Gallidation assisted impurity doping
In one embodiment, a product includes a structure comprising a material of a Group-III-nitride having a dopant, where a concentration of the dopant in the structure has a concentration gradient characteristic of diffusion of the dopant inward from at least a portion of a surface of the structure in a direction substantially normal to the portion of the surface. The structure has less than 1% decomposition of the Group-III-nitride at the surface of the structure.
1. A product, comprising:
a structure comprising a material of a Group-III-nitride having a dopant,
wherein a concentration of the dopant in the structure has a concentration gradient characteristic of diffusion of the dopant inward from at least a portion of a surface of the structure in a direction substantially normal to the portion of the surface,
wherein the structure has less than 1% decomposition of the Group-III-nitride at the surface of the structure.
2. A product as recited in claim 1 , wherein the Group-III-nitride comprises a compound of a nitrogen and at least one element selected from the group consisting of: gallium, aluminum, indium, boron, and thallium.
3. A product as recited in claim 1 , wherein the structure has a vertical sidewall oriented in a z-direction substantially perpendicular to an x-y plane of deposition of the structure, wherein a concentration of the dopant extending inward from the vertical sidewall has a concentration gradient characteristic of diffusion of the dopant inward from at least a portion of a surface of the vertical sidewall in a direction substantially parallel to the x-y plane.
4. A product as recited in claim 1 , wherein the doped-Group-III-nitride has a p-type conductivity along at least the portion of the structure.
5. A product as recited in claim 1 , wherein the dopant includes magnesium.
6. A product as recited in claim 5 , wherein the structure has no damage characteristic of ion implantation.
7. A product as recited in claim 1 , comprising an ohmic contact having the structure, a layer of magnesium on the structure, and
a metal layer sandwiching the layer of magnesium between the structure and the metal layer.
8. A product as recited in claim 7 , wherein a metal of the metal layer is selected from the group consisting of: platinum, gold, nickel, palladium, and a combination thereof.
9. A product as recited in claim 1 , wherein doped-Group-III-nitride has a n-type conductivity.
10. A product as recited in claim 1 , wherein the dopant is selected from the group consisting of: silicon, germanium, tin, and carbon.
11. A product as recited in claim 1 , wherein the dopant is selected from the group of rare earth dopants consisting of: lanthanides, europium, samarium, and erbium.
12. A product as recited in claim 1 , wherein the dopant is selected from the group consisting of: manganese, chromium, iron, nickel, vanadium, cobalt, and gadolinium.
13. A method of forming the product as recited in claim 1 , the method comprising:
depositing a source layer on a surface of a substrate,
wherein the substrate comprises a Group-III-nitride material having a compound of nitrogen and at least one element selected from the group consisting of: gallium, aluminum, indium, boron, and thallium,
wherein the source layer includes the dopant;
depositing a cap layer above the source layer;
applying a thermal annealing treatment to the substrate and deposited layers for causing diffusion of at least some of the at least one element from the substrate to the cap layer, and for causing diffusion of the dopant from the source layer to a former location of the at least one element in the substrate thereby changing a conductivity and/or magnetic characteristic of the substrate; and
removing the source layer and/or cap layer.
14. A method as recited in claim 13 , wherein a material of the cap layer includes a metal selected from the group consisting of:
platinum, gold, nickel, palladium, and a combination thereof.
15. A method as recited in claim 14 , wherein the Group-III-nitride material includes gallium nitride, wherein applying the thermal annealing treatment causes a diffusion of gallium from the substrate to the cap layer, wherein the gallium forms a gallium metal compound with the metal of the cap layer.
16. A method as recited in claim 13 , wherein the dopant includes magnesium.
17. A method as recited in claim 16 , wherein applying the thermal annealing treatment causes diffusion of at least some molecules of the at least one element from the substrate to the cap layer, and causes diffusion of at least some molecules of magnesium from the source layer to the former location of some of the at least some molecules of the at least one element in the substrate.
18. A method as recited in claim 13 , wherein a material of the source layer includes a solid magnesium source selected from the group consisting of: MgF 2 , pure Mg, MgO, Mg 3 N 2 , MgCl 2 , MgH 2 , and a combination thereof.
19. A method as recited in claim 13 , wherein a temperature for the thermal annealing treatment is in a range of greater than 200 degrees Celsius to less than 1000 degrees Celsius.
20. A method as recited in claim 13 , wherein a temperature for the thermal annealing treatment is in a range of greater than 600 degrees Celsius and less than 800 degrees Celsius.
21. A method as recited in claim 13 , wherein the source layer includes an n-type dopant selected from the group consisting of:
silicon, germanium, tin, carbon, and a combination thereof.
22. A method as recited in claim 13 , wherein the source layer includes a rare earth dopant.
23. A method as recited in claim 13 , wherein a time duration of the thermal annealing treatment is less than one hour.
24. A method as recited in claim 13 , wherein a time duration of thermal treatment is less than 20 minutes.
25. A method as recited in claim 13 , wherein a material of the source layer includes a solid dopant source selected from the group consisting of: manganese, chromium, iron, nickel, vanadium, cobalt, and gadolinium, and a combination thereof.
26. A method as recited in claim 13 , wherein a material of the cap layer includes a metal having a melting point greater than 1000 degrees Celsius.
27. A method as recited in claim 13 , wherein applying the thermal annealing treatment is in an atmosphere, wherein the atmosphere includes hydrogen.
28. A method as recited in claim 27 , comprising, after the thermal annealing treatment, removing hydrogen from the substrate.
29. A method as recited in claim 13 , wherein applying the thermal annealing treatment changes the conductivity of the substrate from a n-type conductivity to a p-type conductivity.
30. A method as recited in claim 13 , wherein the source layer and/or the cap layer is removed using at least one process selected from the group consisting of: planarization, polishing, lapping, plasma etching, chemical etching, and a combination thereof.