Capacitor bank structure and semiconductor package structure
A capacitor bank structure includes a plurality of capacitors, a protection material, a first dielectric layer and a plurality of first pillars. The capacitors are disposed side by side. Each of the capacitors has a first surface and a second surface opposite to the first surface, and includes a plurality of first electrodes and a plurality of second electrodes. The first electrodes are disposed adjacent to the first surface for external connection, and the second electrodes are disposed adjacent to the second surface for external connection. The protection material covers the capacitors, sidewalls of the first electrodes and sidewalls of the second electrodes, and has a first surface corresponding to the first surface of the capacitor and a second surface corresponding to the second surface of the capacitor. The first dielectric layer is disposed on the first surface of the protection material, and defines a plurality of openings to expose the first electrodes. The first pillars are disposed in the openings of the first dielectric layer and protrude from the first dielectric layer.
1. A capacitor bank structure, comprising:
at least two capacitors physically separated from each other by a first protection material disposed therebetween, wherein each of the capacitors has a first surface and a second surface opposite to the first surface, and includes a plurality of first electrodes disposed on and protruding from the first surface thereof for external connection and a plurality of second electrodes disposed adjacent to the second surface thereof for external connection, wherein the first protection material encapsulates a lateral surface and the second surface of each of the capacitors, and includes a plurality of openings to expose the plurality of second electrodes respectively; and
a conductive pad extending into the first protection material from a level above a top surface of the first protection material to electrically connect one of the plurality of second electrodes, wherein the conductive pad is electrically connected to the one of the plurality of second electrodes through a soldering material, wherein the soldering materials are disposed in the first protection material.