IP Library Granted Patent US 10,833,069
Granted Patent B2
US 10,833,069 · App. 16/455,665 · Granted Nov 10, 2020

Logic gate designs for 3D monolithic direct stacked VTFET

Inventors: Chen Zhang (Guilderland, NY); Tenko Yamashita (Schenectady, NY); Terence B. Hook (Jericho, VT)
Assignee: International Business Machines Corporation
H01L27/0688H01L21/2255H01L21/8221H01L21/823871H01L21/823885H01L21/84H01L23/5286H01L27/0207H01L27/092H01L27/1203H01L29/0847H01L29/1037H01L29/6656H01L29/66666H01L29/7827H03K19/0948H03K19/20H03K19/215
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Quick Facts
Patent No.
US 10,833,069
App. No.
16/455,665
Granted
Nov 10, 2020
Kind
B2
Abstract

Logic gate designs (e.g., NAND, NOR, Inverter) for stacked VTFET designs are provided. In one aspect, a logic gate device is provided. The logic gate device includes: at least one top vertical transport field-effect transistor (VTFET 1 ) sharing a fin with at least one bottom VTFET (VTFET 2 ); a power rail connected to a power contact of the logic gate device; and a ground rail, adjacent to the power rail, connected to a ground contact of the logic gate device. A method of forming a logic gate device is also provided.

Claims (25)

1. A logic gate device, comprising:

at least one top vertical transport field-effect transistor (VTFET 1 ) sharing a fin with at least one bottom VTFET (VTFET 2 );

a power rail connected to a power contact of the logic gate device; and

a ground rail, adjacent to the power rail, connected to a ground contact of the logic gate device,

wherein the VTFET 1 comprises a first top VTFET (VTFET 1 A) and a second top VTFET (VTFET 1 B), and the VTFET 2 comprises a first bottom VTFET (VTFET 2 A) and a second bottom VTFET (VTFET 2 B), wherein the VTFET 1 A and the VTFET 2 A share a first fin, and the VTFET and the VTFET 2 B share a second fin, and wherein the ground contact is connected to top source and drains of the VTFET 2 A.

2. The logic gate device of claim 1 , wherein the VTFET 1 is an n-channel FET (NFET) and the VTFET 2 is a p-channel FET (PFET).

3. The logic gate device of claim 1 , wherein the VTFET 1 is a PFET and the VTFET 2 is an NFET.

4. The logic gate device of claim 1 , wherein the VTFET 1 and the VTFET 2 each comprises a gate alongside the fin.

5. The logic gate device of claim 1 , further comprising:

an output contact connected to i) bottom source and drains of the VTFET 1 A and the VTFET 1 B, and ii) top source and drains of the VTFET 2 B.

6. A logic gate device, comprising:

at least one top vertical transport field-effect transistor (VTFET 1 ) sharing a fin with at least one bottom VTFET (VTFET 2 ), wherein the VTFET 1 is either a) an NFET if the VTFET 2 is a PFET or b) a PFET if the VTFET 2 is an NFET;

a power rail connected to a power contact of the logic gate device; and

a ground rail, adjacent to the power rail, connected to a ground contact of the logic gate device,

wherein the VTFET 1 comprises a first top VTFET (VTFET 1 A) and a second top VTFET (VTFET 1 B), and the VTFET 2 comprises a first bottom VTFET (VTFET 2 A) and a second bottom VTFET (VTFET 2 B), wherein the VTFET 1 A and the VTFET 2 A share a first fin, and the VTFET 1 B and the VTFET 2 B share a second fin, and wherein the ground contact is connected to top source and drains of the VTFET 2 A.

7. The logic gate device of claim 6 , wherein the VTFET 1 and the VTFET 2 each comprises a gate alongside the fin.

8. The logic gate device of claim 6 , further comprising:

an output contact connected to i) bottom source and drains of the VTFET 1 A and the VTFET 1 B, and ii) top source and drains of the VTFET 2 B.

9. A logic gate device, comprising:

at least one top vertical transport field-effect transistor (VTFET 1 ) sharing a fin with at least one bottom VTFET (VTFET 2 );

a power rail connected to a power contact of the logic gate device; and

a ground rail, adjacent to the power rail, connected to a ground contact of the logic gate device, wherein the VTFET 1 comprises a first top VTFET (VTFET 1 A′) and a second top VTFET (VTFET 1 B′), and the VTFET 2 comprises a first bottom VTFET (VTFET 2 A′) and a second bottom VTFET (VTFET 2 B′), wherein the VTFET 1 A′ and the VTFET 2 A′ share a first fin, and the VTFET 1 B′ and the VTFET 2 B′ share a second fin, and wherein the ground contact is connected to bottom source and drains of the VTFET 2 A′ and the VTFET 2 B′.

10. The logic gate device of claim 9 , further comprising:

an output contact connected to i) top source and drains of the VTFET 1 B′, and ii) top source and drains of the VTFET 2 A′ and the VTFET 2 B′.

11. The logic gate device of claim 9 , wherein the power contact is connected to i) bottom source and drains of the VTFET 1 A′ and the VTFET 1 B′, and ii) top source and drains of the VTFET 1 A′.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 27, 2019
From: ZHANG, CHEN; YAMASHITA, TENKO; HOOK, TERENCE B.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 049617/0446 →
Continuity (2)
Division 15879181 · Jan 24, 2018
Related Publication 20190326279A1 · Oct 24, 2019
Cited By (1)
US 12,672,318