IP Library Granted Patent US 11,252,958
Granted Patent B2
US 11,252,958 · App. 16/456,133 · Granted Feb 22, 2022

Antimicrobial solid surfaces and treatments and processes for preparing the same

Inventors: Kenneth Gauthier Trinder, II (Norfolk, VA); Vikram Kanmukhla (Henrico, VA)
Assignee: Cupron, Inc.
A01N25/10A01N59/20
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Quick Facts
Patent No.
US 11,252,958
App. No.
16/456,133
Granted
Feb 22, 2022
Kind
B2
Abstract

Provided is an antimicrobial non-isotactic polymer based hard or semi-flexible surface in a thermoset and/or thermoplastic resin matrix wherein the active antimicrobial ingredient is copper oxide. Processes for preparing the same and applications thereof are also described.

Claims (16)

1. A continuous pour process for the manufacture of a composite structural solid material comprising a thermoset resin and copper oxide particles substantially uniformly dispersed therein the process comprising the steps of:

mixing a filler with copper oxide until well blended to form a filler-copper oxide blend, wherein the filler-copper oxide blend oxide has a ratio of filler to copper oxide in the range of 20:1 to 1:2;

stepwise, subsequently mixing said filler-copper oxide blend with a thermoset resin, a copper oxide containing masterbatch, and optionally a pigment to form a copper oxide containing blended composition;

stepwise, subsequently mixing a catalyst with said copper oxide containing blended composition to form a polymerizable composite structural material;

distributing said polymerizable composite structural material in a mold; and

providing conditions for polymerization of said polymerizable composite structural material, thereby preparing a composite structural solid material wherein the copper oxide is present at a concentration ranging from 15% to 50% w/w and wherein a portion of said copper oxide particles are surface exposed.

2. The process of claim 1 , wherein said catalyst is methyl ethyl ketone.

3. The process of claim 1 , wherein said thermoset resin comprises epoxy or polyester resins.

4. The process of claim 1 , wherein said filler material makes up to between 10 and 30% by weight of the total composition.

5. The process of claim 1 , wherein said copper oxide particles have a size ranging from about 5 to about 20 microns.

6. The process of claim 1 , wherein said copper oxide particles have a size ranging from about 5 to about 10 microns.

7. The process of claim 1 , further comprising the step of preparing a finished product incorporating said composite structural solid material.

8. The process of claim 1 , further comprising the step of casting said polymeric resin mixture containing copper oxide powder and catalyst into a sheet.

9. The process of claim 1 , further comprising the step of casting said polymeric resin mixture containing copper oxide powder and catalyst using a compression molding process.

10. The process of claim 1 , further comprising the step of casting said polymeric resin mixture containing copper oxide powder and catalyst using an extrusion process.

11. The process of claim 1 , further comprising the step of casting said polymeric resin mixture containing copper oxide powder and catalyst using an injection molding process.

Assignments (8)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 28, 2025
From: KANMUKHLA, VIKRAM
To: CUPRON, INC.
Reel/Frame 071234/0392 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 28, 2025
From: TRINDER, KENNETH GAUTHIER, II
To: EOS SURFACES LLC
Reel/Frame 071234/0666 →
RELEASE OF SECURITY INTEREST Recorded Dec 28, 2022
From: SPOTSWOOD CAPITAL, LLC
To: CUPRON INC.
Reel/Frame 062225/0396 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 28, 2022
From: CUPRON INC.
To: EOS SURFACES, L.L.C.
Reel/Frame 062225/0606 →
SECURITY INTEREST Recorded Aug 9, 2022
From: CUPRON INC.
To: SPOTSWOOD CAPITAL, LLC
Reel/Frame 060757/0971 →
SECURITY INTEREST Recorded Aug 24, 2021
From: CUPRON INC.
To: SPOTSWOOD CAPITAL, LLC
Reel/Frame 057268/0301 →
SECURITY INTEREST Recorded May 19, 2020
From: CUPRON INC.
To: SPOTSWOOD CAPITAL, LLC
Reel/Frame 052696/0980 →
SECURITY INTEREST Recorded May 19, 2020
From: CUPRON INC.
To: SPOTSWOOD CAPITAL, LLC
Reel/Frame 052696/0649 →
Continuity (3)
Continuation 14420518
Provisional Application 61681158 · Aug 9, 2012
Related Publication 20200154701A1 · May 21, 2020