IP Library › Granted Patent US 10,497,411
Granted Patent B2
US 10,497,411 · App. 16/446,129 · Granted Dec 3, 2019

Semiconductor device

Inventors: Woongrae Kim (Icheon-si, KR); Sangkwon Lee (Yongin-si, KR)
Assignee: SK hynix Inc.
G11C7/1057G06F1/325G11C5/148G11C7/062G11C7/222
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Quick Facts
Patent No.
US 10,497,411
App. No.
16/446,129
Granted
Dec 3, 2019
Kind
B2
Abstract

A semiconductor device includes a buffer control circuit suitable for generating a buffer control signal in response to a power-down mode signal and a detection pulse, a first buffer circuit suitable for generating a first internal chip select signal by buffering a chip select signal depending on a select signal which is generated in response to the buffer control signal in a power-down mode, and a detection pulse generation circuit suitable for generating the detection pulse in response to the first internal chip select signal.

Claims (16)

1. A semiconductor device comprising:

a first buffer circuit suitable for generating a first internal chip select signal by buffering a chip select signal in the case where a select signal has a first logic level;

a second buffer circuit suitable for generating a second internal chip select signal by buffering the chip select signal in the case where the select signal has a second logic level;

a detection pulse generation circuit suitable for generating a detection pulse in response to the second internal chip select signal; and

a buffer control circuit suitable for generating a buffer control signal in response to the detection pulse.

2. The semiconductor device according to claim 1 , wherein the select signal is generated by delaying the buffer control signal by a predetermined delay period.

3. The semiconductor device according to claim 1 , wherein the first buffer circuit comprises:

a current mirror suitable for supplying current to a first node and a second node; and

a charge discharger suitable for differentially discharging charges of the first node and charges of the second node depending on a logic level of the chip select signal.

4. The semiconductor device according to claim 1 , wherein the second buffer circuit comprises:

an input driver suitable for driving an input node in response to the select signal and the chip select signal; and

an output driver suitable for driving an output node through which the second internal chip select signal is outputted, in response to a signal of the input node.

5. The semiconductor device according to claim 1 , wherein the detection pulse is generated in synchronization with a predetermined edge of the second internal chip select signal.

6. The semiconductor device according to claim 1 , wherein the buffer control signal has a first logic level in the case where a power-down mode signal is enabled, and has a second logic level in the case where the detection pulse is generated.

7. The semiconductor device according to claim 1 , further comprising:

a command address buffer circuit suitable for generating an internal command address by buffering a command address in response to the buffer control signal.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 19, 2019
From: KIM, WOONGRAE; LEE, SANGKWON
To: SK HYNIX INC.
Reel/Frame 049523/0445 →
Priority Claims (1)
KR 10-2017-0038477 · Mar 27, 2017 · national
Continuity (2)
Division 15653026 · Jul 18, 2017
Related Publication 20190304518A1 · Oct 3, 2019
Cited By (1)
US 12,380,940