IP Library › Granted Patent US 11,662,161
Granted Patent B2
US 11,662,161 · App. 16/438,630 · Granted May 30, 2023

Heat conduction device

Inventors: Masanori Jinnoh (Kariya, JP); Aun Ota (Kariya, JP); Hisayoshi Oshima (Kariya, JP); Hidehiko Hiramatsu (Kariya, JP); Takashi Kaneko (Kariya, JP)
Assignee: DENSO CORPORATION
F28F13/00F28F13/14F28F2013/001F28F2013/006F28F2013/008
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,662,161
App. No.
16/438,630
Granted
May 30, 2023
Kind
B2
Abstract

A heat conduction device includes a heat source portion, a temperature control surface, and heat transfer portions. The heat source portion is configured to generate at least hot heat or cold heat. The temperature control surface is sectioned into a plurality of temperature control sections, and at least some of the plurality of temperature control sections are disposed away from the heat source portion. The plurality of heat transfer portions connect the heat source portion and the plurality of the temperature control sections to transfer heat between the heat source portion and the plurality of temperature control sections. The plurality of temperature control sections are separated from each other based on a distance from the heat source portion.

Claims (55)

1. A heat conduction device comprising:

a medium flow pipe through which a medium flows;

a first heat transfer sheet and a second heat transfer sheet each of which is thermally conductive and is configured to exchange heat with the medium flowing through the medium flow pipe; and

a heat insulator covering the first heat transfer sheet and the second heat transfer sheet, wherein

the first heat transfer sheet extends from a first end close to the medium flow pipe to a second end away from the medium flow pipe,

the second heat transfer sheet extends from a first end close to the medium flow pipe to a second end away from the medium flow pipe,

the first heat transfer sheet and the second heat transfer sheet are stacked with each other such that the first end of the first heat transfer sheet and the first end of the second heat transfer sheet are aligned in a first direction,

the first heat transfer sheet is longer than the second heat transfer sheet in a second direction perpendicular to the first direction and away from the medium flow pipe, and

the second end of the first heat transfer sheet and the second end of the second heat transfer sheet are aligned in the second direction to define a temperature control surface.

2. The heat conduction device according to claim 1 , wherein

thermal resistance between the medium flow pipe and the second end of each of the first heat transfer sheet and the second heat transfer sheet is uniform.

3. The heat conduction device according to claim 2 , further comprising:

a thermal resistance adjuster, comprising a block of material, configured to adjust the thermal resistance between the medium flow pipe and the second end of each of the first heat transfer sheet and the second heat transfer sheet to be uniform.

4. The heat conduction device according to claim 3 , wherein

the thermal resistance adjuster is made of metal.

5. The heat conduction device according to claim 3 , wherein

the thermal resistance adjuster has corrosion resistance.

6. The heat conduction device according to claim 5 , wherein

the thermal resistance adjuster is made of titanium.

7. The heat conduction device according to claim 3 , wherein

the thermal resistance adjuster is made of a film or a tape.

8. The heat conduction device according to claim 3 , wherein

the thermal resistance adjuster is located between the medium flow pipe and the first and second heat transfer sheets.

9. The heat conduction device according to claim 3 , wherein

each of the first heat transfer sheet and the second heat transfer sheet is separated into a plurality of parts, and

the thermal resistance adjuster is located between the plurality of parts of the first heat transfer sheet and the second heat transfer sheet.

10. The heat conduction device according to claim 3 , wherein

the thermal resistance adjuster is made of materials whose thermal conductivity is different from each other.

11. The heat conduction device according to claim 2 , wherein

at least shapes or materials of the first heat transfer sheet and the second heat transfer sheet are different from each other, and thereby thermal resistance of the first heat transfer sheet and the second heat transfer sheet is different from each other.

12. The heat conduction device according to claim 11 , wherein

the first heat transfer sheet or the second heat transfer sheet has a notch or a cut-off portion, and thereby the thermal resistance of the first heat transfer sheet is different from the thermal resistance of the second heat transfer sheet.

13. The heat conduction device according to claim 1 , wherein

the second end of the first heat transfer sheet is smaller than the second end of the second heat transfer sheet.

14. The heat conduction device according to claim 1 , wherein

the medium flow pipe is in contact with the first heat transfer sheet or the second heat transfer sheet,

a stacking member is provided between the first heat transfer sheet or the second heat transfer sheet, and

the stacking member is configured to adjust thermal resistance in the first direction.

15. The heat conduction device according to claim 14 , wherein

the stacking member connects the first heat transfer sheet and the second heat transfer sheet.

16. The heat conduction device according to claim 1 , wherein

thermal resistance of the first heat transfer sheet and the second heat transfer sheet in a direction in which the first heat transfer sheet and the second heat transfer sheet extend is higher than thermal resistance of the first heat transfer sheet and the second heat transfer sheet in another direction.

17. The heat conduction device according to claim 16 , wherein

the thermal resistance of the first heat transfer sheet and the second heat transfer sheet in the direction in which the first heat transfer sheet and the second heat transfer sheet extend is more than 100 times higher than the thermal resistance of the first heat transfer sheet and the second heat transfer sheet in the another direction.

18. The heat conduction device according to claim 17 , wherein

the first heat transfer sheet and the second heat transfer sheet are graphite sheets.

19. The heat conduction device according to claim 1 , wherein

the first heat transfer sheet and the second heat transfer sheet and the heat insulator are stacked with each other.

20. The heat conduction device according to claim 1 , wherein

the medium flowing through the medium flow pipe directly contacts the first heat transfer sheet and second heat transfer sheet.

21. The heat conduction device according to claim 1 , wherein

the first end of the first heat transfer sheet is connected to the medium flow pipe, and

the first end of the second heat transfer sheet is connected to the medium flow pipe.

22. The heat conduction device according to claim 1 , further comprising:

a thermal switch provided between the medium flow pipe and the first and second heat transfer sheets.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 12, 2019
From: JINNOH, MASANORI; OTA, AUN; OSHIMA, HISAYOSHI; HIRAMATSU, HIDEHIKO; KANEKO, TAKASHI
To: DENSO CORPORATION
Reel/Frame 049442/0889 →
Priority Claims (2)
JP JP2016-245478 · Dec 19, 2016 · national
JP JP2017-186657 · Sep 27, 2017 · national
Continuity (2)
Continuation PCTJP2017042492 · Nov 28, 2017
Related Publication 20190331437A1 · Oct 31, 2019