IP Library › Patent Application 16439341
Patent Application
App. No. 16/439,341

MICRO LIGHT-EMITTING DIODE (LED) DISPLAY AND FLUIDIC SELF-ASSEMBLY OF SAME

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Quick Facts
Patent No.
US None
App. No.
16/439,341
Abstract

Micro light-emitting diode (LED) displays and assembly apparatuses are described. In an example, method of manufacturing a micro-light emitting diode (LED) display panel includes positioning a display backplane substrate in a tank or container, the display backplane substrate having microgrooves therein. The method also includes adding a fluid to the tank or container, the fluid including a suspension of light-emitting diode (LED) pixel elements therein. The method also includes moving the fluid over the display backplane substrate. The method also includes assembling LED pixel elements from the fluid into corresponding ones of the microgrooves.

Claims (35)

1 . A method of manufacturing a micro-light emitting diode (LED) display panel, the method comprising:

positioning a carrier plate in a tank or container, the carrier plate having microgrooves therein;

adding a fluid to the tank or container, the fluid including a suspension of light-emitting diode (LED) pixel elements therein;

moving the fluid over the carrier plate;

assembling LED pixel elements from the fluid into corresponding ones of the microgrooves; and

transferring the assembled LED pixel elements from the carrier plate to a display backplane substrate.

2 . The method of claim 1 , wherein adding the fluid comprises adding a fluid having a surfactant.

3 . The method of claim 1 , wherein the microgrooves of the carrier plate are trapezoidal, and the suspension of LED pixel elements is a suspension of trapezoidal LED pixel elements.

4 . The method of claim 3 , wherein the trapezoidal microgrooves have at least a first size and a second size, and wherein the suspension of trapezoidal LED pixel elements corresponds to the first size but not the second size.

5 . The method of claim 1 , wherein the suspension of LED pixel elements is a suspension of nanowire-based LED pixel elements.

6 . The method of claim 5 , wherein the suspension of nanowire-based LED pixel elements comprises GaN nanowires or InGaN nanowires.

7 . A method of manufacturing a micro-light emitting diode (LED) display panel, the method comprising:

positioning a substrate in a tank or container, the substrate having microgrooves therein;

adding a fluid to the tank or container, the fluid including a suspension of light-emitting diode (LED) pixel elements therein;

applying an electric field to the substrate of the fluid; and

assembling LED pixel elements from the fluid into corresponding ones of the microgrooves.

8 . The method of claim 7 , wherein the substrate is a carrier plate, the method further comprising:

transferring the assembled LED pixel elements from the carrier plate to a display backplane substrate.

9 . The method of claim 7 , wherein the substrate is a display backplane substrate.

10 . The method of claim 7 , wherein adding the fluid comprises adding a fluid having a surfactant.

11 . The method of claim 7 , wherein the suspension of LED pixel elements is a suspension of nanowire-based LED pixel elements.

12 . The method of claim 11 , wherein the suspension of nanowire-based LED pixel elements comprises GaN nanowires.

13 . The method of claim 11 , wherein the suspension of nanowire-based LED pixel elements comprises InGaN nanowires.

14 . A method of manufacturing a micro-light emitting diode (LED) display panel, the method comprising:

positioning a carrier plate in a tank or container, the carrier plate having microgrooves therein;

adding a fluid to the tank or container, the fluid including a suspension of light-emitting diode (LED) pixel elements therein;

moving the fluid over the carrier plate;

applying an electric field to the carrier plate while moving the fluid over the carrier plate; and

assembling LED pixel elements from the fluid into corresponding ones of the microgrooves.

15 . The method of claim 14 , wherein adding the fluid comprises adding a fluid having a surfactant.

16 . The method of claim 14 , wherein the microgrooves of the carrier plate are trapezoidal, and the suspension of LED pixel elements is a suspension of trapezoidal LED pixel elements.

17 . The method of claim 16 , wherein the trapezoidal microgrooves have at least a first size and a second size, and wherein the suspension of trapezoidal LED pixel elements corresponds to the first size but not the second size.

18 . The method of claim 14 , wherein the suspension of LED pixel elements is a suspension of nanowire-based LED pixel elements.

19 . The method of claim 18 , wherein the suspension of nanowire-based LED pixel elements comprises GaN nanowires.

20 . The method of claim 18 , wherein the suspension of nanowire-based LED pixel elements comprises InGaN nanowires.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 7, 2022
From: INTEL CORPORATION
To: SAMSUNG ELECTRONICS CO. LTD.
Reel/Frame 058910/0602 →