Foil composite card
Composite cards formed include a security layer comprising a hologram or diffraction grating formed at, or in, the center, or core layer, of the card. The hologram may be formed by embossing a designated area of the core layer with a diffraction pattern and depositing a thin layer of metal on the embossed layer. Additional layers may be selectively and symmetrically attached to the top and bottom surfaces of the core layer. A laser may be used to remove selected portions of the metal formed on the embossed layer, at selected stages of forming the card, to impart a selected pattern or information to the holographic region. The cards may be ‘lasered’ when the cards being processed are attached to, and part of, a large sheet of material, whereby the “lasering” of all the cards on the sheet can be done at the same time and relatively inexpensively.
1. A method for making a card comprising the steps of:
stacking a plurality of plastic layers with one layer of said plurality of plastic layers including an integrated circuit (IC) containing electronic circuitry and an antenna connected to the IC for enabling contactless radio frequency (RF) communication;
forming a metallic layer overlying and attached to said plurality of plastic layers, wherein the metallic layer is formed by embossing a pattern on a plastic layer selected from said plurality of plastic layers and depositing the metallic layer on the pattern embossed on said selected plastic layer to form an embossed metallic layer; and
forming at least one window within the embossed pattern, wherein the embossed metallic layer acts as a radio frequency shield surrounding the at least one window.
2. The method as claimed in claim 1 wherein the step of forming at least one window includes lasering a selected area of the metallic layer to form said at least one window.
3. The method as claimed in claim 1 wherein the metallic layer is formed by vapor deposition to form a thin layer; and further including the step of lasering the metallic layer to personalize the card.
4. The method as claimed in claim 1 , wherein the step of forming at least one window includes applying a laser to the metallic layer for selectively ablating selected portions of the metallic layer.
5. The method as claimed in claim 1 , further comprising attaching a first clear primer layer to the embossed metallic layer and attaching a second clear primer layer to the bottom surface of the plurality of plastic layers.
6. The method as claimed in claim 5 , wherein the first clear primer layer, the embossed metallic layer, the plurality of plastic layers, and the second clear primer layer together define a central core region of the card.
7. The method as claimed in claim 5 , further comprising attaching a first buffer layer to the first clear primer layer and attaching a second buffer layer between the second clear primer layer and a carrier layer, each of said first and second buffer layers having first materials of construction.
8. The method as claimed in claim 7 , wherein the carrier layer is a plastic layer.
9. The method as claimed in claim 8 , wherein the first and second clear primer layers are protective layers for protecting the embossed metallic layer, each comprising a first adhesive and second materials of construction.
10. The method as claimed in claim 7 , further comprising attaching first and second additional plastic layers, the first additional plastic layer being attached to the first buffer layer and the second additional plastic layer being attached to the carrier layer, and printing graphic material on selected ones of said carrier layer, said plurality of plastic layers, or said first or second additional plastic layers.
11. The method as claimed in claim 1 , wherein the metallic layer is opaque.
12. A method for forming a card comprising the steps of:
forming a metal layer on and overlying a base plastic layer, wherein the metal layer is formed by embossing a pattern on the base plastic layer and depositing the metal layer on the pattern embossed on the base plastic layer to form an embossed metal layer;
attaching a first number of (clear) plastic layers, overlying the metal layer, to the metal layer;
attaching a second number of (clear) plastic layers, underlying the base plastic layer, to the base plastic layer;
said second number of plastic layers including an integrated circuit (IC) containing selected electronic circuits and an antenna connected to said IC for enabling contactless radio frequency communication with an external device; and
selectively modifying the metal layer to customize the card, the selective modifying comprising forming at least one window within the embossed pattern, wherein the embossed metal layer acts as a radio frequency shield surrounding the at least one window.
13. The method as claimed in claim 12 , wherein the metallic layer is opaque.
14. The method for forming a card as claimed in claim 12 , wherein the step of selectively modifying the metal layer includes using a laser to ablate selected portions of the metal layer.
15. The method for forming a card as claimed in claim 14 , wherein the step of attaching the first number of plastic layers includes attaching a first clear plastic buffer layer to and overlying the metal layer via a clear adhesive primer layer; and wherein the step of attaching the second number of plastic layers includes attaching a clear plastic buffer layer to and underlying the base plastic layer.