information associated with the multiconnection via structure includes:
specifying the at least one additional upper metal enclosure and the at least one additional lower metal enclosure at locations in proximity to the initial via; and
specifying at least one sibling via to electrically connect the at least one additional lower metal enclosure with the at least one additional upper metal enclosure.
7. The method of claim 1 , wherein the initial upper metal enclosure is placed on an initial upper track, the initial lower metal enclosure is placed on an initial lower track, an additional upper metal enclosure of the at least one upper metal enclosure is placed on a neighboring track to the initial upper track, and an additional lower metal enclosure of the at least one lower metal enclosure is placed on a neighboring track to the initial lower track.
8. The method of claim 1 , wherein wires in the circuit are specified to be 7 nm or less in width.
9. The method of claim 1 , wherein the layout information is obtained from a place-and-route system that performs placement and routing of the circuit.
10. The method of claim 1 , wherein the layout information is obtained from a placer that does not perform routing.
11. A system, comprising:
one or more processors configured to:
obtain layout information associated with an initial via in a circuit, the initial via comprising an initial lower metal enclosure and an initial upper metal enclosure connected by an initial cut;
determine layout information associated with a multiconnection via structure comprising: a plurality of sibling vias having at least one additional upper metal enclosure and at least one additional lower metal enclosure, and the initial via; wherein:
the plurality of sibling vias are connected by a plurality of corresponding sibling cuts; and
the multiconnection via structure has lower resistance than the initial via structure;
update the layout information associated with the initial via with the layout information associated with the multiconnection via structure comprising the plurality of sibling vias and the initial via; and
output the updated layout information; and
one or more memories coupled to the one or more processors and configured to provide the processors with instructions.
12. The system of claim 11 , wherein the plurality of sibling vias are electrically connected to the initial via.
13. The system of claim 11 , wherein to determine the layout information associated with the multiconnection via structure includes to select among a plurality of pre-defined multiconnection via structures associated with the initial via.
14. The system of claim 11 , wherein to determine the layout information associated with the multiconnection via structure includes to:
specify the at least one additional upper metal enclosure and the at least one additional lower metal enclosure at locations in proximity to the initial via; and
specify at least one sibling via to electrically connect the at least one additional lower metal enclosure with the at least one additional upper metal enclosure.
15. The system of claim 11 , wherein the initial upper metal enclosure is placed on an initial upper track, the initial lower metal enclosure is placed on an initial lower track, an additional upper metal enclosure of the at least one additional metal enclosure is placed on a neighboring track to the initial upper track, and an additional lower metal enclosure of the at least one additional lower metal enclosure is placed on a neighboring track to the initial lower track.
16. The system of claim 11 , wherein wires in the circuit are specified to be 7 nm or less in width.
17. The system of claim 11 , wherein the layout information is obtained from a place-and-route system that performs placement and routing of the circuit.
18. The system of claim 11 , wherein the layout information is obtained from a placer that does not perform routing.
19. A computer program product, the computer program product being embodied in a tangible computer readable storage medium and comprising computer instructions for:
obtaining layout information associated with an initial via in a circuit, the initial via comprising an initial lower metal enclosure and an initial upper metal enclosure connected by an initial cut;
determining layout information associated with a multiconnection via structure comprising: a plurality of sibling vias having at least one additional upper metal enclosure and at least one additional lower metal enclosure, and the initial via; wherein:
the plurality of sibling vias are connected by a plurality of corresponding sibling cuts; and
the multiconnection via structure has lower resistance than the initial via structure;
updating the layout information associated with the initial via with the layout information associated with the multiconnection via structure comprising the plurality of sibling vias and the initial via; and
outputting the updated layout information.